NTGS5120P ,Power MOSFET, 60V PCh, TSOP6ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)JParameter Symbol Test Condition Mi ..
NTGS5120PT1G , Power MOSFET −60 V, −2.9 A, Single P−Channel, TSOP−6
NTHC5513T1 ,Power MOSFET 20 V, 3.1 A/-2.1A Complentary ChipFET™ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)JParameter Symbol N/P Test Conditions M ..
NTHC5513T1G ,Power MOSFET 20 V, 3.1 A/-2.1A Complentary ChipFET™ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)JParameter Symbol N/P Test Conditions M ..
NTHD2102PT1 ,Trench Power MOSFET 8.0 V, 3.4 A Dual P-Channel ChipFet™ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)JCharacteristic Symbol Test Condition M ..
NTHD2102PT1G ,Trench Power MOSFET 8.0 V, 3.4 A Dual P-Channel ChipFet™PremiumV R TYP I MAX• Low Profile (<1.1 mm) Allows it to Fit Easily into Extremely Thin (BR)DSS DS( ..
OUDH-SS-112D , 10 Amp Miniature, Sealed PC Board Relay
OV2640 , world smallest 2 megapixel CameraChip
OV2655 , high sensitivity 1/5-inch 2 megapixel CameraChip sensor
OV6680 , optimal low-light sensitivity and pixel performance for video conferencing cameras in 3G mobile phones
OV6680 , optimal low-light sensitivity and pixel performance for video conferencing cameras in 3G mobile phones
OV7411 , SINGLE-CHIP CMOS COLOR PAL CAMERA
NTGS5120P
Power MOSFET, 60V PCh, TSOP6
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)JParameter Symbol Test Condition Min Typ Max UnitOFF CHARACTERISTICSDrain−to−Source Breakdown Voltage V V = 0 V, I = −250 A−60 V(BR)DSS GS DZero Gate Voltage Drain Current I T = 25°C−1.0 ADSS V = 0 V, JGSV = −48 VDST = 125°C−5.0JV = 0 V, V = ±12 VGate−to−Source Leakage Current I 100 nADS GSGSSV = 0 V, V = ±20 V 200 nADS GSON CHARACTERISTICS (Note 5)Gate Threshold Voltage V V = V , I = −250 A−1.0−3.0 VGS(TH) GS DS DV = −10 V, I = −2.9 ADrain−to−Source On Resistance R 72 111 mGS DDS(on)V = −4.5 V, I = −2.5 A 88 142GS DForward Transconductance g V = −5.0 V, I = −6.0 A 10.1 SFS DS DCHARGES, CAPACITANCES AND GATE RESISTANCEInput Capacitance C 942 pFISSOutput Capacitance C V = 0 V, f = 1 MHz, V = −30 V 72OSS GS DSReverse Transfer Capacitance C 48RSSTotal Gate Charge Q 18.1 nCG(TOT)Threshold Gate Charge Q 1.2G(TH)V = −10 V, V = −30 V;GS DSI = −2.9 ADGate−to−Source Charge Q 2.7GSGate−to−Drain Charge Q 3.6GDSWITCHING CHARACTERISTICS (Note 6)Turn−On Delay Time t 8.7 nsd(ON)Rise Time t 4.9rV = −10 V, V = −30 V,GS DSI = −1.0 A, R = 6.0 D GTurn−Off Delay Time t 38d(OFF)Fall Time t 12.8fDRAIN−SOURCE DIODE CHARACTERISTICSForward Diode Voltage V V = 0 V, T = 25°C−0.75−1.0 VSD GS JI = −0.9 ASReverse Recovery Time t 18.3 nsRRV = 0 V, d /d = 100 A/s,GS IS tCharge Time t 15.5 nsaI = −0.9 ASReverse Recovery Charge Q 15.1 nCRR5. Pulse Test: pulse width 300 s, duty cycle 2%6. Switching characteristics are independent of operating junction temperatures