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PMEG4010ERNXPN/a12000avai1 A low V_F MEGA Schottky barrier rectifier


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PMEG4010ER
1 A low V_F MEGA Schottky barrier rectifier
1. Product profile
1.1 General description

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a SOD123W small and flat
lead Surface-Mounted Device (SMD) plastic package.
1.2 Features and benefits
Average forward current: IF(AV)≤ 1A Reverse voltage: VR≤40V Low forward voltage High power capability due to clip-bond technology AEC-Q101 qualified Small and flat lead SMD plastic package
1.3 Applications
Low voltage rectification High efficiency DC-to-DC conversion Switch Mode Power Supply (SMPS) Reverse polarity protection Low power consumption applications
1.4 Quick reference data

[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.
PMEG4010ER
1 A low VF MEGA Schottky barrier rectifier
Rev. 02 — 15 April 2010 Product data sheet
Table 1. Quick reference data
=25 °C unless otherwise specified.
IF(AV) average forward current square wave; δ= 0.5; =20 kHz
Tamb≤ 115°C [1] -- 1 A
Tsp≤ 140 °C- - 1 A reverse voltage - - 40 V forward voltage IF=1A - 430 490 mV reverse current VR =40V - 10 50 μA
NXP Semiconductors PMEG4010ER
1 A low VF MEGA Schottky barrier rectifier
2. Pinning information

[1] The marking bar indicates the cathode.
3. Ordering information

4. Marking

5. Limiting values

Table 2. Pinning
cathode [1] anode
Table 3. Ordering information

PMEG4010ER - plastic surface-mounted package; 2 leads SOD123W
Table 4. Marking codes

PMEG4010ER BD
Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). reverse voltage Tj =25 °C- 40 V
IF(AV) average forward current square wave; δ= 0.5;
f=20 kHz
Tamb≤ 115°C [1] -1 A
Tsp≤ 140 °C- 1 A
IFSM non-repetitive peak
forward current
square wave; =8ms
[2] -50 A
Ptot total power dissipation Tamb≤25°C [3][4] -0.57 W
[3][5] -0.95 W
[3][1] -1.8 W
NXP Semiconductors PMEG4010ER
1 A low VF MEGA Schottky barrier rectifier

[1] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[2] Tj =25 °C prior to surge.
[3] Reflow soldering is the only recommended soldering method.
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[5] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics

[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[5] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[6] Soldering point of cathode tab. junction temperature - 150 °C
Tamb ambient temperature −55 +150 °C
Tstg storage temperature −65 +150 °C
Table 5. Limiting values …continued

In accordance with the Absolute Maximum Rating System (IEC 60134).
Table 6. Thermal characteristics

Rth(j-a) thermal resistance from
junction to ambient
in free air [1][2]
[3]- - 220 K/W
[4]- - 130 K/W
[5] --70 K/W
Rth(j-sp) thermal resistance from
junction to solder point
[6] --18 K/W
NXP Semiconductors PMEG4010ER
1 A low VF MEGA Schottky barrier rectifier

NXP Semiconductors PMEG4010ER
1 A low VF MEGA Schottky barrier rectifier

7. Characteristics

Table 7. Characteristics
=25 °C unless otherwise specified. forward voltage IF= 0.1A - 310 360 mV=1A - 430 490 mV reverse current VR =10V - 3 13 μA =40V - 10 50 μA diode capacitance f=1 MHz=1V - 130 - pF =10V - 50 - pF
NXP Semiconductors PMEG4010ER
1 A low VF MEGA Schottky barrier rectifier

NXP Semiconductors PMEG4010ER
1 A low VF MEGA Schottky barrier rectifier

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