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NZH3V0B-NZH3V3A-NZH3V9B-NZH6V2B
Single Zener diodes
Product profile1.1 General descriptionGeneral-purpose Zener diodes in a SOD123F small and flat lead Surface-Mounted
Device (SMD) plastic package.
1.2 Features
1.3 Applications General regulation functions
1.4 Quick reference data[1] Pulse test: tp≤ 300 μs; δ≤ 0.02.
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
cathode 1 cm2.
[3] Device mounted on a ceramic PCB, Al2O3, standard footprint.
NZH series
Single Zener diodes
Rev. 01 — 27 January 2010 Product data sheet Total power dissipation: ≤ 500 mW Small plastic package suitable for
surface-mounted design Wide working voltage range Low differential resistance
Table 1. Quick reference data forward voltage IF =10mA [1] -- 0.9 V
Ptot total power dissipation Tamb≤25°C [2] -- 500 mW
[3] -- 1 W
NXP Semiconductors NZH series
Single Zener diodes Pinning information[1] The marking bar indicates the cathode.
Ordering information[1] The series consists of 25 types with nominal working voltages from 3.0 V to 30V.
Marking
Table 2. Pinning cathode [1] anode
Table 3. Ordering informationNZH3V0B to
NZH30C[1] - plastic surface-mounted package; 2 leads SOD123F
Table 4. Marking codes
NXP Semiconductors NZH series
Single Zener diodes Limiting values[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[2] Device mounted on a ceramic PCB, Al2O3, standard footprint.
Thermal characteristics[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[2] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[3] Soldering point of cathode tab.
Characteristics[1] Pulse test: tp≤ 300 μs; δ≤ 0.02.
Table 5. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134). forward current - 250 mA
Ptot total power dissipation Tamb≤25°C [1] -500 mW
[2] -1 W junction temperature - 150 °C
Tamb ambient temperature −55 +150 °C
Tstg storage temperature −65 +150 °C
Table 6. Thermal characteristicsRth(j-a) thermal resistance from
junction to ambient
in free air [1]- - 250 K/W
[2]- - 125 K/W
Rth(j-sp) thermal resistance from
junction to solder point
[3] --70 K/W
Table 7. Characteristics =25 °C unless otherwise specified. forward voltage IF =10mA [1] --0.9 V
Table 8. Characteristics per type; NZH3V0B to NZH10C =25 °C unless otherwise specified.
3V0B 2.85 3.15 1000 80 50 1 450
3V3A 3.16 3.38 1000 70 20 1 450
3V6B 3.42 3.78 1000 60 5 1 450
3V9B 3.71 4.10 1000 50 5 1 450
NXP Semiconductors NZH series
Single Zener diodes[1]f=1 MHz; VR =0V
[1]f=1 MHz; VR =0V
[1]f=1 MHz; VR =0V
4V3B 4.17 4.43 1000 40 5 1 450
4V7B 4.55 4.80 900 25 5 1 300
5V1B 4.94 5.20 800 20 5 1.5 300
5V6B 5.45 5.73 500 13 5 2.5 300
6V2B 5.96 6.27 300 10 5 3 200
6V8B 6.49 6.83 150 8 2 3.5 200
7V5C 7.29 7.67 120 8 0.5 4 150
8V2B 8.02 8.36 120 8 0.5 5 150
9V1B 8.85 9.23 120 8 0.5 6 150
10C 9.70 10.20 120 8 0.2 7 90
Table 9. Characteristics per type; NZH11C to NZH20C =25 °C unless otherwise specified.
11C 10.82 11.38 120 10 0.04 8 85
12B 11.44 12.03 110 12 0.04 9 85
13B 12.35 13.65 110 14 0.04 10 80
15B 14.25 15.75 110 16 0.04 11 75
16C 15.69 16.51 150 18 0.04 12 75
18C 17.42 18.33 150 23 0.04 13 70
20C 19.23 20.22 200 28 0.04 15 60
Table 10. Characteristics per type; NZH22C to NZH30C =25 °C unless otherwise specified.
22C 21.08 22.17 200 30 0.04 17 60
24C 23.12 24.31 200 35 0.04 19 55
27C 25.63 26.95 250 45 0.04 21 50
30C 28.50 31.50 250 55 0.04 23 50
Table 8. Characteristics per type; NZH3V0B to NZH10C …continued =25 °C unless otherwise specified.
NXP Semiconductors NZH series
Single Zener diodesNXP Semiconductors NZH series
Single Zener diodes Package outline Packing information[1] For further information and the availability of packing methods, see Section13.
[2] The series consists of 25 types with nominal working voltages from 3.0 V to 30V.
10. Soldering
Table 11. Packing methodsThe indicated -xxx are the last three digits of the 12NC ordering code.[1]
NZH3V0B to
NZH30C[2] SOD123F 4 mm pitch, 8 mm tape and reel -115 -135
