SL3S1002FTB1 ,SL3ICS1002/1202 UCODE G2XM and G2XLapplications where operating distances of several meters and high anti-collision rates are required ..
SL3S1002FTB1,115 , UCODE G2XM and G2XL
SL3S1002FTT ,SL3ICS1002/1202 UCODE G2XM and G2XLfeatures 512-bit user memory (G2XM only) 240-bit of EPC memory 64-bit tag identifier (TID) inclu ..
SL4053B , Analog Multiplexer Demultiplexer
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SMCJ22CA-TR ,TRANSILFEATURESPEAK PULSE POWER : 1500 W (10/1000μs)STAND OFF VOLTAGE RANGE :From 5V to 188V.UNI AND BIDI ..
SMCJ24A ,Zener TVSs
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SMCJ24A-13-F , 1500W SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR
SL3S1002FTB1-SL3S1002FTT
SL3ICS1002/1202 UCODE G2XM and G2XL
1. General descriptionThe UHF EPCglobal Generation 2 standard allows the commercialized provision of mass
adoption of UHF RFID technology for passive smart tags and labels. Main fields of
applications are supply chain management and logistics for worldwide use with special
consideration of European, US and Chinese frequencies to ensure that operating
distances of several meters can be realized.
The G2X is a dedicated chip for passive, intelligent tags and labels supporting the
EPCglobal Class 1 Generation 2 UHF RFID standard. It is especially suited for
applications where operating distances of several meters and high anti-collision rates are
required.
The G2X is a product out of the NXP Semiconductors UCODE product family. The entire
UCODE product family offers anti-collision and collision arbitration functionality. This
allows a reader to simultaneously operate multiple labels / tags within its antenna field. UCODE G2X based label/ tag requires no external power supply.
Its contact-less interface generates the power supply via the antenna circuit by
propagative energy transmission from the interrogator (reader), while the system clock is
generated by an on-chip oscillator. Data transmitted from interrogator to label/tag is
demodulated by the interface, and it also modulates the interrogator’s electromagnetic
field for data transmission from label/tag to interrogator. A label/tag can be operated
without the need for line of sight or battery, as long as it is connected to a dedicated
antenna for the targeted frequency range. When the label/tag is within the interrogator’s
operating range, the high-speed wireless interface allows data transmission in both
directions.
In addition to the EPC specifications the G2X offers an integrated EAS (Electronic Article
Surveillance) feature and read protection of the memory content. On top of the
specification of the G2XL the G2XM offers 512-bit of user memory.
SL3ICS1002/1202
UCODE G2XM and G2XL
Rev. 3.8 — 11 November 2013
Product data sheet
COMPANY PUBLIC
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
2. Features and benefits
2.1 Key features 512-bit user memory (G2XM only) 240-bit of EPC memory 64-bit tag identifier (TID) including 32-bit unique serial number Memory read protection EAS (Electronic Article Surveillance) command Calibrate command 32-bit kill password to permanently disable the tag 32-bit access password to allow a transition into the secured transmission state Broad international operating frequency: from 840 MHz to 960 MHz Long read/write ranges due to extremely low power design Reliable operation of multiple tags due to advanced anti-collision Forward link: 40-160 kbit/s Return link: 40-640 kbit/s
2.2 Key benefits High sensitivity provides long read range Low Q-factor for consistent performance on different materials Improved interference suppression for reliable operation in multi-reader environment Large input capacitance for ease of assembly and high assembly yield Highly advanced anti-collision resulting in highest identification speed Reliable and robust RFID technology suitable for dense reader and noisy
environments
2.3 Custom commands EAS Alarm
Enables the UHF RFID tag to be used as EAS tag without the need for a backend data
base. Read Protect
Protects all memory content including CRC16 from unauthorized reading. Calibrate
Activates permanent back-scatter in order to evaluate the tag-to-reader performance.
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
3. Applications Supply chain management Item level tagging Asset management Container identification Pallet and case tracking Product authentication
Outside above mentioned applications, please contact NXP Semiconductors for support.
