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STM915-16
RF POWER MODULE GSM MOBILE APPLICATIONS
STM915-16RF POWER MODULE
GSM MOBILE APPLICATIONS LINEAR POWER AMPLIFIER 890-915 MHz 12.5 VOLTS INPUT/OUTPUT 50 OHMS POUT = 16 W MIN. GAIN = 42 dB MIN.
DESCRIPTION The STM915-16 is a linear power module
designed for 12.5 V applications in GSM Cellular
Radio Systems. The STM915-16 uses gold
metallized transistors with diffused emitter ballast
resistors for high linearity Class AB operation.
June 1999
ABSOLUTE MAXIMUM RATINGS (Tcase = 25 oC)
Note1: Pulse Width = 577 μsec.
Repetition rate = 4.6 msec.
1/7
ELECTRICAL SPECIFICATIONS (Tcase = 25°C, VS1, VS3 = 8.0 Vdc; VS2, VS4 = 12.5 Vdc)Notes: 1) PIN = 1.0mW adjust VCONTROL for specified POUT. 3) POUT (Reference) = 42 dBm
2) Pulse Width = 577 μsec. 4)Tr measured at 1% to 81% of POUT in watts
Repetition rate = 4.6 msec.
GSM SPECIFIC TESTSREF. 1014655E
STM915-162/7
MODULE DC AND TEST FIXTURE CONFIGURATION
STM915-163/7
Output Power vs Frequency
Control Voltage vs Case Temperature
Output Power vs Control Voltage
Control Voltage, Efficiency & Input VSWR vs
Frequency
Output Power vs Case Temperature
TYPICAL PERFORMANCE
STM915-164/7
APPLICATIONS RECOMMENDATIONS
OPERATION LIMITSThe STM915-16 power module should never be
operated under any condition which exceeds
the Absolute Maximum Ratings presented on
this data sheet. Nor should the module be
operated continuously at any of the specified
maximum ratings. If the module is to be
operated under any condition such that it may
be subjected to one or more of the maximum
rating conditions, care must be taken to monitor
other parameters which may be affected. For
example, a combination of high VS3 and input
overdrive could result in exceeding the
maximum output power rating; in this condition,
the output power must be maintained below the
maximum rating by use of the gain control pin.
GAIN CONTROLThe module output power should be limited to
20 watts (43 dBm). The module is designed to
be operated with VS1 and VS3 set to 8.0 Vdc,
VS2 and VS4 set to 12.5 Vdc and input power
set to 1.0 mW (0 dBm). Module gain is adjusted
by varying VCONTROL.
DECOUPLINGThe bypassing internal to the module is
sufficient for the frequency range 90-1300 MHz.
Care should be taken to insure proper
decoupling for each application as the module
is capable of a wide range of operating
characteristics including "linear" operation, in
which an important design criteria is the use of
appropriate bypassing. For bypassing low
frequencies while maintaining the electrical
specifications contained in this data sheet, use
of the decoupling network shown in the "Module
DC and Test Fixture Configuration" diagram
herein is recommended.
MODULE MOUNTINGTo insure adequate thermal transfer from the
module to the heatsink, it is recommended that
a satisfactory thermal compound such as Dow
Corning 340, Wakefield 120-2 or equivalent be
applied between the module flange and the
heatsink.
The heatsink mounting surface under the module
should be flat to within ± 0.05 mm (± 0.002 inch).
The module should be mounted to the heatsink
using 3 mm (or 4-40) or equivalent screws
torqued to 5-6 kg-cm (4-6 in-lb).
The module leads are attached to the equipment
PC board using 180°C solder applied to the leads
with it properly grounded soldering iron trip, not to
exceed 195°C, applied a minimum of 2 mm
(0.080 inch) from the body of the module for a
duration not to exceed 15 seconds per lead. It is
imperative that no other portion of the module,
other than the leads, be subjected to
temperatures in excess of 100°C (maximum
storage temperature), for any period of time, as
the plastic moulded cover, internal components
and sealing adhesives may be adversely affected
by such conditions.
Due to the construction techniques and the
materials used within the module, reflow
soldering of the flange heatsink or leads, is not
recommended.
THERMAL CONSIDERATIONSIt will be necessary to provide a suitable heatsink
in order to maintain the module flange
temperature at or below the maximum case
operating temperature. In a case where the
module output power will be limited to +42 dBm
(16 W) and designing for the worst case
efficiency of 35%, the power dissipated by the
module will be 29.7 watts. The heatsink must be
designed such that the thermal rise will be less
than the difference between the maximum
ambient temperature at which the module will
operate and the maximum operating case
temperature of the module while dissipating 29.7
watts.
STM915-165/7
STM915-166/7
