NZQA5V6XV5T1 ,Quad TVS array in SOT553FeaturesSOT-553CASE 463B• SOT-553 Package Allows Four Separate UnidirectionalPLASTICConfigurations• ..
NZQA6V8AXV5T1 ,Low Capacitance Quad TVS Array in SOT553Features• ESD Protection: IEC61000−4−2: Level 4ESD Protection: MILSTD 883C − Method 3015−6: Class 3 ..
NZT44H8 ,NPN Power AmplifierD44H8 / NZT44H8Discrete POWER & SignalTechnologiesD44H8 NZT44H8CEBC CEBTO-220SOT-223NPN Power Ampli ..
NZT560 ,NPN Low Saturation TransistorNZT560/NZT560ANZT560/NZT560ANPN Low Saturation Transistor4• These devices are designed with high cu ..
NZT560A ,NPN Low Saturation Transistorapplications involving pulsed or low duty cycle operations.
NZT560A ,NPN Low Saturation TransistorNZT560/NZT560ANZT560/NZT560ANPN Low Saturation Transistor4• These devices are designed with high cu ..
P0300EAL , TO-92 SIDACtor solid state protection devices protect telecommunications equipment such
P0300EAL , TO-92 SIDACtor solid state protection devices protect telecommunications equipment such
P0300EAL , TO-92 SIDACtor solid state protection devices protect telecommunications equipment such
P0300ECL , SIDACtor® Device
P0300ECL , SIDACtor® Device
P0300ECL , SIDACtor® Device
NZQA5V6XV5T1
Quad TVS array in SOT553
NZQA5V6XV5T1 Series
Quad Array for
ESD Protection
This quad monolithic silicon voltage suppressor is designed for
applications requiring transient overvoltage protection capability. It is
intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems,
medical equipment, and other applications. Its quad junction common
anode design protects four separate lines using only one package.
These devices are ideal for situations where board space is at a
premium.
Specification Features SOT-553 Package Allows Four Separate Unidirectional
Configurations Low Leakage < 1 �A @ 3 Volt for NZQA5V6XV5T1 Breakdown V oltage: 5.6 Volt - 6.8 Volt @ 1 mA ESD Protection Meeting IEC61000-4-2 - Level 4
Mechanical Characteristics Void Free, Transfer-Molded, Thermosetting Plastic Case Corrosion Resistant Finish, Easily Solderable Package Designed for Optimal Automated Board Assembly Small Package Size for High Density Applications 100% Lead Free, MSL1 @ 260°C Reflow Temperature
