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STPS0540Z-STPS0560Z
SCHOTTKY RECTIFIER
STPS0540Z / STPS0560ZJanuary 2002-Ed:2B
SCHOTTKY RECTIFIER Very small conduction losses Negligible switching losses Extremely fast switching
FEATURES AND BENEFITSSingle Schottky rectifier suited for switch mode
power supplies and high frequency DCto DC
converters.
Packagesin SOD-123, these devices are intended
for usein low voltage, high frequency inverters,
free wheeling and polarity protection applications.
Dueto the small sizeof the package these devices
fit GSM and PCMCIA requirements.
DESCRIPTION
ABSOLUTE RATINGS (limiting values) dPtot
dTj Rthj a< − thermal runaway conditionfora diodeonits own heatsink
MAIN PRODUCT CHARACTERISTICS
STPS0540Z / STPS0560ZPulse test:* tp=5ms,δ <2%tp= 380μs,δ <2% evaluate the maximum conduction losses use the following equation:
STPS0540Z:P= 0.29x IF(AV) +0.22xIF2 (RMS)
STPS0560Z:P= 0.35x IF(AV) +0.3xIF2 (RMS)
STATIC ELECTRICAL CHARACTERISTICS(*) Mountedon epoxy board.
THERMAL RESISTANCE
STPS0540Z / STPS0560Z0.0 0.1 0.2 0.3 0.4 0.5 0.60.00
PF(av)(W)
Fig. 1-1: Average forward power dissipation ver-
sus average forward current.(STPS0540Z)
0.0 0.1 0.2 0.3 0.4 0.5 0.60.00
PF(av)(W)
Fig. 1-2: Average forward power dissipation ver-
sus average forward current.(STPS0560Z) 25 50 75 100 1250.0
IF(av)(A)
Fig.2: Average forward current versus ambient
temperature(δ= 0.5).
1E-3 1E-2 1E-1 1E+00.0
IM(A)
Fig.3: Non repetitive surge peak forward current
versus overload duration (maximum values).
1E-3 1E-2 1E-1 1E+0 1E+1 1E+21E-3
1E-2
1E-1
1E+0
Zth(j-a)/Rth(j-a)
Fig.4: Relative variationof thermal impedance
junctionto ambient versus pulse duration (Epoxy
printed circuit board FR4 with recommended pad
layout). 5 10 15 20 25 30 35 401E-4
1E-3
1E-2
1E-1
1E+0
1E+1
5E+1
IR(mA)
Fig. 5-1: Reverse leakage current versus reverse
voltage applied (typical values).(STPS0540Z)
STPS0540Z / STPS0560Z 5 10 15 20 25 30 35 40 45 50 55 601E-4
1E-3
1E-2
1E-1
1E+0
1E+1
5E+1
IR(mA)
Fig. 5-2: Reverse leakage current versus reverse
voltage applied (typical values).(STPS0560Z) 25 50 75 100 1251E-1
1E+0
1E+1
1E+2
1E+3
IR[Tj] / IR[Tj=25°C]
Fig.6: Reverse leakage current versus junction
temperature (typical values). 5 10 20 40 6010
C(pF)
Fig.7: Junction capacitance versus reverse volt-
age applied (typical values).
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.11E-3
1E-2
1E-1
1E+0
5E+0
IFM(A)
Fig. 8-1: Forward voltage drop versus forward cur-
rent (maximum values).(STPS0540Z)
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.21E-3
1E-2
1E-1
1E+0
5E+0
IFM(A)
Fig. 8-2: Forward voltage drop versus forward cur-
rent (maximum values).(STPS0560Z) 20406080 100100
Rth(j-a) (°C/W)
Fig.9: Variationof thermal resistance junctionto
ambient versus copper surface under each lead
(Printed circuit board FR4, e(Cu)= 35μm).
STPS0540Z / STPS0560ZInformation furnishedis believedtobe accurateand reliable. However, STMicroelectronics assumesno responsibilityforthe consequences useofsuch informationnorforany infringementofpatentsor otherrightsofthirdpartieswhich may result fromitsuse. Nolicenseis granted implicationor otherwise under anypatent orpatent rightsof STMicroelectronics.Specifications mentioned inthis publicationare subjectto
changewithout notice. This publication supersedesand replaces allinformationpreviously supplied.
STMicroelectronics productsare notauthorizedforuseas critical componentsinlife support devicesor systems without express writtenap-
proval ofSTMicroelectronics.
TheST logoisa registered trademarkof STMicroelectronics 2002 STMicroelectronics- Printedin Italy-All rights reserved.
STMicroelectronics GROUPOF COMPANIES
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http://
PACKAGE MECHANICAL DATASOD-123 Epoxy meets UL94, V0. Band indicates cathode.
MARKING
FOOTPRINT (in millimeters)
:
www.ic-phoenix.com
.
