SN75976A2DL ,9-Channel Differential TransceiverSN75976A, SN55976A9-CHANNEL DIFFERENTIAL TRANSCEIVERSLLS218B – MAY 1995 – REVISED MAY 1997SN75976A ..
SN75976A2DLR ,9-Channel Differential TransceiverSN75976A, SN55976A9-CHANNEL DIFFERENTIAL TRANSCEIVERSLLS218B – MAY 1995 – REVISED MAY 1997SN75976A ..
SN75976A2DLRG4 , 9-CHANNEL DIFFERENTIAL TRANSCEIVER
SN75ALS057 ,Trapezoidal-Waveform Interface Bus Transceiver SN75ALS056, SN75ALS057 TRAPEZOIDAL-WAVEFORM INTERFACE BUS TRANSCEIVERS SLLS028G – AUGUST 1987 – RE ..
SN75ALS057DWR ,Trapezoidal-Waveform Interface Bus Transceiver SN75ALS056, SN75ALS057 TRAPEZOIDAL-WAVEFORM INTERFACE BUS TRANSCEIVERS SLLS028G – AUGUST 1987 – RE ..
SN75ALS057N ,Trapezoidal-Waveform Interface Bus Transceiver SN75ALS056, SN75ALS057 TRAPEZOIDAL-WAVEFORM INTERFACE BUS TRANSCEIVERS SLLS028G – AUGUST 1987 – RE ..
SPI07N60C3 ,for lowest Conduction Losses & fastest SwitchingCharacteristicsParameter Symbol Values Unitmin. typ. max.R - - 1.5 K/WThermal resistance, junction ..
SPI08N50C3 ,for lowest Conduction Losses & fastest SwitchingCharacteristics, at T =25°C unless otherwise specifiedjParameter Symbol Conditions Values Unitmin. ..
SPI08N80C3 ,for lowest Conduction Losses & fastest SwitchingPlease note: Infineon has changed the CoolMOS 800V C2 marking to C3. 800V C2 ...FeatureR 0.65 ΩDS(on)• New revolutionary high voltage technologyI 8 AD• Ultra low gate chargeP-TO22 ..
SPI11N60C3 ,for lowest Conduction Losses & fastest SwitchingCharacteristicsParameter Symbol Conditions Values Unitmin. typ. max.Transconductance g V ≥2*I *R , ..
SPI11N60S5 ,for lowest Conduction LossesFeatureR 0.38 ΩDS(on)• New revolutionary high voltage technologyI 11 AD• Ultra low gate chargeP-TO2 ..
SPI11N65C3 ,for lowest Conduction Losses & fastest SwitchingCharacteristicsParameter Symbol Values Unitmin. typ. max.R - - 1 K/WThermal resistance, junction - ..
SN75976A1DGG-SN75976A1DGGR-SN75976A1DL-SN75976A1DLR-SN75976A1DLRG4-SN75976A2DGG-SN75976A2DGGR-SN75976A2DL-SN75976A2DLR
9-Channel Differential Transceiver
Control Paths of the Small Computer
Systems Interface (SCSI) and Intelligent
Peripheral Interface (IPI) SN75976A Packaged in Shrink
Small-Outline Package with 25-Mil Terminal
Pitch (DL) and Thin Shrink Small-Outline
Package with 20-Mil Terminal Pitch (DGG) SN55976A Packaged in a 56-Pin Ceramic
Flat Pack (WD) Two Skew Limits Available ESD Protection on Bus Terminals
Exceeds 12 kV Low Disabled Supply Current 8 mA Typ Thermal Shutdown Protection Positive- and Negative-Current Limiting Power-Up/Down Glitch Protection
descriptionThe SN75976A is an improved replacement for
the industry’s first 9-channel RS-485
transceiver — the SN75LBC976. The A version
offers improved switching performance, a smaller
package, and higher ESD protection. The
SN75976A is offered in two versions. The ’976A2
skew limits of 4 ns for the differential drivers and
5 ns for the differential receivers complies with the
recommended skew budget of the Fast-20 SCSI
standard for data transfer rates up to 20 million
transfers per second. The ’976A1 supports the
Fast SCSI skew budget for 10 million
transfers per second. The skew limit ensures that the propagation delay times, not only from channel-to-channel
but from device-to-device, are closely matched for the tight skew budgets associated with high-speed parallel
data buses.
The patented thermal enhancements made to the 56-pin shrink small-outline package (SSOP) of the SN75976
have been applied to the new, thin shrink, small-outline package (TSSOP). The TSSOP package offers even
less board area requirements than the SSOP while reducing the package height to 1 mm. This provides more
board area and allows component mounting to both sides of the printed circuit boards for low-profile,
space-restricted applications such as small form-factor hard disk drives.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Terminals 13 through 17 and 40 through 44 are
connected together to the package lead frame
and signal ground.
BSR
CRE
1DE/RE
2DE/RE
3DE/RE
4DE/RECC
GND
GND
GND
GND
GNDCC
5DE/RE
6DE/RE
7DE/RE
8DE/RE
9DE/RE
CDE1
CDE0
9B+
9B–
8B+
8B–
7B+
7B–
6B+
6B–CC
GND
GND
GND
GND
GNDCC
5B+
5B–
4B+
4B–
3B+
3B–
2B+
2B–
1B+
1B–
