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STPS1L20MF
Low drop power Schottky rectifier in flat package
STPS1L20MFLow drop power Schottky rectifier in flat package
Features Very low profile package: 0.85 mm Backward compatible with standard STmite
footprint Very small conduction losses Negligible switching losses Extremely fast switching Low forward voltage drop for higher efficiency
and extended battery life Low thermal resistance Avalanche capability specified
DescriptionSingle Schottky rectifier suited for switch mode
power supplies and high frequency dc to dc
converters.
Packaged in STmite flat, this device is intended
for use in low voltage, high frequency inverters,
free wheeling and polarity protection applications.
Due to the very small size of the package this
device fits battery powered equipment (cellular,
notebook, PDA’s, printers) as well as chargers
and PCMCIA cards.
Table 1. Device summary
Characteristics STPS1L20MF
1 Characteristics
To evaluate the conduction losses use the following equation:
P = 0.32 x IF(AV) + 0.05 IF2 (RMS)
Table 2. Absolute ratings (limiting values) condition to avoid thermal runaway for a diode on its own heatsink
Table 3. Thermal resistance Mounted with minimum recommended pad size, PC board FR4
Table 4. Static electrical characteristics Pulse test: = 380 µs, δ < 2%
dPtot
dTj--------------- 1
Rthja–()--------------------------<
STPS1L20MF Characteristics
Figure 1. Conduction losses versus average
current
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
Figure 3. Normalized avalanche power
derating versus pulse duration
Figure 4. Normalized avalanche power
derating versus junction
temperature
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values)
Figure 6. Relative variation of thermal
impedance junction to case versus
pulse duration
Characteristics STPS1L20MF
Figure 11. Thermal resistance junction to ambient versus copper surface under tab
(epoxy printed board FR4, copper thickness = 35 µm, typical values)
Figure 7. Reverse leakage currrent versus
reverse voltage applied
(typical values)
Figure 8. Reverse leakage currrent versus
junction temperature
(typical values)
Figure 9. Junction capacitance versus
reverse voltage applied
(typical values)
Figure 10. Forward voltage drop versus
forward current
STPS1L20MF Package information
2 Package information Epoxy meets UL94, V0 Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: .
ECOPACK® is an ST trademark.
Figure 12. STmite flat recommended footprint (all dimensions in mm)
Table 5. STmite flat dimensions
Ordering information STPS1L20MF
3 Ordering information
4 Revision history
Table 6. Ordering information
Table 7. Document revision history