4. Ordering information
Table 1. Ordering information G2XMSL3ICS1002FUG/V7AF Wafer Bumped die on sawn wafer -
SL3S1002FTB1 XSON3 plastic extremely thin small outline package;3 terminals;
body 1 x 1.45 x 0,5 mm
SOT1122
Table 2. Ordering information G2XLSL3ICS1202FUG/V7AF Wafer Bumped die on sawn wafer -
SL3S1202FTB1 XSON3 plastic extremely thin small outline
package;3 terminals; body 1 x 1.45 x 0,5 mm
SOT1122
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
5. Block diagramThe SL3ICS1002/1202 IC consists of three major blocks:
- Analog RF Interface
- Digital Controller
- EEPROM
The analog part provides stable supply voltage and demodulates data received from the
reader for being processed by the digital part. Further, the modulation transistor of the
analog part transmits data back to the reader.
The digital section includes the state machines, processes the protocol and handles
communication with the EEPROM, which contains the EPC and the user data.
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
6. Wafer layout and pinning information
6.1 Wafer layoutNXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
7. Package outlineNXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
Table 3. Pin description of SOT1122RFP 1 Ungrouded antenna connector
RFN 2 Grounded antenna connector
n.c. 3 not connected
Table 4. SOT1122 MarkingSL3S1202FTB1 UL UCODE G2XL
SL3S1002FTB1 UM UCODE G2XM
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
8. Mechanical specification
8.1 Wafer specificationSee Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BL-ID document number: 1093**”.
8.1.1 Wafer Designation: each wafer is scribed with batch number and
wafer number
Diameter: 200 mm (8”)
Thickness: 150 m ± 15 m
Number of pads 4
Pad location: non diagonal/ placed in chip corners
Distance pad to pad RFN-RFP 333.0 µm
Distance pad to pad TP1-RFN: 351.0 µm
Process: CMOS 0.14 µm
Batch size: 25 wafers
Dies per wafer: 120.000
8.1.2 Wafer backside Material: Si
Treatment: ground and stress release
Roughness: Ra max. 0.5 m, Rt max. 5 m
8.1.3 Chip dimensions Die size without scribe: 0.414 mm x 0.432 mm = 0.178 mm2
Scribe line width:
x-dimension:56.4 m (width is measured on top metal layer)
y-dimension: 56.4 m (width is measured on top metal layer)
8.1.4 Passivation on front Type Sandwich structure
Material: PE-Nitride (on top)
Thickness: 1.75 m total thickness of passivation
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
8.1.5 Au bump Bump material: > 99.9% pure Au
Bump hardness: 35 – 80 HV 0.005
Bump shear strength: > 70 MPa
Bump height: 18 m
Bump height uniformity:
within a die: ± 2 m
within a wafer: ± 3 m
wafer to wafer: ± 4 m
Bump flatness: ± 1.5 m
Bump size:
RFP, RFN 60 x 60 m
TP1, TP2 60 x 60 m
Bump size variation: ± 5 m
Under bump metallization: sputtered TiW
8.1.6 Fail die identification No inkdots are applied to the wafer.
Electronic wafer mapping (SECS II format) covers the electrical test results and
additionally the results of mechanical/visual inspection.
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BL-ID document number: 1093**”
8.1.7 Map file distributionSee Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BL-ID document number: 1093**”
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
9. Limiting values[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any conditions other
than those described in the Operating Conditions and Electrical Characteristics section of this specification
is not implied.
[2] This product includes circuitry specifically designed for the protection of its internal devices from the
damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be
taken to avoid applying greater than the rated maxima.
[3] For ESD measurement, the die chip has been mounted into a CDIP20 package.
Table 5. Limiting values [1][2]In accordance with the Absolute Maximum Rating System (IEC 60134)
Voltages are referenced to RFN
DieTstg storage temperature range -55 +125 C
Toper operating temperature -40 +85 C
VESD electrostatic discharge voltage Human body model [3] - 2kV
SOT1122Tstg storage temperature range -55 +125 C
Ptot total power dissipation - 30 mW
Toper operating temperature -40 +85 C
VESD electrostatic discharge voltage Human body model - 2kV
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
10. Characteristics
10.1 Wafer characteristics[1] Power to process a Query command
[2] Measured with a 50 source impedance
[3] At minimum operating power
[4] Values measured for a 40 kHz phase reserval command under matched conditions
10.2 Package characteristics[1] Measured with network analyzer at 915 MHz; values at 0.5 dBm after peakmax of on-set of die, measured in the center of the pads.
