MOC8020 ,6-Pin DIP Optoisolators Darlington Ouput(No Base Connection)**Order this documentSEMICONDUCTOR TECHNICAL DATA by MOC8020/D*GlobalOptoisolator[CTR = 500% Min]* ..
MOC8020300 ,6-Pin DIP Photodarlington Output OptocouplerAPPLICATIONS MIN0.100 (2.54)ANODE 1 6 N/C Appliances, measuring instruments0.016 (0.40)0.008 (0.20 ..
MOC8020300W ,6-Pin DIP Photodarlington Output OptocouplerPHOTODARLINGTON OPTOCOUPLERS (NO BASE CONNECTION)MOC8020 MOC8021DESCRIPTIONPACKAGE DIMENSIONSThe M ..
MOC80203S ,6-Pin DIP Photodarlington Output OptocouplerFEATURES• High current transfer ratio 6-500% (MOC8020) 0.350 (8.89)0.330 (8.38)-1000% (MOC8021)0.07 ..
MOC80203SD ,6-Pin DIP Photodarlington Output OptocouplerAPPLICATIONS MIN0.100 (2.54)ANODE 1 6 N/C Appliances, measuring instruments0.016 (0.40)0.008 (0.20 ..
MOC8021 ,5V; 60mA non base optically coupled isolator photodarlington outputMAXIMUM RATINGS (T = 25°C unless otherwise noted)A34Rating Symbol Value UnitINPUT LEDPIN 1. LED ANO ..
MSM41256A-12 , 262,144-WORD x 1-BIT DYNAMIC RAM
MSM5105 , MOBILE STATION MODEM, 3G CDMA Enabling Chipset (Pin compatible with the MSM3100 in a 208 FBGA package)
MSM5105 , MOBILE STATION MODEM, 3G CDMA Enabling Chipset (Pin compatible with the MSM3100 in a 208 FBGA package)
MSM5105 , MOBILE STATION MODEM, 3G CDMA Enabling Chipset (Pin compatible with the MSM3100 in a 208 FBGA package)
MSM-5105 , MOBILE STATION MODEM, 3G CDMA Enabling Chipset (Pin compatible with the MSM3100 in a 208 FBGA package)
MSM511000C-60JS , 1,048,576-Word x 1-Bit DYNAMIC RAM : FAST PAGE MODE TYPE
MOC70P3
PHOTOTRANSISTOR OPTICAL INTERRUPTER SWITCH
MOC70P1 / MOC70P2 / MOC70P3 PHOTOTRANSISTOR OPTICAL INTERRUPTER SWITCH PACKAGE DIMENSIONS DESCRIPTION 0.510 [12.95] The MOC70PX consists of an infrared light emitting diode coupled to an 0.250 [6.35] NPN silicon phototransistor packaged into an injection molded housing. The housing is designed for wide gap, non 0.506 [12.85] contact sensing. 0.200 [5.08] NOM 0.080 [2.03] NOM 0.153 [3.89] 2X FEATURES C L 0.270 [6.86] No contact sensing SCHEMATIC 5 mm gap 0.050 [1.27] 14 .040” aperture SEATING PLANE 0.140 [3.56] 0.105 [2.67] Low profile 0.020 [0.51] 4 X PCB mount 0.380 [9.65] Transistor output PIN 3 (COLLECTOR) PIN 2 CATHODE 2 3 0.100 [2.54] NOTES PIN 1 (ANODE) PIN 4 (EMITTER) 1. Derate power dissipation linearly, on each component, 1.67 mW/°C above 25°C. 2. RMA flux is recommended. NOTES: 1. Dimensions for all drawings are in inches (millimeters). 3. Methanol or isopropyl alcohols are recommended as 2. Tolerance of ± .010 (.25) on all non-nominal dimensions cleaning agents. 4. Soldering iron tip 1/16” (1.6mm) from housing. unless otherwise specified. 5. As long as leads are not under any stress or spring tension. (T = 25°C unless otherwise specified) ABSOLUTE MAXIMUM RATINGS A Parameter Symbol Rating Units Operating Temperature T -55 to +100 °C OPR Storage Temperature T -55 to +100 °C STG (2,3,4,5) Soldering Temperature (Iron) T 240 for 5 sec °C SOL-I (2,3,5) Soldering Temperature (Flow) T 260 for 10 sec °C SOL-F EMITTER Continuous Forward Current I 50 mA F Reverse Voltage V 6V R (1) Power Dissipation P 100 mW D SENSOR Collector-Emitter Voltage V 30 V CEO Emitter-Collector Voltage V 4.5 V ECO Collector Current I 20 mA C (1) Power Dissipation P 150 mW D 2001 DS300009 4/25/01 1 OF 5
