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Partno	Mfg	Dc	Qty	Available	Descript
RB751CS40	NXP	N/a	15000	avai	Schottky barrier single diodes
RB751CS-40 |RB751CS40	ROHM	N/a	8000	avai	Schottky barrier single diodes
RB751S40	NXP	N/a	297000	avai	Schottky Barrier Diode
RB751V40	NXP/PHILIPS	N/a	51000	avai	Schottky barrier single diodes

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RB751CS40-RB751CS-40-RB751S40-RB751V40
Schottky barrier single diodes
Product profile1.1 General description
Planar Schottky barrier single diodes with an integrated guard ring for stress protection,
encapsulated in small Surface-Mounted Device (SMD) plastic packages.
1.2 Features Low forward voltage Low capacitance
1.3 Applications Ultra high-speed switching Voltage clamping Line termination Reverse polarity protection
1.4 Quick reference data
[1] Pulse test: tp≤ 300μs;δ≤ 0.02.
RB751 series
Schottky barrier single diodes
Rev. 01 — 21 May 2007 Product data sheet
Table 1. Product overview
RB751CS40 SOD882 - leadless ultra small
RB751S40 SOD523 SC-79 ultra small
RB751V40 SOD323 SC-76 very small
Table 2. Quick reference data forward current - - 120 mA
VRRM repetitive peak reverse
voltage
--40 V forward voltage IF =1mA [1]- - 370 mV
NXP Semiconductors RB751 series
Schottky barrier single diodes Pinning information
[1] The marking bar indicates the cathode. Ordering information Marking
Table 3. Pinning
SOD882 cathode [1] anode
SOD323; SOD523 cathode [1] anode
Transparent
top view
sym001
001aab540
sym001
Table 4. Ordering information
RB751CS40 - leadless ultra small plastic package; 2 terminals;
body 1.0× 0.6× 0.5 mm
SOD882
RB751S40 SC-79 plastic surface-mounted package; 2 leads SOD523
RB751V40 SC-76 plastic surface-mounted package; 2 leads SOD323
Table 5. Marking codes
RB751CS40 F6
RB751S40 G4
RB751V40 W8
NXP Semiconductors RB751 series
Schottky barrier single diodes Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method. Characteristics
[1] Pulse test: tp≤ 300μs;δ≤ 0.02.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
VRRM repetitive peak reverse
voltage
-40 V reverse voltage - 40 V forward current - 120 mA
IFSM non-repetitive peak forward
current
square wave; <10ms 200 mA
Ptot total power dissipation Tamb≤25°C [1]
RB751CS40 [2]- 250 mW
RB751S40 [2]- 280 mW
RB751V40 - 280 mW junction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °C
Table 7. Thermal characteristics
Rth(j-a) thermal resistance from
junction to ambient
in free air [1]
RB751CS40 [2]- - 500 K/W
RB751S40 [2]- - 450 K/W
RB751V40 - - 450 K/W
Table 8. Characteristics
Tamb =25 °C unless otherwise specified. forward voltage IF =1mA [1]- - 370 mV reverse current VR=30V - - 0.5 μA diode capacitance VR=1 V; f=1 MHz - 2 - pF
NXP Semiconductors RB751 series
Schottky barrier single diodes
NXP Semiconductors RB751 series
Schottky barrier single diodes Package outline Packing information
[1] For further information and the availability of packing methods, see Section13.
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
RB751CS40 SOD882 2 mm pitch, 8 mm tape and reel - - -315
RB751S40 SOD523 2 mm pitch, 8 mm tape and reel - -315 - mm pitch, 8 mm tape and reel -115 - -135
RB751V40 SOD323 4 mm pitch, 8 mm tape and reel -115 - -135
NXP Semiconductors RB751 series
Schottky barrier single diodes
10. Soldering

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