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MP34DT01TR
MEMS audio sensor omnidirectional stereo digital microphone
June 2013 DocID022331 Rev 11 1/20
MP34DT01MEMS audio sensor omnidirectional digital microphone
Datasheet - production data
Features Single supply voltage Low power consumption 120 dBSPL acoustic overload point 63 dB signal-to-noise ratio Omnidirectional sensitivity –26 dBFS sensitivity PDM output HCLGA package Top-port design SMD-compliant EMI-shielded
–ECOPACK®, RoHS, and “Green” compliant
Applications Mobile terminals Laptop and notebook computers Portable media players VoIP Speech recognition A/V eLearning devices Gaming and virtual reality input devices Digital still and video cameras Antitheft systems
DescriptionThe MP34DT01 is an ultra-compact, low-power,
omnidirectional, digital MEMS microphone built
with a capacitive sensing element and an IC
interface.
The sensing element, capable of detecting
acoustic waves, is manufactured using a
specialized silicon micromachining process
dedicated to produce audio sensors.
The IC interface is manufactured using a CMOS
process that allows designing a dedicated circuit
able to provide a digital signal externally in PDM
format.
The MP34DT01 has an acoustic overload point of
120 dBSPL with a 63 dB signal-to-noise ratio and
–26 dBFS sensitivity.
The MP34DT01 is available in a top-port, SMD-
compliant, EMI-shielded package and is
guaranteed to operate over an extended
temperature range from -40 °C to +85 °C.
Table 1. Device summary
Contents MP34DT012/20 DocID022331 Rev 11
Contents Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Acoustic and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 62.1 Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Carrier tape mechanical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Process recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147.1 L/R channel selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
DocID022331 Rev 11 3/20
MP34DT01 List of tables
List of tables
Table 1. Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Distortion specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 5. Timing characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 6. Frequency response mask for digital microphones . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 7. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 8. L/R channel selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 9. Recommended soldering profile limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 10. HCLGA (3 x 4 x 1 mm) 4-lead package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 11. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
List of figures MP34DT01
4/20 DocID022331 Rev 11
List of figures
Figure 1. Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Timing waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 3. Frequency response and mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 4. Carrier tape without microphone-top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 5. Carrier tape with microphone-top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 6. Recommended picking area. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 7. Recommended picker design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 8. Recommended soldering profile limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 9. HCLGA (3 x 4 x 1 mm) 4-lead package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 10. Land pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
DocID022331 Rev 11 5/20
MP34DT01 Pin description
1 Pin description
Figure 1. Pin connections
Table 2. Pin description
