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NCTOSHIBAN/a20avaiSeries Single Value Chip and Wire Capacitors


NC ,Series Single Value Chip and Wire Capacitors Revision 28-Mar-03 101NC SeriesVishay Electro-FilmsDC WORKING VOLTAGES VALUES AND TOLERANCESNCA 0.0 ..
NC2D-JP-DC12V , FLAT/VERTICAL TYPE HIGH POWER BIFURCATED CONTACT
NC2D-JP-DC5V , FLAT/VERTICAL TYPE HIGH POWER BIFURCATED CONTACT
NC2D-JP-DC5V , FLAT/VERTICAL TYPE HIGH POWER BIFURCATED CONTACT
NC2D-JPL2-DC12V , FLAT/VERTICAL TYPE HIGH POWER BIFURCATED CONTACT
NC2D-P-DC12V , FLAT/VERTICAL TYPE HIGH POWER BIFURCATED CONTACT
NJM2118 , MONAURAL MICROPHONE AMPLIFIER
NJM2118M , MONAURAL MICROPHONE AMPLIFIER
NJM2118V , MONAURAL MICROPHONE AMPLIFIER
NJM2119 , DUAL SINGLE-SUPPLY OPERATIONAL AMPLIFIER
NJM2120L , SWITCHING OPERATIONAL AMPLIFIER
NJM2121 , HIGH SPEED OPERATIONAL AMPLIFIER WITH SWITCH


NC
Series Single Value Chip and Wire Capacitors
NC Series
Vishay Electro-Films
Thin Film Single Value Chip and Wire Capacitors
FEATURES
Small size: 0.020 to 0.060 inches square Substrate: silicon with gold backing Dielectric: silicon dioxide/silicon nitride Capacitance range: 0.5pF to 1000pF
The NC series of thin film capacitors has the advantage of
increased performance and smaller size when compared with
its thick film counterparts. These chips are available in sizes
down to 20 mil square and in capacitances up to 1000pF.
Parts require epoxy or eutectic die attach to substrate and one
wire bond.
These chips are manufactured using Vishay Electro-Films (EFI)
sophisticated Thin Film equipment and manufacturing
technology. The NC’s are 100% electrically tested and visually
inspected to MIL-STD-883.
APPLICATIONS

The NC series of capacitor chips are designed for assembly in hybrid circuits using conventional wire-bonding techniques.
They provide excellent stability and performance, and their small size gives the hybrid designer greater layout flexibility.
They are available as MNOS or MOS capacitors. The MOS version is to be preferred when low dielectric absorption is
required.
ELECTRICAL SCHEMATIC
NCA/NCB/NCC
ELECTRICAL SCHEMATIC
NCD/NCE TOP BONDING PADS BACK OF CHIP

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