MX7534JCWP ,Microprocessor-Compatible / 14-Bit DACsELECTRICAL CHARACTERISTICS(V = +11.4V to +15.75V (Note 1), V = 10V, V = V = V = 0V, T = T to T , un ..
MX7534JP+ ,Microprocessor-Compatible, 14-Bit DACsFeaturesThe MX7534/MX7535 are high-performance, CMOS, ♦ 14-Bit Monotonic Over Full Temperature Rang ..
MX7534KN ,Microprocessor-Compatible / 14-Bit DACsGeneral Description ________
MX7534KN+ ,Microprocessor-Compatible, 14-Bit DACsGeneral Description ________
MX7534KP+ ,Microprocessor-Compatible, 14-Bit DACsFeaturesThe MX7534/MX7535 are high-performance, CMOS, ♦ 14-Bit Monotonic Over Full Temperature Rang ..
MX7535JN ,Microprocessor-Compatible / 14-Bit DACsFeaturesThe MX7534/MX7535 are high-performance, CMOS, ' 14-Bit Monotonic Over Full Temperature Rang ..
NDS356 ,P-Channel Logic Level Enhancement Mode Field Effect TransistorElectrical Characteristics (T = 25°C unless otherwise noted)ASymbol Parameter Conditions Min Typ Ma ..
NDS356P ,P-Channel Logic Level Enhancement Mode Field Effect Transistor
NDS7002 ,N-Channel Enhancement Mode Field Effect Transistorapplications.______________________________________________________________________________________ ..
NDS7002 ,N-Channel Enhancement Mode Field Effect TransistorElectrical Characteristics T = 25°C unless otherwise notedASymbol Parameter Conditions Type Min Typ ..
NDS8410A ,Single N-Channel Enhancement Mode Field Effect TransistorMarch 1997 NDS8410ASingle N-Channel Enhancement Mode Field Effect Transistor
NDS8410S ,Single N-Channel Enhancement Mode Field Effect TransistorELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)ASymbol Parameter Conditions Min Typ Ma ..
MX7534JCWP-MX7534KN-MX7535JN-MX7535KN-MX7535SQ
Microprocessor-Compatible / 14-Bit DACs
_______________General DescriptionThe MX7534/MX7535 are high-performance, CMOS,
monolithic, 14-bit digital-to-analog converters (DACs).
Wafer-level, laser-trimmed, thin-film resistors and tempera-
ture-compensated NMOS switches assure operation over
the full operating temperature range with exceptional lin-
ear and gain stability.
The MX7534 accepts right-justified data in two bytes from
an 8-bit bus, while the MX7535 operates with a 14-bit data
bus with separate MS-byte and LS-byte select controls. In
addition, all digital inputs are compatible with both TTL and
5V CMOS-logiclevels. The MX7534/MX7535 are intended
for unipolar operation, but may be operated as bipolar
DACs with additional external components. Both devices
are protected against CMOS latchup, and neither requires
the use of external Schottky protection diodes.
The MX7534 is available in 20-pin narrow (0.3") DIP, wide
SO, or PLCC packages. The MX7535 is available in
28-pin, 600 mil wide DIP, wide SO, or PLCCpackages.
________________________ApplicationsMachine and Motion Control Systems
Automatic Test Equipment
Digital Audio
µP-Controlled Calibration Circuitry
Programmable-Gain Amplifiers
Digitally Controlled Filters
Programmable Power Supplies
____________________________Features14-Bit Monotonic Over Full Temperature RangeFull 4-Quadrant MultiplicationµP-Compatible, Double-Buffered InputsExceptionally Low Gain Tempco (2.5ppm/°C)Low Output Leakage (<20nA)Over Temp.Low Power ConsumptionTTL and CMOSCompatible
______________Ordering Information
Ordering Information continued at end of data sheet.*Dice are tested at +25°C, DC parameters only.
