STG3699BVTR ,Low voltage 0.5 惟 max, quad SPDT switch with break-before-make featureFeatures■ High speed: –t = 1.5 ns (typ.) at V = 3.0 VPD CC–t = 1.5 ns (typ.) at V = 2.3 VPD CC■ Ult ..
STG3699BVTR ,Low voltage 0.5 惟 max, quad SPDT switch with break-before-make featurefeatures are fast switching speed, break-before-make delay Description time and ultra low power con ..
STG3699BVTR ,Low voltage 0.5 惟 max, quad SPDT switch with break-before-make featureapplications.Table 1. Device summaryOrder code Temperature range Package PackagingSTG3699BVTR –40 t ..
STG3699QTR ,LOW VOLTAGE 0.5 OHM MAX QUAD SPD SWITCH WITH BREAK BEFORE MAKE FEATUREapplications.discharge, giving them ESD immunity andIt offers very low ON-Resistance (<0.5Ω )attran ..
STG3856QTR ,Low voltage 1.0惟 max dual SP3T switch with break-before-make featurefeatures are fast switching speed, and ultra low power consumption. All inputs and outputs are equi ..
STG4159BJR ,Low Voltage 0.3 Ohm Max Single SPDT Switch with Break-Before-Make Feature and 10kV Contact ESD ProtectionFeatures■ Wide operating voltage range: V (opr.) = 1.65 to 4.8 V CC■ Low power dissipation: I = 0.2 ..
SUP90P06-09L ,MOSFETsS-41203—Rev. A, 21-Jun-043C − Capacitance (pF) g− Transconductance (S) I− Drain Current (A)fs DV ..
SUP90P06-09L ,MOSFETsS-41203—Rev. A, 21-Jun-042SUP90P06-09LNew ProductVishay SiliconixTYPICAL CHARACTERISTICS (25C UNLE ..
SUP90P06-09L ,MOSFETsS-41203—Rev. A, 21-Jun-041SUP90P06-09LNew ProductVishay SiliconixSPECIFICATIONS (T = 25C UNLESS OT ..
SUP-E3G-E , NOISE FILTER
SUP-F10H-ER , NOISE FILTER
SUP-J10G-E1-0 , NOISE FILTER
STG3699BVTR
Low voltage 0.5 惟 max, quad SPDT switch with break-before-make feature
September 2007 Rev 6 1/18
STG3699BLow voltage 0.5 Ω max, quad SPDT switch
with break-before-make feature
Features High speed:
–tPD= 1.5 ns (typ.) at VCC = 3.0V
–tPD= 1.5 ns (typ.) at VCC = 2.3V Ultra low power dissipation:
–ICC =0.2 μA (max.) at TA =85°C Low ON resistance VIN =0V:
–RON =0.50 Ω (max. TA = 25°C)at
VCC =4.3V
–RON =0.55 Ω (max. TA = 25°C)at
VCC =3.0V
–RON =0.55 Ω (max. TA = 25°C)at
VCC =2.7V Wide operating voltage range:
–VCC (OPR) = 1.65 to 4.3 V single supply 4.3 V tolerant and 1.8 V compatible thresholds
on digital control input at VCC= 2.3 to 3.0V Latch-up performance exceed 300 mA
(JESD 17) ESD performance (analog chan. vs. GND):
HBM>2 kV (MIL STD 883 method 3015)
DescriptionThe STG3699B is a high-speed CMOS low
voltage quad analog SPDT (single-pole double-
throw) switch or 2:1 multiplexer/demultiplexer
switch fabricated using silicon gate C2 MOS
technology. Designed to operate from 1.65 to
4.3 V, this device is ideal for portable applications.
It offers very low ON resistance (RON <0.5 Ω) at
VCC= 3.0 V. The nIN inputs are provided to
control the independent channel switches nS1
and nS2. The switches nS1 are ON (connected to
common ports Dn) when the nIN input is held high
and OFF (state of high impedance exists between
the two ports) when nIN is held low. The switches
nS2 are ON (connected to common ports Dn)
when the nIN input is held low and OFF (state of
high impedance exists between the two ports)
when IN is held high. Additional key features are
fast switching speed, break-before-make delay
time and ultra low power consumption. All inputs
and outputs are equipped with protection circuits
against static discharge, giving them ESD and
excess transient voltage immunity.
The STG3699B is available in the commercial
temperature range of -40to125°C in a QFN16L,
2.6x 1.8 mm package.
Table 1. Device summary
Contents STG3699B2/18
Contents Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31.1 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Typical application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
STG3699B Summary description
3/18
1 Summary description
1.1 Pin connection
Figure 1. Connections diagram (top through view)
Table 2. Pin description
Summary description STG3699B
4/18
Figure 2. Input equivalent circuit
Table 3. Truth table
STG3699B Maximum rating
5/18
2 Maximum rating
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 4. Absolute maximum ratings Derate above 70°C: by 18.5mW/°C.
Table 5. Recommended operating conditions
DC and AC parameters STG3699B
6/18 DC and AC parameters
Table 6. DC specification
STG3699B DC and AC parameters
7/18 ΔRON =RON(Max) –RON(Min) Flatness is defined as the difference between the maximum and minimum value of ON resistance as measured over the
specified analog signal ranges.
Table 6. DC specification (continued)
Table 7. AC electrical characteristics (CL =35pF, RL =50Ω, tr =tf ≤5ns)
DC and AC parameters STG3699B
8/18
Table 8. Analog switch characteristics (CL = 5pF , RL =50Ω, TA =25°C) Off-isolation = 20 log10 (VD/VS), VD = output, VS = input to off switch
Table 7. AC electrical characteristics (CL =35pF, RL =50Ω, tr =tf ≤5 ns) (continued)
STG3699B Typical application
9/18
4 Typical application
Figure 3. ON resistance Figure 4. Bandwidth
Figure 5. OFF leakage Figure 6. Channel-to-channel crosstalk