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STPS160A-STPS160U
POWER SCHOTTKY RECTIFIER
STPS160A/UJuly 1999 - Ed: 5A
POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICSVERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
LOW FORWARD VOLTAGE DROP
SURFACE MOUNTED DEVICE
FEATURES AND BENEFITSSingle chip Schottky rectifier suited for Switched
Mode Power Supplies and high frequency DC to
DC converters.
Packaged in SMA or SMB, this device is intended
for surface mounting and used in low voltage, high
frequency inverters, free wheeling and polarity pro-
tection applications.
DESCRIPTION
ABSOLUTE RATINGS (limiting values)* : dPtot
dTj < 1
Rth(j−a) thermal runaway condition for a diode on its own heatsink
1/6
THERMAL RESISTANCES
STATIC ELECTRICAL CHARACTERISTICSPulse test : * tp = 380 μs, δ < 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.49 x IF(AV) + 0.08 x IF2 (RMS)
0.0 0.2 0.4 0.6 0.8 1.0 1.20.0
PF(av)(W)
Fig. 1: Average forward power dissipation versus
average forward current. 25 50 75 100 125 1500.0
IF(av)(A)
Fig. 2: Average forward current versus ambient
temperature (δ=0.5).
STPS160A/U2/6
1E-3 1E-2 1E-1 1E+00
IM(A)
Fig. 3-1: Non repetive surge peak forward current
versus overload duration (maximum values) (SMB).
1E-3 1E-2 1E-1 1E+00
IM(A)
Fig. 3-2: Non repetive surge peak forward current
versus overload duration (maximum values) (SMA).
1E-2 1E-1 1E+0 1E+1 1E+2 1E+30.0
Zth(j-a)/Rth(j-a)
Fig. 4-1: Relative variation of thermal impedance
junction to ambient versus pulse duration (SMB).
1E-2 1E-1 1E+0 1E+1 1E+20.0
Zth(j-a)/Rth(j-a)
Fig. 4-2: Relative variation of thermal impedance
junction to ambient versus pulse duration (SMA).510152025303540455055601E-1
1E+0
1E+1
1E+2
1E+3
IR(μA)
Fig. 5: Reverse leakage current versus reversevoltage applied (typical values). 2 5 10 20 50 10010
C(pF)
Fig. 6: Junction capacitance versus reverse volt-
age applied (typical values)
STPS160A/U3/6
0.2 0.4 0.6 0.8 1 1.2 1.4 1.61E-21E-1
1E+0
1E+1
IFM(A)
Fig. 7: Forward voltage drop versus forward cur-rent (maximum values). 234 50
Rth(j-a) (°C/W)
Fig. 8-1: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board, copper thickness: 35μm)(SMB). 2 3 4 50
Rth(j-a) (°C/W)
Fig. 8-2: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board, copper thickness: 35μm)(SMA).
STPS160A/U4/6
PACKAGE MECHANICAL DATASMA
FOOT PRINT DIMENSIONS ( in millimeters)
STPS160A/U5/6
. consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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PACKAGE MECHANICAL DATASMB
FOOT PRINT DIMENSIONS ( in millimeters)Band indicates cathode
Epoxy meets UL94,V0
STPS160A/U6/6
