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MUN2212T1MOTOROALN/a15000avaiNPN SILICON BIAS RESISTOR TRANSISTOR
MUN2213T1N/a6000avaiBias Resistor Transistor
MUN2214T1MOTON/a15322avaiBias Resistor Transistor
MUN2216T1MOTN/a2903avaiBias Resistor Transistor


MUN2214T1 ,Bias Resistor Transistorhttp://onsemi.com3MUN2211T1 Series
MUN2214T1 ,Bias Resistor TransistorMAXIMUM RATINGS (T = 25°C unless otherwise noted)ARating Symbol Value UnitCollector–Base Voltage V ..
MUN2215T1 ,NPN SILICON BIAS RESISTOR TRANSISTORhttp://onsemi.comTransistor) contains a single transistor with a monolithic bias networkconsisting ..
MUN2215T1G , Digital Transistors (BRT) R1 = 10 k, R2 =  k
MUN2216 ,Bias Resistor Transistorhttp://onsemi.comTransistor) contains a single transistor with a monolithic bias networkconsisting ..
MUN2216T1 ,Bias Resistor TransistorMUN2211T1 SeriesPreferred DevicesBias Resistor TransistorsNPN Silicon Surface Mount Transistorswith ..
NC2D-JP-DC12V , FLAT/VERTICAL TYPE HIGH POWER BIFURCATED CONTACT
NC2D-JP-DC5V , FLAT/VERTICAL TYPE HIGH POWER BIFURCATED CONTACT
NC2D-JP-DC5V , FLAT/VERTICAL TYPE HIGH POWER BIFURCATED CONTACT
NC2D-JPL2-DC12V , FLAT/VERTICAL TYPE HIGH POWER BIFURCATED CONTACT
NC2D-P-DC12V , FLAT/VERTICAL TYPE HIGH POWER BIFURCATED CONTACT
NC2D-P-DC12V , FLAT/VERTICAL TYPE HIGH POWER BIFURCATED CONTACT


MUN2212T1-MUN2213T1-MUN2214T1-MUN2216T1
NPN SILICON BIAS RESISTOR TRANSISTOR
PIN3
COLLECTOR
(OUTPUT)
PIN1
EMITTER
(GROUND)
PIN2
BASE
(INPUT) --
NPN Silicon Surface Mount Transistor with
Monolithic Bias Resistor Network

This new series of digital transistors is designed to replace a single device and its
external resistor bias network. The BRT (Bias Resistor Transistor) contains a single
transistor with a monolithic bias network consisting of two resistors; a series base
resistor and a base–emitter resistor. The BRT eliminates these individual components
by integrating them into a single device. The use of a BRT can reduce both system
cost and board space. The device is housed in the SC–59 package which is designed
for low power surface mount applications. Simplifies Circuit Design Reduces Board Space Reduces Component Count The SC–59 package can be soldered using wave or reflow.
The modified gull–winged leads absorb thermal stress during
soldering eliminating the possibility of damage to the die. Available in 8 mm embossed tape and reel
Use the Device Number to order the 7 inch/3000 unit reel.
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
THERMAL CHARACTERISTICS
DEVICE MARKING AND RESISTOR VALUES
Device mounted on a FR–4 glass epoxy printed circuit board using the minimum recommended footprint. New devices. Updated curves to follow in subsequent data sheets.
Thermal Clad is a trademark of the Bergquist Company
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