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PDTC143XENXP/PHILIPSN/a7200avaiNPN resistor-equipped transistors; R1 = 4.7 k惟, R2 = 10 k惟
PDTC143XTNXPN/a3000avaiNPN resistor-equipped transistors; R1 = 4.7 k惟, R2 = 10 k惟


PDTC143XE ,NPN resistor-equipped transistors; R1 = 4.7 k惟, R2 = 10 k惟Features and benefits  100 mA output current capability Reduces component count Built-in bias re ..
PDTC143XK ,R1 = 4.7 kOhm, R2 = 10 kOhm
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PDTC143XE-PDTC143XT
NPN resistor-equipped transistors; R1 = 4.7 k惟, R2 = 10 k惟
1. Product profile
1.1 General description

NPN Resistor-Equipped Transistor (RET) family in Surface-Mounted Device (SMD)
plastic packages.
1.2 Features and benefits

1.3 Applications

1.4 Quick reference data

PDTC143X series
NPN resistor-equipped transistors;
R1 = 4.7 k, R2 = 10 k
Rev. 11 — 9 December 2011 Product data sheet
Table 1. Product overview

PDTC143XE SOT416 SC-75 - PDTA143XE ultra small
PDTC143XM SOT883 SC-101 - PDTA143XM leadless ultra small
PDTC143XT SOT23 - TO-236AB PDTA143XT small
PDTC143XU SOT323 SC-70 - PDTA143XU very small 100 mA output current capability  Reduces component count Built-in bias resistors  Reduces pick and place costs Simplifies circuit design  AEC-Q101 qualified Digital applications in automotive and
industrial segments Cost-saving alternative for BC847/857
series in digital applications Control of IC inputs  Switching loads
Table 2. Quick reference data

VCEO collector-emitter voltage open base - - 50 V output current - - 100 mA bias resistor 1 (input) 3.3 4.7 6.1 k
R2/R1 bias resistor ratio 1.7 2.1 2.6
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
2. Pinning information

3. Ordering information

4. Marking

[1] * = placeholder for manufacturing site code
Table 3. Pinning
SOT23; SOT323; SOT416
SOT883
Table 4. Ordering information

PDTC143XE SC-75 plastic surface-mounted package; 3 leads SOT416
PDTC143XM SC-101 leadless ultra small plastic package; 3 solder lands;
body 1.0 0.6 0.5 mm
SOT883
PDTC143XT - plastic surface-mounted package; 3 leads SOT23
PDTC143XU SC-70 plastic surface-mounted package; 3 leads SOT323
Table 5. Marking codes

PDTC143XE 34
PDTC143XM E2
PDTC143XT *32
PDTC143XU *53
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
5. Limiting values

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 70 m copper strip line, standard footprint.
Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
VCBO collector-base voltage open emitter - 50 V
VCEO collector-emitter voltage open base - 50 V
VEBO emitter-base voltage open collector - 7 V input voltage
positive - +20 V
negative - 7V output current - 100 mA
ICM peak collector current single pulse;  1ms
-100 mA
Ptot total power dissipation Tamb25C
PDTC143XE (SOT416) [1][2] -150 mW
PDTC143XM (SOT883) [2][3] -250 mW
PDTC143XT (SOT23) [1] -250 mW
PDTC143XU (SOT323) [1] -200 mW junction temperature - 150 C
Tamb ambient temperature 65 +150 C
Tstg storage temperature 65 +150 C
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k

6. Thermal characteristics

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 70 m copper strip line, standard footprint.
Table 7. Thermal characteristics

Rth(j-a) thermal resistance from junction
to ambient
in free air
PDTC143XE (SOT416) [1][2] -- 830 K/W
PDTC143XM (SOT883) [2][3] -- 500 K/W
PDTC143XT (SOT23) [1] -- 500 K/W
PDTC143XU (SOT323) [1] -- 625 K/W
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k

NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
7. Characteristics

[1] Characteristics of built-in transistor
Table 8. Characteristics

Tamb =25 C unless otherwise specified.
ICBO collector-base cut-off
current
VCB =50V; IE=0A - - 100 nA
ICEO collector-emitter
cut-off current
VCE =30V; IB =0A - - 1 A
VCE =30V; IB =0A; = 150C 5 A
IEBO emitter-base cut-off
current
VEB =5V; IC =0A - - 600 A
hFE DC current gain VCE =5V; IC =10 mA 50 - -
VCEsat collector-emitter
saturation voltage =10mA; IB =0.5 mA - - 100 mV
VI(off) off-state input voltage VCE =5V; IC =100 A- 0.9 0.3 V
VI(on) on-state input voltage VCE= 0.3 V; IC =20mA 2.5 1.5 - V bias resistor 1 (input) 3.3 4.7 6.1 k
R2/R1 bias resistor ratio 1.7 2.1 2.6 collector capacitance VCB =10V; IE =ie =0A; 1MHz 2.5 pF transition frequency VCE =5V; IC =10 mA; = 100 MHz
[1] -230 -MHz
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k

NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
8. Test information
8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
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