Table 6. Wafer characteristics
Memory characteristicstRET EEPROM data retention Tamb 55 C50 - - year
NWE EEPROM write endurance Tamb 55 C 100000- - cycle
Interface characteristicsPtot total power dissipation - 30 mW
foper operating frequency 840 - 960 MHz
Pmin minimum operating power supply [1][2] --15 - dBm input capacitance (parallel) [3] - 0.88 - pF quality factor (Im (Zchip) / Re (Zchip)) [3] -9 - - impedance (915 MHz) - 22 - j195 - modulated jammer suppression 1.0 MHz [4] -- 4 - dB unmodulated jammer suppression 1.0 MHz [4] -- 4 - dB
Table 7. Package interface characteristics
Interface characteristics SOT1122 input capacitance (parallel) [1] - 1.02 - pF SOT1122 impedance (915 MHz) - 18.6 - j171.2 -
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
11. Packing information
11.1 WaferSee Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BL-ID document number: 1093**”.
11.2 SOT1122 Part orientation T1. For details please refer to
http://www.standardics.nxp.com/packaging/packing/pdf/sot886.t1.t4.pdf.
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
12. Functional description
12.1 Power transferThe interrogator provides an RF field that powers the tag, equipped with a UCODE G2X.
The antenna transforms the impedance of free space to the chip input impedance in order
to get the maximum possible power for the G2X on the tag.
The RF field, which is oscillating on the operating frequency provided by the interrogator,
is rectified to provide a smoothed DC voltage to the analog and digital modules of the IC.
The antenna that is attached to the chip may use a DC connection between the two
antenna pads. Therefore the G2X also enables loop antenna design. Possible examples
of supported antenna structures can be found in the reference antenna design guide.
12.2 Data transfer
12.2.1 Reader to G2X LinkAn interrogator transmits information to the UCODE G2X by modulating an RF signal in
the 840 MHz - 960 MHz frequency range. The G2X receives both information and
operating energy from this RF signal. Tags are passive, meaning that they receive all of
their operating energy from the interrogator's RF waveform.
An interrogator is using a fixed modulation and data rate for the duration of at least an
inventory round. It communicates to the G2X by modulating an RF carrier using
DSB-ASK, SSB-ASK or PR-ASK with PIE encoding.
For further details refer to Section 17, Ref. 1, section 6.3.1.2. Interrogator-to-tag (R=>T)
communications.
12.2.2 G2X to reader LinkAn interrogator receives information from the UCODE G2X by transmitting a
continuous-wave RF signal to the tag; the G2X responds by modulating the reflection
coefficient of its antenna, thereby generating modulated sidebands used to backscatter an
information signal to the interrogator. The system is a reader talks first (RTF) system,
meaning that a G2X modulates its antenna reflection coefficient with an information signal
only after being directed by the interrogator.
G2X backscatter is a combination of ASK and PSK modulation depending on the tuning
and bias point. The backscattered data is either modulated with FM0 baseband or Miller
sub carrier.
For further details refer to Section 17, Ref. 1, section 6.3.1.3. tag-to-interrogator (T=>R)
communications.
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
12.3 Operating distances
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
12.4 Air interface standardsThe G2X is certified according EPCglobal 1.0.9 and fully supports all parts of the
"Specification for RFID Air Interface EPCglobal, EPCTM Radio-Frequency Identity
Protocols, Class-1 Generation-2 UHF RFID, Protocol for Communications at 860 MHz -
960 MHz, Version 1.1.0".
EPCglobal compliance and interoperability certification
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
13. Physical layer and signaling
13.1 Reader to G2X communication
13.1.1 Physical layerFor interrogator-to-G2X link modulation refer to Section 17, Ref. 1, annex H.1 Baseband
waveforms, modulated RF, and detected waveforms.
13.1.2 ModulationAn interrogator sends information to one or more G2X by modulating an RF carrier using
double-sideband amplitude shift keying (DSB-ASK), single-sideband amplitude shift
keying (SSB-ASK) or phase-reversal amplitude shift keying (PR-ASK) using a
pulse-interval encoding (PIE) format. The G2X receives the operating energy from this
same modulated RF carrier.
Section 17, Ref. 1: Annex H, as well as chapter 6.3.1.2.2.
The G2X is capable of demodulating all three modulation types.
13.1.3 Data encodingThe R=>T link is using PIE. For the definition of the therefore relevant reference time
interval for interrogator-to-chip signaling (Tari) refer to Section 17, Ref. 1, chapter
6.3.1.2.3. The T ari is specified as the duration of a data-0.
13.1.4 Data ratesInterrogators shall communicate using Tari values between 6.25 s and 25 s, inclusive.
For interrogator compliance evaluation the preferred Tari values of 6.25 s, 12.5 s or s should be used. For further details refer to Section 17, Ref. 1, chapter 6.3.1.2.4.