MX7534/MX7535
Microprocessor-Compatible,
14-Bit DACs
________________________________________________________________Maxim Integrated Products1
_______________Functional Diagrams_________________Pin Configurations19-1116; Rev 1; 11/96
& the latest literature: http://,
MX7534/MX7535
Microprocessor-Compatible,
14-Bit DACs_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS(VDD= +11.4V to +15.75V (Note 1), VREF= 10V, VIOUT= VAGNDS= VSS= 0V, TA= TMINto TMAX, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDDto DGND............................................................-0.3V, +17V
VSSto AGND.............................................................-15V, +0.3V
REF to AGND (MX7534)......................................................±25V
REFS to AGND (MX7535)....................................................±25V
REFF to AGND (MX7535)....................................................±25V
RFB to AGND.......................................................................±25V
Digital Input Voltage to DGND.........................-0.3V, VDD+ 0.3V
IOUT to DGND.................................................-0.3V, VDD+ 0.3V
AGND to DGND...............................................-0.3V, VDD+ 0.3V
Continuous Power Dissipation (TA= +70°C)
20-Pin Plastic DIP(derate 11.11mW/°C above +70°C)....889mW
28-Pin Plastic DIP (derate 14.29mW/°C above +70°C)......1.14W
20-Pin SO(derate 10.00mW/°C above +70°C)..............800mW
28-Pin SO (derate 12.50mW/°C above +70°C).....................1W
20-Pin PLCC (derate 10.00mW/°C above +70°C).........800mW
28-Pin PLCC (derate 10.53mW/°C above +70°C).........842mW
20-Pin CERDIP (derate 11.11mW/°C above +70°C)......889mW
28-Pin CERDIP (derate 16.67mW/°C above +70°C)........1.33W
20-Pin Ceramic SB
(derate 11.76mW/°C above +70°C).............................941mW
28-Pin Ceramic SB
(derate 20.00mW/°C above +70°C)................................1.6W
Operating Temperature Ranges
MX753_J/K............................................................0°C to +70°C
MX753_A/B........................................................-25°C to +85°C
MX753_EW_.......................................................-40°C to +85°C
MX753_S/T.......................................................-55°C to +125°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10sec).............................+300°C
MX7534/MX7535
Microprocessor-Compatible,
14-Bit DACs
_______________________________________________________________________________________3
ELECTRICAL CHARACTERISTICS (continued)(VDD= +11.4V to +15.75V (Note 1), VREF= 10V, VIOUT= VAGNDS= VSS= 0V, TA= TMINto TMAX, unless otherwise noted.)
Note 1:Specifications are guaranteed for VDDof +11.4V to +15.75V. At VDD= +5V, device is still functional with degraded specifications.
Note 2:Guaranteed by design, not tested.
Note 3:Resistors have a typical -300ppm/°C tempco.
AC PERFORMANCE CHARACTERISTICS (Note 4)(VDD= +11.4V to +15.75V, VREF= 10V, VIOUT= VAGND(VAGNDSfor MX7535) = VSS= 0V, output amplifier is AD544*,= TMINto TMAX, unless otherwise noted.)
Note 4:These characteristics are included for design guidance only, and are not subject to test.
Note 5:Feedthrough can be further reduced by connecting the metal lid on the ceramic package to DGND.
* AD544 is an Analog Devices part.
MX7534/MX7535
Microprocessor-Compatible,
14-Bit DACs_______________________________________________________________________________________
TIMING CHARACTERISTICS (MX7534)(VDD= +11.4V to +15.75V, VREF= 10V, VIOUT= VAGND= VSS= 0V, TA= TMINto TMAX, unless otherwise noted. See Figure 1a for
timing diagram.)
TIMING CHARACTERISTICS (MX7535)(VDD= +11.4V to +15.75V, VREF= 10V, VIOUT= VAGNDS= VSS= 0V, TA= TMINto TMAX, unless otherwise noted. See Figure 1b for
timing diagram.)
MX7534/MX7535
Microprocessor-Compatible,
14-Bit DACs
_______________________________________________________________________________________5
__________Pin Description (MX7534)
__________Pin Description (MX7535)
MX7534/MX7535
_______________Detailed Description
Digital-to-Analog SectionThe basic MX7534/MX7535 digital-to-analog converter
(DAC) circuit consists of a laser-trimmed, thin-film,
11-bit R-2R resistor array, a 3-bit segmented resistor
array, and NMOS current switches, as shown in Figure
2. The three MSBs are decoded to drive switches A–G
of the segmented array, and the remaining bits drive
switches S0–S10 of the R-2R array.
Binary weighted currents are switched to either AGNDF
or IOUT, depending on the status of each input bit. The
R-2R ladder current is one-eighth of the total reference
input current. The remaining seven-eighths of the cur-
rent flows in the segmented resistors, dividing equally
among these seven resistors. The input resistance at
REF is constant; therefore, it can be driven by a voltage
or current source of positive or negative polarity.
The MX7534/MX7535 are optimized for unipolar output
operation (analog output from 0V to -VREF), although
bipolar operation (analog output from +VREFto -VREF) is
possible with some added external components.
Figure 3 shows the equivalent circuit for the two DACs.
COUTvaries from about 90pF to 180pF, depending on
the digital code. R0denotes the DAC’S equivalent out-
put resistance, which varies with the input code.
g(VREF,N) is the Thevenin equivalent voltage generator
due to the reference input voltage, VREF, and the trans-
fer function of the R-2R ladder, N.
