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STPS20L15D-STPS20L15G
15V 20A Schottky Discrete Diode in a TO-220AC package
STPS20L15D/GJuly 1999 - Ed: 2B
LOW DROP OR-ing POWER SCHOTTKY DIODE
MAIN PRODUCT CHARACTERISTICSVERY LOW FORWARD VOLTAGE DROP FOR
LESS POWER DISSIPATION AND REDUCED
HEATSINK SIZE
REVERSE VOLTAGE SUITED TO OR-ing OF 3V,
5V and 12V RAILS
FEATURES AND BENEFITSPackaged in TO-220AC or D2 PAK, this device is
especially intended for use as an OR-ing diode in
fault tolerant power supply equipments.
DESCRIPTION
ABSOLUTE RATINGS (limiting values)* : dPtot
dTj < 1
Rth(j−a) thermal runaway condition for a diode on its own heatsink
1/5
THERMAL RESISTANCESPulse test : * tp = 380 μs, δ < 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.18 x IF(AV) + 8.10-3 x IF2 (RMS)
STATIC ELECTRICAL CHARACTERISTICS2 4 6 8 1012 14161820220
PF(av)(W)
Fig. 1: Average forward power dissipation versusaverage forward current. 25 50 75 100 1250
IF(av)(A)
Fig. 2: Average forward current versus ambient
temperature ( δ = 1).
1E-3 1E-2 1E-1 1E+00
IM(A)
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values).
1.0E-4 1.0E-3 1.0E-2 1.0E-1 1.0E+00.0
Zth(j-c)/Rth(j-c)
Fig. 4: Relative variation of thermal impedance
junction to case versus pulse duration.
STPS20L15D/G2/5
02468 10 12 14 161E-1
1E+0
1E+1
1E+2
5E+2
IR(mA)
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values). 5 10 200.1
C(nF)
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values). 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
IFM(A)
Fig. 7: Forward voltage drop versus forward
current (typical values). 4 8 1216 2024283236400
Rth(j-a) (°C/W)
Fig. 9: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness : 35 μm).
(STPS20L15G only) 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.81
200
IFM(A)
Fig. 8: Forward voltage drop versus forward
current (maximum values).
STPS20L15D/G3/5
PACKAGE MECHANICAL DATA2 PAK
FOOT PRINT DIMENSIONS (in millimeters)
STPS20L15D/G4/5
. consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
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© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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PACKAGE MECHANICAL DATATO-220AC
Cooling method: by conduction (C)
Recommended torque value: 0.55 m.N
Maximum torque value: 0.7 m.N
Epoxy meets UL94,V0
STPS20L15D/G5/5
:
www.ic-phoenix.com
.
