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SSS1N50BFAIRCHILN/a1000avai520V N-Channel MOSFET


SSS1N50B ,520V N-Channel MOSFETFeaturesThese N-Channel enhancement mode power field effect • 1.5A, 520V, R = 5.3Ω @V = 10 VDS(on) ..
SSS1N60B ,600V N-Channel MOSFETFeaturesThese N-Channel enhancement mode power field effect • 1.0A, 600V, R = 12Ω @V = 10 VDS(on) G ..
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SSS1N50B
520V N-Channel MOSFET
SSP1N50B SSP1N50B 520V N-Channel MOSFET General Description Features These N-Channel enhancement mode power field effect • 1.5A, 520V, R = 5.3Ω @V = 10 V DS(on) GS transistors are produced using Fairchild’s proprietary, • Low gate charge ( typical 8.3 nC) planar, DMOS technology. • Low Crss ( typical 5.5 pF) This advanced technology has been especially tailored to • Fast switching minimize on-state resistance, provide superior switching • 100% avalanche tested performance, and withstand high energy pulse in the • Improved dv/dt capability avalanche and commutation mode. These devices are well suited for high efficiency switch mode power supplies, power factor correction and electronic lamp ballasts based on half bridge. D !!!!!!!! ● ● ● ● ● ● ● ● ◀ ◀ ◀ ◀ ◀ ◀ ◀ ◀ ▲ ▲ ▲ ▲ ▲ ▲ ▲ ▲ ● ● ● ● ● ● ● ● G!!!!!!!! ● ● ● ● ● ● ● ● TO-220 G D S SSP Series !!!! !!!! S Absolute Maximum Ratings T = 25°C unless otherwise noted C Symbol Parameter SSP1N50B Units V Drain-Source Voltage 520 V DSS I - Continuous (T = 25°C) Drain Current 1.5 A D C - Continuous (T = 100°C) 0.97 A C I (Note 1) Drain Current - Pulsed 5.0 A DM V Gate-Source Voltage ± 30 V GSS E (Note 2) Single Pulsed Avalanche Energy 100 mJ AS I Avalanche Current (Note 1) 1.5 A AR E (Note 1) Repetitive Avalanche Energy 3.6 mJ AR dv/dt Peak Diode Recovery dv/dt (Note 3) 3.5 V/ns P Power Dissipation (T = 25°C) 36 W D C - Derate above 25°C 0.29 W/°C T , T Operating and Storage Temperature Range -55 to +150 °C J STG Maximum lead temperature for soldering purposes, T 300 °C L 1/8" from case for 5 seconds Thermal Characteristics Symbol Parameter Typ Max Units R Thermal Resistance, Junction-to-Case -- 3.44 °C/W θJC R Thermal Resistance, Case-to-Sink 0.5 -- °C/W θCS R Thermal Resistance, Junction-to-Ambient -- 62.5 °C/W θJA ©2002 Rev. B, May 2002
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