Digital SectionAll digital inputs are both TTL and 5V CMOS logic compat-
ible. The digital inputs are protected from electrostatic dis-
charge (ESD) with typical input currents of less than 1nA.
To minimize power-supply currents, keep digital input volt-
ages as close to 0V and 5V logic levels as possible.
__________Applications Information
Unipolar Operation (2-Quadrant
Multiplication)Figures 4a and 4b show the circuit diagram for unipolar
binary operation. With an AC input, the circuit performs
2-quadrant multiplication. The code table for Figure 4 is
given in Table 2.
Capacitor C1 provides phase compensation and helps
prevent overshoot and ringing when high-speed op
amps are used. Note that the output polarity is the
inverse of the reference input.
Microprocessor-Compatible,
14-Bit DACs_______________________________________________________________________________________Figure 1a. MX7534 Timing DiagramFigure 1b. MX7535 Timing Diagram
MX7534/MX7535
Microprocessor-Compatible,
14-Bit DACs
_______________________________________________________________________________________7
Zero-Offset Adjustment
(Figures 4a and 4b)Load the DAC register with all 0s.Adjust the offset of amplifier A1 so that V0(see fig-
ure) is at a minimum (i.e., ≤30µV).
Gain Adjustment
(Figures 4a and 4b)Load the DAC register with all 1s.Trim potentiometer R1 so that VOUT= -VIN(16383)16384
In fixed-reference applications, adjust full scale by
omitting R1 and R2 and trimming the reference voltage
magnitude. In many applications, the excellent Gain
Tempco and Gain Error specifications eliminate the
need for gain adjustment. However, if trims are
required and the DAC is to operate over a wide temper-
ature range, use low-tempco (>300ppm/°C) resistors.
Bipolar Operation
(4-Quadrant Multiplication)Bipolar or 4-quadrant operation is shown in Figures 5a
and 5b. This configuration provides for offset binary
coding. Table 4 shows DAC codes and the corre-
sponding analog outputs for Figures 5a and 5b. With
the DAC loaded to 10 0000 0000 0000, either adjust R1
for VOUT= 0V, or omit R1 and R2 and adjust the ratio of
R5 and R6 for VOUT= 0V. Adjust the amplitude of VIN
or vary the value of R7 for full-scale trimming.
Resistors R5, R6, and R7 must be matched to 0.003%.
Mismatch of R5 and R6 causes both offset and full-
scale errors. For wide temperature range operation,
use resistors of the same material so that their tempera-
ture coefficients match and track.
Figure 2. Simplified Circuit Diagram
MX7534/MX7535
Grounding ConsiderationsSince IOUT and the output amplifier noninverting input
are sensitive to offset voltages, connect nodes that
must be grounded directly to a single-point ground
through a separate, very-low-resistance path. Note that
the output currents at IOUT and AGNDF vary with input
code and create code-dependent error if these termi-
nals are connected to ground (or a virtual ground)
through a resistive path.
To obtain high accuracy, it is important to use a proper
grounding technique. The two AGND pins (AGNDF‚
AGNDS) provide flexibility in this respect. In Figures 4a
and 4b, AGNDS and AGNDF are shorted together
externally and an extra op amp, A2, is not used.
Voltage-drops due to bond-wire resistance are not
compensated for in this circuit; this could create a lin-
earity error of approximately 0.1LSB due to bond-wire
resistance alone. This can be eliminated by using the
circuits shown in Figures 6a and 6b, where A2 main-
tains AGNDS at signal ground potential. By using
force/sense techniques, all switch contacts on the DAC
are kept at exactly the same potential, and any error
caused by bond-wire resistance is eliminated.
Figure 7 shows a remote voltage reference driving the
MX7535. Op amps A2 and A3 compensate for voltage
drops along the reference input line and analog
ground line.
Figure 8 shows a printed circuit board (PCB) layout with
a single output amplifier for the MX7534. The input to
REF (Pin 1) is shielded to reduce AC feedthrough, while
the digital inputs are shielded to minimize digital
feedthrough. The traces connecting IOUT and AGNDS
to the inverting and noninverting op amp inputs are
kept as short as possible. Gain trim components, R3
and R4, are omitted.
Zero-Offset Adjustment
(Figures 6a and 6b)Load DAC register with all 0s.Adjust offset of amplifier A2 for minimum potential at
AGNDS. This potential should be ≤30µV with respect
to signal ground.Adjust A1’s offset so that VOUTis at a minimum
(i.e., ≤30µV).
Microprocessor-Compatible,
14-Bit DACs_______________________________________________________________________________________