13.1.5 RF envelope for R=>TA specification of the relevant RF envelope parameters can be found in Section 17,
Ref. 1, chapter 6.3.1.2.5.
13.1.6 Interrogator power-up/down waveformFor a specification of the interrogator power-up and power-down RF envelope and
waveform parameters refer to Section 17, Ref. 1, chapters 6.3.1.2.6 and 6.3.1.2.7.
13.1.7 Preamble and frame-syncAn interrogator shall begin all R=>T signaling with either a preamble or a frame-sync. A
preamble shall precede a Query command and denotes the start of an inventory round.
For a definition and explanation of the relevant R=>T preamble and frame-sync refer to
Section 17, Ref. 1, chapter 6.3.1.2.8.
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
13.2 G2X to reader communicationAn interrogator receives information from a G2X by transmitting an unmodulated RF
carrier and listening for a backscattered reply. The G2X backscatters by switching the
reflection coefficient of its antenna between two states in accordance with the data being
sent. For further details refer to Section 17, Ref. 1, chapter 6.3.1.3.
13.2.1 Modulation The UCODE G2X communicates information by backscatter-modulating the amplitude
and/or phase of the RF carrier. Interrogators shall be capable of demodulating either
demodulation type.
13.2.2 Data encodingThe encoding format, selected in response to interrogator commands, is either FM0
baseband or Miller-modulated subaltern. The interrogator commands the encoding choice
13.2.2.1 FM0 basebandFM0 inverts the baseband phase at every symbol boundary; a data-0 has an additional
mid-symbol phase inversion. For details on FM0 and generator state diagram, FM0
symbols and sequences and how FM0 transmissions should be terminated refer to
Section 17, Ref. 1, chapter 6.3.1.3.
13.2.2.2 FM0 PreambleT=>R FM0 signaling begin with one of two defined preambles, depending on the value of
the TRext bit specified in the Query command that initiated the inventory round. For
further details refer to Section 17, Ref. 1, chapter 6.3.1.3.
13.2.2.3 Miller-modulated sub carrierBaseband Miller inverts its phase between two data-0s in sequence. Baseband Miller also
places a phase inversion in the middle of a data-1 symbol. For details on Miller-modulated
sub carrier, generator state diagram, sub carrier sequences and terminating sub carrier
transmissions refer to Section 17, Ref. 1, chapter 6.3.1.3.
13.2.2.4 Miller sub carrier preambleT=>R sub carrier signaling begins with one of the two defined preambles. The choice
depends on the value of the TRext bit specified in the Query command that initiated the
inventory round. For further details refer to Section 17, Ref. 1, chapter 6.3.1.3.
13.2.3 Data ratesThe G2X IC supports tag to interrogator data rates and link frequencies as specified in
Section 17, Ref. 1, chapter 6.3.1.3.
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
13.3 Link timingFor the interrogator interacting with a UCODE G2X equipped tag population exact link and
response timing requirements must be fulfilled, which can be found in Section 17, Ref.1,
chapter 6.3.1.6.
13.3.1 Regeneration timeThe regeneration time is the time required if a G2X is to demodulate the interrogator
signal, measured from the last falling edge of the last bit of the G2X response to the first
falling edge of the interrogator transmission. This time is referred to as T2 and can vary
between 3.0 Tpri and 20 Tpri. For a more detailed description refer to Section 17, Ref.1,
chapter 6.3.1.6.
13.3.2 Start-up timeFor a detailed description refer to Section 17, Ref. 1, chapter 6.3.1.3.4.
13.3.3 Persistence timeAn interrogator chooses one of four sessions and inventories tags within that session
(denoted S0, S1, S2, and S3). The interrogator and associated UCODE G2X population
operate in one and only one session for the duration of an inventory round (defined
above). For each session, a corresponding inventoried flag is maintained. Sessions allow
tags to keep track of their inventoried status separately for each of four possible
time-interleaved inventory processes, using an independent inventoried flag for each
process. Two or more interrogators can use sessions to independently inventory a
common UCODE G2X chip population.
A session flag indicates whether a G2X may respond to an interrogator. G2X chips
maintain a separate inventoried flag for each of four sessions; each flag has symmetric A
and B values. Within any given session, interrogators typically inventory tags from A to B
followed by a re-inventory of tags from B back to A (or vice versa).
