MC74VHC1GU04DFT2 ,Single Inverter Unbuffered
MC74VHC1GU04DTT1 ,Single Inverter Unbufferedmany other applications requiring a high−input impedance amplifier.For digital applications, the MC ..
MC74VHC240DT ,Octal Bus Buffer/Line DriverELECTRICAL CHARACTERISTICSÎÎT = 25°C T = – 40 to 85°CA AV VCC CCÎÎÎÎSb Symboll Parameter P T Test C ..
MC74VHC240DT ,Octal Bus Buffer/Line Driver**SEMICONDUCTOR TECHNICAL DATA**"** *#! *# ** * *$* $* " %*"* "*"* *#"*#"!The MC74VHC240 is an adva ..
MC74VHC240DTR2 ,Octal 3-State DriverMAXIMUM RATINGS*ÎÎÎÎÎÎ Symbol ParameterÎÎÎÎÎ ValueÎÎÎ UnitThis device contains protectioncircuitry ..
MC74VHC240DWR2 ,Octal 3-State DriverELECTRICAL CHARACTERISTICS (Input t = t = 3.0ns)r fÎT = 25°C T = – 40 to 85°CA AÎÎMin Typ Max Min M ..
MDS213CG , 12-Port 10/100Mbps 1Gbps Ethernet Switch
MDS35-800 ,DIODE / SCR MODULEapplications,ISOTOP®using phase controlled bridges, such as soft-startcircuits, welding equipment, ..
MDS50-1200 ,DIODE / SCR MODULEFEATURES:Symbol Value UnitI50-70-85 AT(RMS)V /V800 and 1200 VDRM RRMI 50 and 100 mAGTDESCRIPTIONPac ..
MDS50-800 ,DIODE / SCR MODULEMDS35/50 /80SeriesDIODE / SCR MODULEMAIN
MDS80-800 ,DIODE / SCR MODULEapplications,ISOTOP®using phase controlled bridges, such as soft-startcircuits, welding equipment, ..
MDT10P22A2K , 8-bit micro-controller
MC74VHC1G66-MC74VHC1GT50-MC74VHC1GT50DF2G-MC74VHC1GT50DTT1-MC74VHC1GU04DF1G-MC74VHC1GU04DFT2
Single SPST Analog Switch
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Prepared By: Fred Zlotnick, Strategic MarketingJess Diaz, Market Development
Standard Logic Business Unit
INTRODUCTIONOne–Gate logic devices have been in use for several years,
and are nothing more than single–gate derivatives of their
multi–gate cousins. Initial offerings were pioneered in Japan,
to help solve particular problems the design community had
encountered. Earlier, traditional ICs were packaged in 14 and
16 pin Dual–in–line Packages (DIPs), and the goal of the IC
manufacturer was to get as much functionality as possible
into a single–package device. Double, triple, quadruple, and
quintuple versions of simple logic functions became the
norm. The enormously successful 7400–TTL/LS logic
family of standard bipolar logic IC’s became the industry
standard for nearly 20 years. Ceramic, and later plastic, dip
packages became a staple item for logic designers. New,
Small–Outline–Integrated–Circuit (SOIC) packages began to
replace DIPs as packaging technologies evolved.
As CMOS process technologies emerged and began to
gain popularity, the 4000 series CMOS family also followed
industry trends. The 4000 series, was not only a low power
family, but was also low speed. Improvements in CMOS
technology accelerated process development efforts. The
resulting products were faster than older bipolar families,
and have become standards within the design community.
These newer product families tended to be offered only in
SOIC and smaller packages. The result of all the
improvements in CMOS technology is that the older bipolar
families are now rarely used, except for legacy designs.
Families such as VHC now offer lower power, and higher
speed and drive capabilities than LSTTL, at the same or
lower cost.
The Japanese electronics industry is responsible for the
majority of the world’s consumer electronics designs. One
trend in this area has been to get as much function into as
small a space as possible, while conserving power. Owing to
the huge number of units consumed, Japanese designers rely
on techniques different from that of the rest of the world. To
turn new designs quickly, Japanese circuit designers created
an infrastructure to support rapid design of moderate sized
gate arrays, as well as Application Specific Standard
Products (ASSP). Previously designed gate arrays or ASSPs
often needed one bit of buffering, logic, or switching in order
to make the circuit usable in a new system design. Often
there was not enough room to add an additional
element on the chip and still keep the board size small. The
designer was faced with having to re–design the entire chip
or to add additional IC components to the board layout to
accomplish the required task.
A solution to this dilemma was to use One–Gate designs,
initially offered in the SOT–23, 5–pin package, and later in
the even smaller SOT–353 (SC88A). The latter package
takes up only 4.2 mm2 of board space, and less than the area
of a TSSOP–20 pin device. One–Gate products, now
fabricated in a .6μ advanced high–speed CMOS technology,
are very fast, with < 4 nsecs gate delays, and enough drive
(8 mA) to support most typical applications. The package is
so small, that it fits “in–line” with the trace that it is mounted
on. The One–Gate device is performing only one function at
a time. Because One–Gates can be mounted right where
they are needed, additional direct benefits to the design are
lower “ground bounce” effects, smaller number of
de–coupling component requirements, shorter signal
routing lines, and a significant reduction in overall board
space.
One–Gate products are beginning to be universally
recognized for the value they bring to a design. The design
may be a consumer oriented portable product, or a larger
computing system such as a workstation. The benefits of
improved routing, reduced cross–talk effects,
system signals, and elimination of previously required
signal “clean–up components”, are recognized as extremely
important to overall system performance, and the use of
One–Gate devices is expected to increase dramatically in the
future.
