MBRS2040LT3 ,Surface Mount Schottky Power Rectifier(SMB Power Surface Mount Package)Features epitaxial construction with oxide passivation and metal2.0 AMPERESoverlay contact. Ideally ..
MBRS2040LT3G ,Surface Mount Schottky Power Rectifier3I , AVERAGE FORWARD CURRENT (AMPS) I , REVERSE CURRENT (AMPS) i , INSTANTANEOUS FORWARD CURRENT (A ..
MBRS230LT3 ,Surface Mount Schottky Power RectifierELECTRICAL CHARACTERISTICSV T = 25°C T = 125°C VoltsF J JM Maximum aximum Instantaneous Instantaneo ..
MBRS240L ,Rectifier,2.0A,40V,Surface MTELECTRICAL CHARACTERISTICSV T = 25°C T = 125°C VoltsF J JMaximum Maximum Instantaneous Forward V In ..
MBRS240LT3 ,Rectifier,2.0A,40V,Surface MTMAXIMUM RATINGS2BL4Rating Symbol Value UnitPeak Repetitive Reverse Voltage V 40 VRRMWorking Peak Re ..
MBRS260T3 ,Surface Mount Schottky Power RectifierELECTRICAL CHARACTERISTICSv T = 25°C T = 125°C VoltsF J JM Maximum aximum Instantaneous Instantaneo ..
MC-222243AF9-B85X-BT3 ,MCP(32M-bit flash memory + 4M-bit Low Power SRAM)Features• Two bank organization enabling simultaneous execution of erase / program and read• Bank o ..
MC-222263F9-B85X-BT3 ,MCP(32M-bit flash memory + 8M-bit Low Power SRAM)Features• Two bank organization enabling simultaneous execution of erase / program and read• Bank o ..
MC-222263F9-B85X-BT3 ,MCP(32M-bit flash memory + 8M-bit Low Power SRAM)Features• Memory organization : 1,048,576 words × 8 bits (BYTE mode)524,288 words × 16 bits (WORD m ..
MC-222264F9-B85X-BT3 ,MCP(32M-bit flash memory + 8M-bit Low Power SRAM)Features• Two bank organization enabling simultaneous execution of erase / program and read• Bank o ..
MC2405 , C-BAND SOLID STATE POWER AMPLIFIERS
MC2405 , C-BAND SOLID STATE POWER AMPLIFIERS
MBRS2040LT3
Surface Mount Schottky Power Rectifier(SMB Power Surface Mount Package)
-- -
SMB Power Surface Mount Package.. employing the Schottky Barrier principle in a metal–to–silicon power
rectifier. Features epitaxial construction with oxide passivation and metal
overlay contact. Ideally suited for low voltage, high frequency switching power
supplies; free wheeling diodes and polarity protection diodes. Compact Package with J–Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guardring for Over–Voltage Protection Low Forward Voltage Drop
Mechanical Characteristics: Case: Molded Epoxy Epoxy Meets UL94, VO at 1/8″ Weight: 95 mg (approximately) Maximum Temperature of 260°C / 10 Seconds for Soldering Polarity: Notch in Plastic Body Indicates Cathode Lead Available in 12 mm Tape, 2500 Units per 13 inch Reel, Add “T3” Suffix to Part Number Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Marking: BKJL
MAXIMUM RATINGS
THERMAL CHARACTERISTICS
ELECTRICAL CHARACTERISTICS(1) Pulse Test: Pulse Width ≤ 250 μs, Duty Cycle ≤ 2.0%.
(2) Minimum pad size (0.108 X 0.085 inch) for each lead on FR4 board.
Order this document
by MBRS2040LT3/D-
SEMICONDUCTOR TECHNICAL DATA-