Additionally, the G2X has implemented a selected flag, SL, which an interrogator may
assert or deassert using a Select command.
For a description of Inventoried flags S0 – S3 refer to Section 17, Ref. 1 chapter 6.3.2.2
and for a description of the Selected flag refer to Section 17, Ref. 1, chapter 6.3.2.3. For
tag flags and respective persistence time refer to Section 17, Ref. 1, table 6.14.
13.4 Bit and byte orderingThe transmission order for all R=>T and T=>R communications respects the following
conventions:
within each message, the most-significant word is transmitted first, and
within each word, the most-significant bit (MSB) is transmitted first,
whereas one word is composed of 16 bits.
To represent memory addresses and mask lengths EBV-8 values are used. An extensible
bit vector (EBV) is a data structure with an extensible data range. For a more detailed
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
13.5 Data integrityThe G2X ignores invalid commands. In general, "invalid" means a command that (1) is
incorrect given the current the G2X state, (2) is unsupported by the G2X, (3) has incorrect
parameters, (4) has a CRC error, (5) specifies an incorrect session, or (6) is in any other
way not recognized or not executable by the G2X. The actual definition of "invalid" is
state-specific and defined, for each G2X state, in n Section 17, Ref. 1 Annex B and
Annex C.
All UCODE G2X backscatter error codes are summarized in Section 17, Ref. 1 Error
codes, Annex I. For a detailed description of the individual backscatter error situations
which are command specific please refer to the Section 17, Ref. 1 individual command
description section 6.3.2.10.
13.6 CRCA CRC-16 is a cyclic-redundancy check that an interrogator uses when protecting certain
R=>T commands, and the G2X uses when protecting certain backscattered T=>R
sequences. To generate a CRC-16 an interrogator or the G2X first generates the CRC-16
precursor shown in Section 17, Ref. 1 T able 6.11, then take the ones-complement of the
generated precursor to form the CRC-16. For a detailed description of the CRC-16
generation and handling rules refer to Section 17, Ref. 1, chapter 6.3.2.1.
The CRC-5 is only used to protect the Query command (out of the mandatory command
set). It is calculated out of X5 + X3 + 1. For a more detailed CRC-5 description refer to
Section 17, Ref. 1, table 6.12.
For exemplary schematic diagrams for CRC-5 and CRC-16 encoder/decoder refer to
Section 17, Ref. 1, AnnexF.
For a CRC calculation example refer to Section 15.1, Table 27 and Table 28.
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
14. TAG selection, inventory and accessThis section contains all information including commands by which a reader selects,
inventories, and accesses a G2X population
An interrogator manages UCODE G2X equipped tag populations using three basic
operations. Each of these operations comprises one or more commands. The operations
are defined as follows
Select: The process by which an interrogator selects a tag population for inventory
and access. Interrogators may use one or more Select commands to select a
particular tag population prior to inventory.
Inventory: The process by which an interrogator identifies UCODE G2X equipped tags.
An interrogator begins an inventory round by transmitting a Query command
in one of four sessions. One or more G2X may reply. The interrogator detects
a single G2X reply and requests the PC, EPC, and CRC-16 from the chip. An
inventory round operates in one and only one session at a time. For an
example of an interrogator inventorying and accessing a single G2X refer to
Section 17, Ref. 1, Annex E.
Access: The process by which an interrogator transacts with (reads from or writes to)
individual G2X. An individual G2X must be uniquely identified prior to access.
Access comprises multiple commands, some of which employ one-time-pad
based cover-coding of the R=>T link.
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
14.1 G2X MemoryFor the general memory layout according to the standard Section 17, Ref. 1, refer to
Figure 6.17. The tag memory is logically subdivided into four distinct banks.
In accordance to the standard Section 17, Ref. 1, section 6.3.2.1. The tag memory of the
SL3ICS1002 G2XM is organized in following 4 memory sections:
The logical address of all memory banks begin at zero (00h).
Table 10. G2X memory sectionsReserved memory (32 bit ACCESS and 32 bit KILL password) 64 bit 00b
EPC (excluding 16 bit CRC-16 and 16 bit PC) 240 bit 01b
TID (including unique 32 bit serial number) 64 bit 10b
User memory (G2XM only) 512 bit 11b
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
14.1.1 Memory map[1] This is the initial memory content when delivered by NXP Semiconductors
[2] G2XL: HEX 3005 FB63 AC1F 3841 EC88 0467
G2XM: HEX 3005 FB63 AC1F 3681 EC88 0468
[3] only G2XM
Table 11. Memory map
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
14.1.1.1 User memory (only G2XM)The User Memory bank contains a sequential block of 512 bits (32 words of 16 bit)
ranging from address 00h to 1Fh. The user memory can be accessed via Select, Read or
Write command and it may be write locked, permanently write locked, unlocked or
permanently unlocked.
