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PMBFJ308-PMBFJ309-PMBFJ310
N-channel silicon FET
1. Product profile
1.1 General descriptionSymmetrical N-channel silicon junction field-effect transistors in a SOT23 package.
1.2 Features and benefits Low noise Interchangeability of drain and source connections High gain.
1.3 Applications AM input stage in car radios VHF amplifiers Oscillators and mixers.
1.4 Quick reference data
PMBFJ308; PMBFJ309;
PMBFJ310
N-channel silicon field-effect transistors
Rev. 4 — 20 September 2011 Product data sheet
Table 1. Quick reference dataVDS drain-source voltage - - 25 V
VGSoff gate-source cut-off voltage
PMBFJ308 VDS =10V; ID =1A 1- 6.5V
PMBFJ309 VDS =10V; ID =1A 1- 4V
PMBFJ310 VDS =10V; ID =1A 2- 6.5V
NXP Semiconductors PMBFJ308; PMBFJ309; PMBFJ310
N-channel silicon field-effect transistors
2. Pinning information[1] Drain and source are interchangeable.
3. Ordering information
4. Marking[1] * = p: Made in Hong Kong.
* = t: Made in Malaysia.
* = W: Made in China.
IDSS drain current
PMBFJ308 VGS =0V; VDS =10V 12 - 60 mA
PMBFJ309 VGS =0V; VDS =10V 12 - 30 mA
PMBFJ310 VGS =0V; VDS =10V 24 - 60 mA
Ptot total power dissipation up to Tamb =25C --250 mW
yfs forward transfer admittance VDS =10V; ID=10 mA 10 --mS
Table 1. Quick reference data …continued
Table 2. Discrete pinning[1]
Table 3. Ordering informationPMBFJ308 - plastic surface mounted package; 3 leads SOT23
PMBFJ309
PMBFJ310
Table 4. MarkingPMBFJ308 48*
PMBFJ309 49*
PMBFJ310 50*
NXP Semiconductors PMBFJ308; PMBFJ309; PMBFJ310
N-channel silicon field-effect transistors
5. Limiting values
6. Thermal characteristics[1] Device mounted on an FR4 printed-circuit board.
Table 5. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).
VDS drain-source voltage (DC) - 25 V
VGSO gate-source voltage open drain - 25 V
VGDO gate-drain voltage open source - 25 V forward gate current (DC) - 50 mA
Ptot total power dissipation up to Tamb =25 C - 250 mW
Tstg storage temperature 65 +150 C junction temperature - 150 C
Table 6. Thermal characteristicsRth(j-a) thermal resistance from junction to ambient [1] 500 K/W
NXP Semiconductors PMBFJ308; PMBFJ309; PMBFJ310
N-channel silicon field-effect transistors
7. Static characteristics
8. Dynamic characteristics
Table 7. Static characteristics =25 C; unless otherwise specified.
V(BR)GSS gate-source breakdown voltage IG=1 A; VDS =0V 25- - V
VGSoff gate-source cut-off voltage V
PMBFJ308 ID =1 A; VDS =10V 1- 6.5V
PMBFJ309 ID =1 A; VDS =10V 1- 4V
PMBFJ310 ID =1 A; VDS =10V 2- 6.5V
VGSS gate-source forward voltage IG =1mA; VDS =0V - - 1 V
IDSS drain-source leakage current
PMBFJ308 VGS =0V; VDS =10V 12 - 60 mA
PMBFJ309 VGS =0V; VDS =10V 12 - 30 mA
PMBFJ310 VGS =0V; VDS =10V 24 - 60 mA
IGSS gate-source leakage current VGS= 15 V; VDS =0V - - 1nA
RDSon drain-source on-state resistance VGS =0V; VDS =100 mV - 50 -
yfs forward transfer admittance ID =10mA; VDS =10V 10 - - mS
yos common source output admittance ID =10mA; VDS =10V - - 250 S
Table 8. Dynamic characteristicsTj = 25 C; unless otherwise specified.
Ciss input capacitance VDS =10V
VGS= 10 V; f=1 MHz - 3 5 pF
VGS =0V; Tamb =25 C- 6 - pF
Crss reverse transfer capacitance VDS =0V; VGS= 10 V; f=1 MHz - 1.3 2.5 pF
gis input conductance VDS =10V; ID =10mA= 100 MHz - 200 - S= 450 MHz -3 -mS
gfs transfer conductance VDS =10V; ID =10mA
f=100MHz - 13 - mS
f=450MHz - 12 - mS
grs reverse conductance VDS =10V; ID =10mA
f=100MHz - 30 - S
f=450MHz - 450- S
gos output conductance VDS =10V; ID =10mA= 100 MHz - 150 - S= 450 MHz - 400 - S equivalent input noise voltage VDS =10V; ID =10mA; f=100Hz - 6 - nV/Hz
NXP Semiconductors PMBFJ308; PMBFJ309; PMBFJ310
N-channel silicon field-effect transistorsNXP Semiconductors PMBFJ308; PMBFJ309; PMBFJ310
N-channel silicon field-effect transistorsNXP Semiconductors PMBFJ308; PMBFJ309; PMBFJ310
N-channel silicon field-effect transistors