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T1121NL , TELECOMMUNICATIONS PRODUCTS
T1122 , T1/CEPT/ISDN-PRI TRANSFORMERS Dual Surface Mount, 1500Vrms, Extended and Standard Temperature Range
T1124NL , TELECOMMUNICATIONS PRODUCTS
T1129NL , TELECOMMUNICATIONS PRODUCTS
T1133 , TRIANGULAR TYPE
T1136 , T1/CEPT/ISDN-PRI TRANSFORMERS Dual Surface Mount, 1500 Vrms, Extended and Standard Temperature Range
STPS20L15-STPS20L15G-TR
LOW DROP OR-ING POWER SCHOTTKY DIODE
STPS20L15D/GJuly 2003-Ed:3B
LOW DROP OR-ing POWER SCHOTTKY DIODE
MAIN PRODUCT CHARACTERISTICS VERY LOW FORWARD VOLTAGE DROP FOR
LESS POWER DISSIPATION AND REDUCED
HEATSINK SIZE REVERSE VOLTAGE SUITEDTO OR-ingOF3V,and 12V RAILS AVALANCHE CAPABILITY SPECIFIED
FEATURES AND BENEFITSPackagedin TO-220ACorD2 PAK, this deviceis
especially intendedfor useasan OR-ing diodein
fault tolerant power supply equipments.
DESCRIPTION
ABSOLUTE RATINGS (limiting values) dPtot
dTj Rthj a< − thermal runaway conditionfora diodeonits own heatsink
THERMAL RESISTANCES
STPS20L15D/GPulsetest:*tp=380μs,δ <2% evaluatethe maximum conduction losses usethe following equation:
P=0.18xIF(AV)+ 8.10-3xIF2 (RMS)
STATIC ELECTRICAL CHARACTERISTICS 2 4 68 1012 14161820220
PF(av)(W)
Fig.1: Average forward power dissipation versus
average forward current. 25 50 75 100 1250
IF(av)(A)
Fig.2: Average forward current versus ambient
temperature(δ=1).
1E-3 1E-2 1E-1 1E+00
250
IM(A)
Fig.5: Non repetitive surge peak forward current
versus overload duration (maximum values).
1.0E-4 1.0E-3 1.0E-2 1.0E-1 1.0E+00.0
Zth(j-c)/Rth(j-c)
Fig.6: Relative variationof thermal impedance
junctionto case versus pulse duration.
1.2 25 50 75 100 125 150
P(t) (25°C)
ARMp
ARM
Fig.4: Normalized avalanche power derating
versus junction temperature.
0.10.01 1
0.1 100 1000
P(t) (1μs)
ARMp
ARM
Fig.3: Normalized avalanche power derating
versus pulse duration.
STPS20L15D/G02468 10 12 14 161E-1
1E+0
1E+1
1E+2
5E+2
IR(mA)
Fig.7: Reverse leakage current versus reverse
voltage applied (typical values). 5 10 200.1
C(nF)
Fig.8: Junction capacitance versus reverse
voltage applied (typical values). 0.2 0.4 0.6 0.8 1 1.2 1.4 1.60.1
IFM(A)
Fig.9: Forward voltage drop versus forward
current (typical values). 4 8 1216 2024283236400
Rth(j-a) (°C/W)
Fig.11: Thermal resistance junctionto ambient
versus copper surface undertab (Epoxy printed
circuit board FR4, copper thickness:35 μm).
(STPS20L15G only) 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.81
200
IFM(A)
Fig. 10: Forward voltage drop versus forward
current (maximum values).
STPS20L15D/G
PACKAGE MECHANICAL DATA2 PAK
FOOT PRINT DIMENSIONS (in millimeters)
STPS20L15D/GInformation furnishedisbelieved tobeaccurateand reliable. However, STMicroelectronicsassumesno responsibilityforthe consequencesof
useofsuch informationnorforany infringementofpatentsor otherrightsof thirdpartieswhichmay result fromitsuse. Nolicenseis grantedby
implicationor otherwise underany patentor patent rightsof STMicroelectronics. Specifications mentionedinthis publicationare subjectto
change without notice.This publication supersedesand replacesall information previously supplied.
STMicroelectronics productsarenot authorizedforuseas critical componentsinlife support devicesor systems without express written
approval ofSTMicroelectronics.
TheST logoisa registered trademarkof STMicroelectronics 2003 STMicroelectronics- PrintedinItaly-All rights reserved.
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http://
PACKAGE MECHANICAL DATATO-220AC Cooling method:by conduction(C) Recommended torque value: 0.55 m.N Maximum torque value:0.7 m.N Epoxy meets UL94,V0
:
www.ic-phoenix.com
.