In addition reading of not only of the User Memory but of the whole memory including EPC
and TID can be protected by using the custom ReadProtect command.
14.1.1.2 Special behavior of user memory address 1FhWRITE or SELECT of user memory address 1Fh will falsely set an error flag. This will
affect the subsequent READ or SELECT.
The following commands will falsely set an internal error flag (without actually
causing an error):1) WRITE to user memory with WordPtr=1Fh
2) SELECT to user memory with compare mask ending at bitaddress 1FFh
(e.g. Pointer=1FEh, length=1 or Pointer=1FDh, length=2 …)
Note: The error flag is set independent of the chip state (also chips in the e.g. Ready
state are affected).
The falsely set error flag will affect the following sub sequential commands:A) READ command with WordCount=0 falsely responds with "memory overrun" error
B) SELECT command with Length<>0 falsely assumes non existing memory location
The behavior can be avoided with: Turning off the RF carrier to reset the chip (This is what readers typically do!).
Using the READ command with WordCount<>0.
Sending other command prior to READ or SELECT (e.g. WRITE to address<>1Fh,
ReqRN) or executing READ or SELECT two times.
Remark: The WRITE operation itself is not affected by this problem i.e. data is written properly! With commercially available readers this behavior is typically not observed.
14.1.1.3 Supported EPC typesThe EPC types are defined in the EPC Tag Standards document from EPCglobal.
These standards define completely that portion of EPC tag data that is standardized,
including how that data is encoded on the EPC tag itself (i.e. the EPC Tag Encodings), as
well as how it is encoded for use in the information systems layers of the EPC Systems
Network (i.e. the EPC URI or Uniform Resource Identifier Encodings).
The EPC Tag Encodings include a Header field followed by one or more Value Fields. The
Header field indicates the length of the Values Fields and contains a numbering system
identifier (NSI). The Value Fields contain a unique EPC Identifier and optional Filter Value
when the latter is judged to be important to encode on the tag itself.
NXP Semiconductors SL3ICS1002/1202
UCODE G2XM and G2XL
14.2 Sessions, selected and inventoried flagsSession, Selected and Inventory Flags are according the EPCglobal standard. For a
description refer to Section 17, Ref. 1, section 6.3.2.3.
14.2.1 G2X States and slot counterFor a description refer to Section 17, Ref. 1, section 6.3.2.4.
14.2.2 G2X State DiagramThe tag state are according the EPCglobal standard please refer to: Section 17, Ref.1,
section 6.3.2.4 Tag states and slot counter.
A detailed tag state diagram is shown in Section 17, Ref. 1, figure 6.19. Refer also to
Section 17, Ref. 1, Annex B for the associated state-transition tables and to Section 17,
Ref. 1, Annex C for the associated command-response tables.
14.3 Managing tag populationsFor a detailed description on how to manage an UCODE G2X tag populations refer to
Section 17, Ref. 1, chapter 6.3.2.6.
14.4 Selecting tag populationsFor a detailed description of the UCODE G2X tag population selection process refer to
Section 17, Ref. 1, section 6.3.2.7.
14.5 Inventorying tag populationsFor a detailed description on accessing individual tags based on the UCODE G2X refer to
Section 17, Ref. 1, section 6.3.2.8.
14.6 Accessing individual tagsFor a detailed description on accessing individual tags based on the UCODE G2X refer to
Section 17, Ref. 1, section 6.3.2.9.
An example inventory and access of a single UCODE G2X tag is shown in Section 17,
Ref. 1, Annex E.1.
14.7 Interrogator commands and tag repliesFor a detailed description refer to Section 17, Ref. 1, section 6.3.2.10.
14.7.1 CommandsAn overview of interrogator to tag commands is located in Section 17, Ref. 1, Table 6.16.
Note that all mandatory commands are implemented on the G2X according to the
standard. Additionally the optional command Access is supported by the G2X (for details
refer to Section 14.11 “Optional Access Command”). Besides also custom commands are
implemented on the G2X (for details refer to Section 14.12 “Custom Commands”.
