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PMN70XPENXP/PHN/a10000avai20 V, single P-channel Trench MOSFET


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PMN70XPE
20 V, single P-channel Trench MOSFET
PMN70XPE
20 V, single P-channel Trench MOSFET6 July 2012 Product data sheet Product profile
1.1 General description

P-channel enhancement mode Field-Effect Transistor (FET) in a small SOT457 (SC-74)Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
1.2 Features and benefits
Low threshold voltage• Very fast switching• Trench MOSFET technology• 2 kV ESD protection
1.3 Applications
Relay driver• High-speed line driver• High-side loadswitch• Switching circuits
1.4 Quick reference data
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit

VDS drain-source voltage - - -20 V
VGS gate-source voltage
Tamb = 25 °C
-12 - 12 V drain current VGS = -4.5 V; Tamb = 25 °C; t ≤ 5 s [1] - - -4.1 A
Static characteristics

RDSon drain-source on-state
resistance
VGS = -4.5 V; ID = -2 A; Tj = 25 °C - 70 85 mΩ
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
drain 6 cm2.
NXP Semiconductors PMN70XPE
20 V, single P-channel Trench MOSFET Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
D drain D drain G gate S source D drain D drain 3256
TSOP6 (SOT457)

017aaa259 Ordering information
Table 3. Ordering information
PackageType number
Name Description Version

PMN70XPE TSOP6 plastic surface-mounted package (TSOP6); 6 leads SOT457 Marking
Table 4. Marking codes
Type number Marking code

PMN70XPE WF Limiting values
Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit

VDS drain-source voltage - -20 V
VGS gate-source voltage
Tamb = 25 °C
-12 12 V
VGS = -4.5 V; Tamb = 25 °C; t ≤ 5 s [1] - -4.1 A
VGS = -4.5 V; Tamb = 25 °C [1] - -3.2 A drain current
VGS = -4.5 V; Tamb = 100 °C [1] - -2 A
IDM peak drain current Tamb = 25 °C; single pulse; tp ≤ 10 µs - -12.8 A
[2] - 500 mWTamb = 25 °C
[1] - 1220 mW
Ptot total power dissipation - 6250 mW
NXP Semiconductors PMN70XPE
20 V, single P-channel Trench MOSFET
Symbol Parameter Conditions Min Max Unit
junction temperature -55 150 °C
Tamb ambient temperature -55 150 °C
Tstg storage temperature -65 150 °C
Source-drain diode
source current Tamb = 25 °C [1] - -1.3 A
ESD maximum rating

VESD electrostatic discharge voltage HBM [3] - 2000 V
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
drain 6 cm2.[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[3] Measured between all pins.(°C)-75 17512525 75-25
017aaa123
Pder(%)
Fig. 1. Normalized total power dissipation as afunction of junction temperature
(°C)-75 17512525 75-25
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Ider(%)
Fig. 2. Normalized continuous drain current as afunction of junction temperature
NXP Semiconductors PMN70XPE
20 V, single P-channel Trench MOSFET

017aaa648
-102(A)
VDS (V)0 -102-10-1
Limit RDSon = VDS/ID
tp = 1 ms
tp = 10 ms
DC; Tsp = 25 °C
DC; Tamb = 25 °C; drain mounting pad 6 cm2
tp = 100 ms
IDM = single pulse
Fig. 3. Safe operating area; junction to ambient; continuous and peak drain currents as a function of drain-source voltage Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit

[1] - 216 250 K/W
[2] - 89 102 K/W
Rth(j-a) thermal resistancefrom junction to
ambient
in free air
[3] - 55 63 K/W
Rth(j-sp) thermal resistance
from junction to solderpoint 15 20 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint[2]2
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm2 , t ≤ 5 s
NXP Semiconductors PMN70XPE
20 V, single P-channel Trench MOSFET

017aaa649
tp (s)10-3 102 10310110-2 10-12
Zth(j-a)(K/W)
duty cycle = 1
0.75 0.50.33 0.250.2
0.05 0.02
0.01 0
FR4 PCB, standard footprint
Fig. 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

017aaa650
tp (s)10-3 102 10310110-2 10-1
Zth(j-a)(K/W)
duty cycle = 1
0.75 0.50.33 0.250.2 0.1
0.05 0.020.01
FR4 PCB, mounting pad for drain 6 cm2
Fig. 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values Characteristics Max Unit
- V -1.25 V -1 µA -10 µA
NXP Semiconductors PMN70XPE
20 V, single P-channel Trench MOSFET
Symbol Parameter Conditions Min Typ Max Unit

VGS = 12 V; VDS = 0 V; Tj = 25 °C - - -10 µAIGSS gate leakage current
VGS = -12 V; VDS = 0 V; Tj = 25 °C - - -10 µA
VGS = -4.5 V; ID = -2 A; Tj = 25 °C - 70 85 mΩ
VGS = -4.5 V; ID = -2 A; Tj = 150 °C - 98 118 mΩ
RDSon drain-source on-stateresistance
VGS = -2.5 V; ID = -1.5 A; Tj = 25 °C - 101 129 mΩ
gfs forward
transconductance
VDS = -10 V; ID = -2 A; Tj = 25 °C - 7 - S
Dynamic characteristics

QG(tot) total gate charge - 5.2 7.8 nC
QGS gate-source charge - 1.1 - nC
QGD gate-drain charge
VDS = -10 V; ID = -2 A; VGS = -4.5 V;
Tj = 25 °C 1.3 - nC
Ciss input capacitance - 602 - pF
Coss output capacitance - 101 - pF
Crss reverse transfercapacitance
VDS = -10 V; f = 1 MHz; VGS = 0 V;
Tj = 25 °C 75 - pF
td(on) turn-on delay time - 7 - ns rise time - 13 - ns
td(off) turn-off delay time - 40 - ns fall time
VDS = -10 V; ID = -2 A; VGS = -4.5 V;
RG(ext) = 6 Ω; Tj = 25 °C 17 - ns
Source-drain diode

VSD source-drain voltage IS = -0.5 A; VGS = 0 V; Tj = 25 °C - -0.7 -1.2 V
NXP Semiconductors PMN70XPE
20 V, single P-channel Trench MOSFET

VDS (V)0 -4-3-1 -2
017aaa651
-15(A)V
-4.5V -3.5VV VGS=-2.8V
-2.5V
-2.2V
-1.8V
Tj = 25 °C
Fig. 6. Output characteristics: drain current as a function of drain-source voltage; typical values

017aaa129
VGS(V)0.0 -1.5-1.0-0.5
-10-3(A)
(2)(1) (3)
Tj = 25 °C; VDS = -3 V
(1) minimum values(2) typical values
(3) maximum values
Fig. 7. Sub-threshold drain current as a function of
gate-source voltage

017aaa652
RDSon(mΩ)
-1.8V -2.2V -2.5V -2.8V
-3.0V
-3.5V
-4.5V
-8.0V
VGS (V)0 -6-4-2
017aaa653
RDSon(mΩ)=150°C=25°C
ID = -2 A
Fig. 9. Drain-source on-state resistance as a functionof gate-source voltage; typical values
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