NTD14N03R ,Power MOSFET 14 A, 25 V N-Channel DPAKELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)JCharacteristics Symbol Min Typ Max ..
NTD15N06 ,Power MOSFET 15 Amps, 60 Volts3R , DRAIN−TO−SOURCE RESISTANCE R , DRAIN−TO−SOURCE RESISTANCE () I , DRAIN CURRENT (AMPS)DS(on) D ..
NTD15N06L ,Power MOSFET 15 Amps, 60 Volts, Logic Level N-Channel DPAKELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)JCharacteristic Symbol Min Typ Max Unit ..
NTD15N06L-001 ,Power MOSFET 15 Amps, 60 Volts, Logic Level N-Channel DPAK3R , DRAIN−TO−SOURCE RESISTANCE R , DRAIN−TO−SOURCE RESISTANCE () I , DRAIN CURRENT (AMPS)DS(on) D ..
NTD15N06LT4G ,Power MOSFET 15 Amps, 60 Volts, Logic Level N-Channel DPAKMAXIMUM RATINGS (T = 25°C unless otherwise noted)JRating Symbol Value UnitDrain−to−Source Voltage V ..
NTD18N06L ,Power MOSFET 18 Amps, 60 Volts, Logic Level N-Channel DPAK3R , DRAIN−TO−SOURCE RESISTANCE R , DRAIN−TO−SOURCE RESISTANCE () I , DRAIN CURRENT (AMPS)DS(on) D ..
OR2C26A-3PS208 , Field-Programmable Gate Arrays
OR2C26A-3PS240 , Field-Programmable Gate Arrays
OR2C40A-3PS208 , Field-Programmable Gate Arrays
OR2T04A-4T100 , Field-Programmable Gate Arrays
OR2T04A-4T144 , Field-Programmable Gate Arrays
OR2T04A-4T144 , Field-Programmable Gate Arrays
NTD12N10T4G
Power MOSFET 12 Amps, 100 Volts
3R DRAIN−TO−SOURCE RESISTANCE (NORMALIZED) R , DRAIN−TO−SOURCE RESISTANCE () I , DRAIN CURRENT (AMPS)DS(on), DS(on) DR , DRAIN−TO−SOURCE RESISTANCE ()DS(on)I , LEAKAGE (nA) I , DRAIN CURRENT (AMPS)DDSSNTD12N10POWER MOSFET SWITCHINGSwitching behavior is most easily modeled and predicted The capacitance (C ) is read from the capacitance curve atissby recognizing that the power MOSFET is charge a voltage corresponding to the off−state condition whencontrolled. The lengths of various switching intervals (t) calculating t and is read at a voltage corresponding to thed(on)are determined by how fast the FET input capacitance can on−state when calculating t .d(off)be charged by current from the generator. At high switching speeds, parasitic circuit elementscomplicate the analysis. The inductance of the MOSFETThe published capacitance data is difficult to use forsource lead, inside the package and in the circuit wiringcalculating rise and fall because drain−gate capacitancewhich is common to both the drain and gate current paths,varies greatly with applied voltage. Accordingly, gateproduces a voltage at the source which reduces the gate drivecharge data is used. In most cases, a satisfactory estimatecurrent. The voltage is determined by Ldi/dt, but since di/dtof average input current (I ) can be made from aG(AV)is a function of drain current, the mathematical solution isrudimentary analysis of the drive circuit so thatcomplex. The MOSFET output capacitance alsot = Q/IG(AV)complicates the mathematics. And finally, MOSFETs havefinite internal gate resistance which effectively adds to theDuring the rise and fall time interval when switching aresistance of the driving source, but the internal resistanceresistive load, V remains virtually constant at a levelGSknown as the plateau voltage, V . Therefore, rise and fall is difficult to measure and, consequently, is not specified.SGPtimes may be approximated by the following: The resistive switching time variation versus gateresistance (Figure 9) shows how typical switchingt = Q x R /(V − V )r 2 G GG GSPperformance is affected by the parasitic circuit elements. Ift = Q x R /Vf 2 G GSPthe parasitics were not present, the slope of the curves wouldmaintain a value of unity regardless of the switching speed.whereThe circuit used to obtain the data is constructed to minimizeV = the gate drive voltage, which varies from zero to VGG GGcommon inductance in the drain and gate circuit loops andR = the gate drive resistanceGis believed readily achievable with board mountedand Q and V are read from the gate charge curve.2 GSP components. Most power electronic loads are inductive; thedata in the figure is taken with a resistive load, whichDuring the turn−on and turn−off delay times, gate currentapproximates an optimally snubbed inductive load. Poweris not constant. The simplest calculation uses appropriateMOSFETs may be safely operated into an inductive load;values from the capacitance curves in a standard equationhowever, snubbing reduces switching losses.for voltage change in an RC network. The equations are:t = R C In [V /(V − V )]d(on) G iss GG GG GSPt = R C In (V /V )d(off) G iss GG GSP1000V = 0 V V = 0 VDS GST = 25°CJCiss800600CrssCiss400Coss200Crss010 5 0 5 10 15 20 25V VGS DSGATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE(VOLTS)Figure 7. Capacitance Variation
