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PSMN017-80BS |PSMN01780BSNXP/PHN/a10000avaiN-channel 80 V 17 m鈩?standard level MOSFET in D2PAK


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PSMN017-80BS
N-channel 80 V 17 m鈩?standard level MOSFET in D2PAK
Product profile1.1 General description
Standard level N-channel MOSFET in D2PAK package qualified to 175 °C. This product is
designed and qualified for use in a wide range of industrial, communications and domestic
equipment.
1.2 Features and benefits
High efficiency due to low switching
and conduction losses Suitable for standard level gate drive
sources
1.3 Applications
DC-to-DC converters Load switching Motor control Server power supplies
1.4 Quick reference data

PSMN017-80BS
N-channel 80 V 17 mΩ standard level MOSFET in D2PAK
Rev. 2 — 1 March 2012 Product data sheet
Table 1. Quick reference data

VDS drain-source voltage Tj≥25 °C; Tj≤ 175°C - - 80 V drain current Tmb =25 °C; VGS =10V; see Figure 1 --50 A
Ptot total power dissipation Tmb =25 °C; see Figure 2 - - 103 W junction temperature -55 - 175 °C
Static characteristics

RDSon drain-source on-state resistance VGS =10 V; ID =10A; Tj =100 °C; see Figure 12 - 15.2 29 mΩ
VGS =10 V; ID =10A; Tj =25°C;
see Figure 13 13.7 17 mΩ
Dynamic characteristics

QGD gate-drain charge VGS =10 V; ID =25A; VDS =40V;
see Figure 14; see Figure 15 -nC
QG(tot) total gate charge - 26 - nC
Avalanche ruggedness

EDS(AL)S non-repetitive drain-source
avalanche energy
VGS =10 V; Tj(init) =25°C; ID =50A;
Vsup≤80 V; RGS =50 Ω; unclamped
--55 mJ
NXP Semiconductors PSMN017-80BS
N-channel 80 V 17 mΩ standard level MOSFET in D2PAK Pinning information

[1] It is not possible to make connection to pin 2 Ordering information Limiting values
Table 2. Pinning information
Table 3. Ordering information

PSMN017-80BS D2PAK plastic single-ended surface-mounted package (D2PAK); 3 leads
(one lead cropped)
SOT404
Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
VDS drain-source voltage Tj≥25 °C; Tj≤ 175°C - 80 V
VDGR drain-gate voltage Tj≥25 °C; Tj≤ 175 °C; RGS =20kΩ -80 V
VGS gate-source voltage -20 20 V drain current VGS =10V; Tmb= 100 °C; see Figure 1 -35 A
VGS =10V; Tmb =25°C; see Figure 1 -50 A
IDM peak drain current pulsed; tp≤10 µs; Tmb =25°C;
see Figure 3 200 A
Ptot total power dissipation Tmb =25°C; see Figure 2 - 103 W
Tstg storage temperature -55 175 °C junction temperature -55 175 °C
Tsld(M) peak soldering temperature - 260 °C
Source-drain diode
source current Tmb =25°C - 50 A
ISM peak source current pulsed; tp≤10 µs; Tmb=25°C - 200 A
Avalanche ruggedness

EDS(AL)S non-repetitive drain-source avalanche
energy
VGS =10V; Tj(init) =25°C; ID =50A;
Vsup≤80 V; RGS =50 Ω; unclamped
-55 mJ
NXP Semiconductors PSMN017-80BS
N-channel 80 V 17 mΩ standard level MOSFET in D2PAK
NXP Semiconductors PSMN017-80BS
N-channel 80 V 17 mΩ standard level MOSFET in D2PAK Thermal characteristics

Table 5. Thermal characteristics

Rth(j-mb) thermal resistance from junction to
mounting base
see Figure 4 -1 1.5 K/W
Rth(j-a) thermal resistance from junction to
ambient
Minimum footprint; mounted on
a printed circuit board
-50 -K/W
NXP Semiconductors PSMN017-80BS
N-channel 80 V 17 mΩ standard level MOSFET in D2PAK Characteristics
Table 6. Characteristics
Tested to JEDEC standards where applicable.
Static characteristics

V(BR)DSS drain-source breakdown
voltage= 250 µA; VGS =0V; Tj= -55°C 73 --V= 250 µA; VGS =0V; Tj=25°C 80 --V
VGS(th) gate-source threshold voltage ID =1mA; VDS =VGS; Tj =175 °C;
see Figure 10; see Figure 11 --V =1mA; VDS =VGS; Tj =-55 °C;
see Figure 10; see Figure 11
--4.8 V =1mA; VDS =VGS; Tj =25 °C;
see Figure 10; see Figure 11
234V
IDSS drain leakage current VDS =80V; VGS =0V; Tj=25°C - 0.3 2 µA
VDS =80V; VGS =0V; Tj= 125°C - - 50 µA
IGSS gate leakage current VGS =-20 V; VDS =0V; Tj=25°C - 10 100 nA
VGS =20V; VDS =0V; Tj=25°C - 10 100 nA
RDSon drain-source on-state
resistance
VGS =10V; ID =10A; Tj =175 °C;
see Figure 12 32.64 40.8 mΩ
VGS =10V; ID =10A; Tj =100 °C;
see Figure 12 15.2 29 mΩ
VGS =10V; ID =10A; Tj =25°C;
see Figure 13 13.7 17 mΩ internal gate resistance (AC) f=1 MHz - 1 - Ω
Dynamic characteristics

QG(tot) total gate charge ID =0A; VDS =0 V; VGS =10V - 22 - nC =25A; VDS =40V; VGS =10V;
see Figure 14; see Figure 15
-26 -nC
QGS gate-source charge - 7.7 - nC
QGS(th) pre-threshold gate-source
charge
-4.6 -nC
QGS(th-pl) post-threshold gate-source
charge -nC
QGD gate-drain charge - 6 - nC
VGS(pl) gate-source plateau voltage ID =25A; VDS=40 V; see Figure 15 -4.7 -V
Ciss input capacitance VDS =40V; VGS=0 V; f=1 MHz; =25 °C; see Figure 16 1573 - pF
Coss output capacitance - 154 - pF
Crss reverse transfer capacitance - 88 - pF
td(on) turn-on delay time VDS =40V; RL =1.6 Ω; VGS =10V;
RG(ext) =4.7Ω
-14 -ns rise time - 12 - ns
td(off) turn-off delay time - 27 - ns fall time - 8 - ns
NXP Semiconductors PSMN017-80BS
N-channel 80 V 17 mΩ standard level MOSFET in D2PAK

Source-drain diode

VSD source-drain voltage IS =10A; VGS =0V; Tj =25°C;
see Figure 17 0.79 1.2 V
trr reverse recovery time IS =40A; dIS/dt= 100 A/µs;
VGS =0V; VDS =40V
-41 -ns recovered charge - 55 - nC
Table 6. Characteristics …continued

Tested to JEDEC standards where applicable.
NXP Semiconductors PSMN017-80BS
N-channel 80 V 17 mΩ standard level MOSFET in D2PAK
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