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PSMN006-20K |PSMN00620KNXP/PHN/a10000avaiN-channel TrenchMOS SiliconMAX ultra low level FET
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PSMN006-20K
N-channel TrenchMOS SiliconMAX ultra low level FET
PSMN006-20K
N-channel TrenchMOS SiliconMAX ultra low level FET
Rev. 01 — 17 November 2009 Product data sheet Product profile
1.1 General description

SiliconMAX ultra low level N-channel enhancement mode Field-Effect Transistor (FET) in
a plastic package using TrenchMOS technology. This product is designed and qualified for
use in computing, communications, consumer and industrial applications only.
1.2 Features and benefits
Low conduction losses due to low
on-state resistance Suitable for very low gate drive
sources
1.3 Applications
Computer motherboards DC-to-DC convertors Switched-mode power supplies
1.4 Quick reference data
Table 1. Quick reference
VDS drain-source voltage Tj≥25 °C; Tj≤ 150°C - - 20 V drain current Tsp =25°C; VGS =4.5V;
see Figure 1 and 3
--32 A
Ptot total power
dissipation
Tsp =25°C; see Figure 2 --8.3 W
Dynamic characteristics

QGD gate-drain charge VGS= 2.5 V; ID =30A;
VDS =10V; Tj =25°C;
see Figure 11 13.2 - nC
Static characteristics

RDSon drain-source
on-state resistance
VGS= 2.5 V; ID =5A; =25°C; see Figure 9 and 10
-4.8 5.7 mΩ
VGS= 1.8 V; ID =5A; =25 °C; see Figure 10
-5.7 8.2 mΩ
VGS= 4.5 V; ID =5A; =25°C; see Figure 9 and 10
-4.2 5 mΩ
NXP Semiconductors PSMN006-20K
N-channel TrenchMOS SiliconMAX ultra low level FET Pinning information
Ordering information Limiting values
Table 2. Pinning information
source
SOT96-1 (SO8)
source source gate drain drain drain drain
Table 3. Ordering information

PSMN006-20K SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
VDS drain-source voltage Tj≥25 °C; Tj≤ 150°C - 20 V
VGS gate-source voltage -10 10 V drain current Tsp =25 °C; VGS= 4.5 V; see Figure 1 and 3 -32 A
IDM peak drain current Tsp =25 °C; tp≤10 µs; pulsed; see Figure 3 -60 A
Ptot total power dissipation Tsp =25 °C; see Figure 2 -8.3 W
Tstg storage temperature - 150 °C junction temperature -55 150 °C
Source-drain diode
source current Tsp =25°C - 7.5 A
ISM peak source current Tsp =25 °C; tp≤10 µs; pulsed - 30 A
NXP Semiconductors PSMN006-20K
N-channel TrenchMOS SiliconMAX ultra low level FET
NXP Semiconductors PSMN006-20K
N-channel TrenchMOS SiliconMAX ultra low level FET Thermal characteristics

Table 5. Thermal characteristics

Rth(j-sp) thermal resistance from
junction to solder point
mounted on a metal clad board;
see Figure 4
--15 K/W
NXP Semiconductors PSMN006-20K
N-channel TrenchMOS SiliconMAX ultra low level FET Characteristics
Table 6. Characteristics
Static characteristics

V(BR)DSS drain-source
breakdown voltage =250 µA; VGS =0V; Tj =25°C 20 - - V
VGS(th) gate-source threshold
voltage =1mA; VDS = VGS; Tj= 150 °C; see Figure 8 0.15 - - V =1mA; VDS = VGS; Tj =25°C; see Figure 8 0.4 0.7 - V
IDSS drain leakage current VDS =20V; VGS =0V; Tj= 150°C - - 0.5 µA
VDS =20V; VGS =0V; Tj=25°C - 0.05 1 µA
IGSS gate leakage current VGS =8V; VDS =0V; Tj=25°C - 10 100 nA
VGS =-8 V; VDS =0V; Tj=25°C - 10 100 nA
RDSon drain-source on-state
resistance
VGS =2.5 V; ID =5A; Tj=25 °C; see Figure 9
and 10
-4.8 5.7 mΩ
VGS =1.8 V; ID =5A; Tj=25 °C; see Figure 10 -5.7 8.2 mΩ
VGS =4.5 V; ID =5A; Tj=25 °C; see Figure 9
and 10
-4.2 5 mΩ
Dynamic characteristics

QG(tot) total gate charge ID =30A; VDS =10V; VGS =25V; Tj =25°C;
see Figure 11
-32 - nC
QGS gate-source charge ID =30A; VDS =10V; VGS =2.5 V; Tj =25°C;
see Figure 11
-10 - nC
QGD gate-drain charge - 13.2 - nC
Ciss input capacitance VDS =20V; VGS=0 V; f=1 MHz; Tj =25°C;
see Figure 12 4350 - pF
Coss output capacitance - 825 - pF
Crss reverse transfer
capacitance 550 - pF
td(on) turn-on delay time VDS =10V; RL =10 Ω; VGS =4.5V;
RG(ext) =6 Ω; Tj =25°C
-65 - ns rise time - 32 - ns
td(off) turn-off delay time - 190 - ns fall time - 90 - ns
gfs forward
transconductance
VDS =15V; ID =10A - 25 - S
Source-drain diode

VSD source-drain voltage IS =3A; VGS =0V; Tj=25 °C; see Figure 13 - 0.75 1.3 V
trr reverse recovery time IS =10A; dIS/dt= -70 A/µs; VGS =0V;
VDS =25V; Tj =25°C
-47 - ns recovered charge - 17 - nC
NXP Semiconductors PSMN006-20K
N-channel TrenchMOS SiliconMAX ultra low level FET
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