PUMX1 ,40 V, 100 mA NPN/NPN general-purpose transistorLimiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter C ..
PUMZ1 ,NPN/PNP general purpose transistorsLIMITING VALUESIn accordance with the Absolute Maximum Rating System (IEC 134).SYMBOL PARAMETER CON ..
PUMZ2 ,PIMZ2; PUMZ2; NPN/PNP general-purpose double transistors
PUS-0505A , DC-DC Converter UNIT 1W UNREGULATED DC-DC CONVERTER
PUSB6B , 500 WATT low capacitance steering diode/TVS ARRAY
PUSB6B , 500 WATT low capacitance steering diode/TVS ARRAY
R2J20605ANP#G3 , Integrated Driver - MOS FET (DrMOS)
R2J20652ANP , Integrated Driver - MOS FET (DrMOS)
R2S15900SP , 2ch Electronic Volume with Surround
R2S15900SP , 2ch Electronic Volume with Surround
R3111D161A , LOW VOLTAGE DETECTOR
R3111D251A , LOW VOLTAGE DETECTOR
PUMX1
40 V, 100 mA NPN/NPN general-purpose transistor
Product profile1.1 General descriptionNPN/NPN general-purpose transistor with two independently operating transistors in a
SOT363 (SC-88) very small Surface-Mounted Device (SMD) plastic package.
1.2 Features Double general-purpose transistor Board-space reduction Very small SMD plastic package
1.3 Applications General-purpose switching and amplification
Pinning information
PUMX1
40 V, 100 mA NPN/NPN general-purpose transistor
Rev. 04 — 20 January 2010 Product data sheet
Table 1. Product overviewPUMX1 SOT363 SC-88 PUMT1 PUMZ1
Table 2. Pinning1emitter TR1
2base TR1 collector TR2
4emitter TR2
5base TR2 collector TR1
sym0201 36
TR1
TR2
NXP Semiconductors PUMX1
40 V, 100 mA NPN general-purpose double transistor Ordering information Marking[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Limiting values[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Table 3. Ordering informationPUMX1 SC-88 plastic surface-mounted package; 6 leads SOT363
Table 4. Marking codesPUMX1 Z*Z
Table 5. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).
Per transistorVCBO collector-base voltage open emitter - 50 V
VCEO collector-emitter voltage open base - 40 V
VEBO emitter-base voltage open collector - 5 V collector current - 100 mA
ICM peak collector current - 200 mA
IBM peak base current - 200 mA
Ptot total power dissipation Tamb≤25 °C- 200 mW
Per devicePtot total power dissipation Tamb≤25°C [1] -300 mW junction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °C
NXP Semiconductors PUMX1
40 V, 100 mA NPN general-purpose double transistor Thermal characteristics[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Characteristics[1] Pulse test: tp≤ 300 μs; δ≤ 0.02.
Table 6. Thermal characteristics
Per deviceRth(j-a) thermal resistance from junction
to ambient
in free air [1]- - 416 K/W
Table 7. CharacteristicsTamb =25 °C unless otherwise specified.
Per transistorICBO collector-base cut-off current VCB =30V; =0A - 100 nA
VCB =30V; =0A; = 150°C
--10 μA
IEBO emitter-base cut-off current VEB =4V; =0A - 100 nA
hFE DC current gain VCE =6V; =1mA
120 - -
VCEsat collector-emitter saturation
voltage =50 mA; =5mA
[1]- - 200 mV transition frequency IC =2mA;
VCE =12V;
f=100MHz
100 - - MHz collector capacitance VCB =12V; =ie =0A;
f=1MHz
--1.5 pF
NXP Semiconductors PUMX1
40 V, 100 mA NPN general-purpose double transistor Package outline Packing information[1] For further information and the availability of packing methods, see Section12.
[2] T1: normal taping
[3] T2: reverse taping
Table 8. Packing methodsThe indicated -xxx are the last three digits of the 12NC ordering code.[1]
PUMX1 SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -135 mm pitch, 8 mm tape and reel; T2 [3] -125 -165
NXP Semiconductors PUMX1
40 V, 100 mA NPN general-purpose double transistor
10. Revision history Table 9. Revision historyPUMX1_4 20100120 Product data sheet - PUMX1_3
Modifications:
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Table 1 “Product overview”: added
Section 1.2 “Features”: updated
Section 1.3 “Applications”: amended
Section 2 “Pinning information”: amended
Figure 1: superseded by minimized package outline drawing
Section 9 “Packing information”: added
Section 11 “Legal information”: updated
PUMX1_3 19990414 Preliminary specification - PUMX1_2
PUMX1_2 19970709 Preliminary specification - PUMX1_1
NXP Semiconductors PUMX1
40 V, 100 mA NPN general-purpose double transistor
11. Legal information
11.1 Data sheet status[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://.
11.2 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
11.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on a weakness or default in the
customer application/use or the application/use of customer’s third party
customer(s) (hereinafter both referred to as “Application”). It is customer’s
sole responsibility to check whether the NXP Semiconductors product is
suitable and fit for the Application planned. Customer has to do all necessary
testing for the Application in order to avoid a default of the Application and the
product. NXP Semiconductors does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial
sale, as published at http:///profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
11.4 TrademarksNotice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
