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STPS15L25DSTMN/a5000avaiLOW DROP POWER SCHOTTKY RECTIFER
STPS15L25DSTN/a50avaiLOW DROP POWER SCHOTTKY RECTIFER


STPS15L25D ,LOW DROP POWER SCHOTTKY RECTIFERAPPLICATIONSDESCRIPTIONSingle Schottky rectifier suited for Switched ModePower Supplies and high fr ..
STPS15L25D ,LOW DROP POWER SCHOTTKY RECTIFERFEATURESKVERY LOW FORWARD VOLTAGE DROPFOR LESS POWER DISSIPATION AND RE-DUCED HEATSINKOPTIMIZED CON ..
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STPS15L25D
LOW DROP POWER SCHOTTKY RECTIFER
STPS15L25D/G
June 1999 - Ed : 4B
LOW DROP POWER SCHOTTKY RECTIFIER
ABSOLUTE RATINGS (limiting values)

VERY LOW FORWARD VOLTAGE DROP
FOR LESS POWER DISSIPATION AND RE-
DUCED HEATSINK
OPTIMIZED CONDUCTION/REVERSE LOSSES
TRADE-OFF WHICH MEANS THE HIGHEST
EFFICIENCY IN THE APPLICATIONS
FEATURES

Single Schottky rectifier suited for Switched Mode
Power Supplies and high frequency DC to DC con-
verters (VRMS).
Packaged in TO-220AC or D2 PAK, this device is
especially intended for use as a Rectifier at the
secondary of 3.3V SMPS and DC/DC units.
DESCRIPTION
MAIN PRODUCT CHARACTERISTICS

* : dPtot
dTj < 1
Rth(j−a) thermal runaway condition for a diode on its own heatsink
1/5
THERMAL RESISTANCES
Pulse test : * tp = 380 μs, δ < 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.24 x IF(AV) + 0.0073 IF2 (RMS)
STATIC ELECTRICAL CHARACTERISTICS
2 4 6 8 10 12 14 160
PF(av)(W)
Fig.1 : Average forward power dissipation versus

average forward current. 25 50 75 100 125 1500
IF(av)(A)
Fig.2 : Average forward current versus ambient

temperature ( δ = 0.5).
STPS15L25D/G

2/5
1E-3 1E-2 1E-1 1E+00
350 IM(A)
Fig.3 : Non repetitive surge peak forward current

versus overload duration (maximum values). 5 10 15 20 251E-2
1E-1
1E+0
1E+1
1E+2
1E+3 IR(mA)
Fig.5 : Reverse leakage current versus reverse

voltage applied (typical values).
1.0E-4 1.0E-3 1.0E-2 1.0E-1 1.0E+00.0
Zth(j-c)/Rth(j-c)
Fig.4 : Relative variation of thermal impedance
junction to case versus pulse duration. 5 10 20 300.1
C(nF)
Fig.6 : Junction capacitance versus reverse
voltage applied (typical values).
IFM(A)

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.1
Fig.7 : Forward voltage drop versus forward
current (maximum values). 4 8 1216 2024283236400
Rth(j-a) (°C/W)
Fig.8 : Thermal resistance junction
to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness : 35 μm).
(STPS15L25G only)
STPS15L25D/G

3/5
PACKAGE MECHANICAL DATA2 PAK
FOOT PRINT DIMENSIONS (in millimeters)

Cooling method: by conduction (method C)
STPS15L25D/G

4/5
. consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
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PACKAGE MECHANICAL DATA

TO-220AC
Cooling method : C
Recommended torque value : 0.55 m.N
Maximum torque value : 0.70 m.N
Epoxy meets UL94,V0
STPS15L25D/G

5/5
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