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PBSS5350DNXPN/a56450avai50 V, 3 A PNP low VCEsat (BISS) transistor


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PBSS5350D
50 V, 3 A PNP low VCEsat (BISS) transistor
Product profile1.1 General description
PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a small
SOT457 (SC-74) Surface-Mounted Device (SMD) plastic package.
NPN complement: PBSS4350D
1.2 Features and benefits
Low collector-emitter saturation
voltage VCEsat High current capability High efficiency due to less heat
generation AEC-Q101 qualified Smaller Printed-Circuit Board (PCB)
area than for conventional transistors
1.3 Applications
Supply line switching circuits Battery management applications DC-to-DC conversion
1.4 Quick reference data

PBSS5350D
50 V, 3 A PNP low VCEsat (BISS) transistor
Rev. 6 — 28 June 2011 Product data sheet
Table 1. Quick reference data

VCEO collector-emitter
voltage
open base - - -50 V collector current - - -3 A
ICM peak collector current - - -5 A
RCEsat collector-emitter
saturation resistance =-2A; IB= -200 mA; pulsed; ≤ 300 µs; δ≤ 0.02 ; Tamb =25°C 120 150 mΩ
NXP Semiconductors PBSS5350D
50 V, 3 A PNP low VCEsat (BISS) transistor Pinning information
Ordering information Marking
Table 2. Pinning information
Table 3. Ordering information

PBSS5350D TSOP6 plastic surface-mounted package (TSOP6); 6 leads SOT457
Table 4. Marking codes

PBSS5350D 53
NXP Semiconductors PBSS5350D
50 V, 3 A PNP low VCEsat (BISS) transistor Limiting values

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
[3] Device mounted on an FR4 4-layer PCB. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
VCBO collector-base voltage open emitter - -60 V
VCEO collector-emitter voltage open base - -50 V
VEBO emitter-base voltage open collector - -6 V collector current - -3 A
ICM peak collector current - -5 A
IBM peak base current - -1 A
Ptot total power dissipation Tamb≤25°C [1] - 600 mW
[2] - 750 mW
[3] - 1200 mW junction temperature - 150 °C
Tamb ambient temperature -65 150 °C
Tstg storage temperature -65 150 °C
Table 6. Thermal characteristics

Rth(j-a) thermal resistance
from junction to
ambient
in free air [1] - - 208 K/W
[2] - - 160 K/W
pulsed; tp ≤ 50 ms; δ ≤ 0.5.; in free air [2] - - 100 K/W
NXP Semiconductors PBSS5350D
50 V, 3 A PNP low VCEsat (BISS) transistor Characteristics
Table 7. Characteristics
ICBO collector-base cut-off
current
VCB =-50 V; IE =0 A; Tamb=25°C - - -100 nA
VCB =-50 V; IE =0 A; Tj= 150°C - - -50 µA
IEBO emitter-base cut-off
current
VEB =-5V; IC =0A; Tamb=25°C - - -100 nA
hFE DC current gain VCE =-2V; IC =-500mA; Tamb=25°C 200 - -
VCE =-2V; IC =-1A; pulsed; ≤ 300 µs; δ≤ 0.02 ; Tamb =25°C
200 - -
VCE =-2V; IC =-2A; pulsed; ≤ 300 µs; δ≤ 0.02 ; Tamb =25°C
100 - -
VCEsat collector-emitter
saturation voltage =-500mA; IB =-50 mA; Tamb=25°C ---100 mV =-1A; IB =-50 mA; Tamb=25°C ---180 mV =-2A; IB= -200 mA; pulsed; ≤ 300 µs; δ≤ 0.02 ; Tamb =25°C
---300 mV
RCEsat collector-emitter
saturation resistance 120 150 mΩ
VBEsat base-emitter saturation
voltage
---1.2 V
VBEon base-emitter turn-on
voltage
VCE =-2V; IC =-1A; pulsed; ≤ 300 µs; δ≤ 0.02 ; Tamb =25°C
---1.1 V transition frequency VCE =-5V; IC =-100mA; f=100MHz;
Tamb =25°C
100 - - MHz collector capacitance VCB =-10 V; IE =0 A; ie =0A;
f=1MHz; Tamb =25°C
--40 pF
NXP Semiconductors PBSS5350D
50 V, 3 A PNP low VCEsat (BISS) transistor

NXP Semiconductors PBSS5350D
50 V, 3 A PNP low VCEsat (BISS) transistor
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