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PSB7110FV1.0
ISAR (Enhanced ISDN Data Access Contr...
_________PSB 7110
Published by Siemens AG, Bereich Halbleiter, Product Definition, Balanstraße 73, D-81541 München©Siemens AG 1995. All Rights Reserved.
As far as patents or other rights of third parties are concerned, liability is only assumed for components per se, not for applications, processes and
circuits implemented within components or assemblies.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved.
For questions on technology, delivery, and prices please contact the Office of Semiconductor Group in Germany or the Siemens Companies and
Representatives worldwide (see address list).
Due to technical requirements components may contain dangerous substances. For information on the type in question please contact your
nearest Siemens Office, Semiconductor Group.
Siemens AG is an approved CECC manufacturer.
_________PSB 7110
3.10.4Program Code Download...............................................................................................................125
3.10.5DSP Program Start.........................................................................................................................129
3.11Fax Class 1 Implementation.....................................................................................................................130
3.11.1Summary of ISAR Fax Control Commands...................................................................................131
3.11.2Summary of ISAR Fax Status Events.............................................................................................132
3.11.3Procedure Termination...................................................................................................................133
3.11.4Fax Pump Startup Procedure.........................................................................................................134
3.11.5HDLC Transmission........................................................................................................................135
3.11.6Binary Transmission........................................................................................................................136
3.11.7HDLC Reception.............................................................................................................................137
3.11.8Binary Reception.............................................................................................................................138
3.11.9Call Termination..............................................................................................................................139
3.11.10Procedure Terminations..................................................................................................................139
3.12Datamodem Automode Operation...........................................................................................................140
Summary of Messages.......................................................................................................................................142Example Configuration Settings........................................................................................................................146Detailed Register Description............................................................................................................................1486.1Register Address Map..................................................................................................................................148
6.2Register Description.....................................................................................................................................148
Hardware and Software Support.......................................................................................................................151Electrical Specification.......................................................................................................................................1538.1Absolute Maximum Ratings..........................................................................................................................153
8.2Recommended Operating Conditions.........................................................................................................153
8.3DC Characteristics........................................................................................................................................153
8.4Capacitances................................................................................................................................................154
8.5Oscillator Circuit............................................................................................................................................154
8.6XTAL1,2 Recommended Typical Crystal Parameters.................................................................................155
8.8AC Characteristics........................................................................................................................................156
8.8.1Testing Waveform...........................................................................................................................156
8.8.2Parallel Host Interface Timing.........................................................................................................156
8.8.3External Memory Interface Timing..................................................................................................158
8.8.4IOM-2 Interface Timing...................................................................................................................160
8.9 ESD Capability...............................................................................................................................................160
Package Outline..................................................................................................................................................161
