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MAX9018AEKA
PLASTIC ENCAPSULATED DEVICES
MAX9018AEKA Rev. A RELIABILITY REPORT
FOR
MAX9018AEKA PLASTIC ENCAPSULATED DEVICES
September 22, 2003
MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by Reviewed by
Jim Pedicord Bryan J. Preeshl
Quality Assurance Quality Assurance
Reliability Lab Manager Executive Director
Conclusion The MAX9018 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. ........Device Description V. ........Quality Assurance Information
II. ........Manufacturing Information VI. .......Reliability Evaluation
III. .......Packaging Information IV. .......Die Information .....Attachments
I. Device Description A. General
The dual MAX9018 nanopower comparator in a space-saving SOT23 packages features Beyond-the-Rails™ inputs
and is guaranteed to operate down to 1.8V. The A-grade packages feature an on-board 1.236V ±1% reference. An
ultra-low supply current of 1.2µA makes the MAX9018 comparator ideal for all 2-cell battery
monitoring/management applications.
The unique design of the MAX9018 output stage limits supply-current surges while switching, which virtually
eliminates the supply glitches typical of many other comparators. This design also minimizes overall power
consumption under dynamic conditions. The MAX9018 has an open-drain output stage that makes them suitable for
mixed-voltage system design. The device is available in the ultra-small 8-pin SOT23 package. B. Absolute Maximum Ratings Supply Voltage (VCC to VEE) 6V
IN+, IN-, INA+, INB+, INA-, INB-, REF/INA-, REF (VEE - 0.3V) to (VCC + 0.3V)
Output Voltage (OUT_) (VEE - 0.3V) to +6V
Output Current (REF, OUT_, REF/INA-) ±50mA
Output Short-Circuit Duration (REF, OUT_, REF/INA-) 10s
Operating Temperature Range -40°C to +85°C
Storage Temperature Range -65°C to +150°C
Junction Temperature +150°C
Lead Temperature (soldering, 10s) +300°C
Continuous Power Dissipation (TA = +70°C)
8-Pin SOT23 727Mw
Derates above +70°C
8-Pin SOT23 9.1mW/°C
II. Manufacturing Information A. Description/Function: SOT23, Dual, Precision, 1.8V, Nanopower Comparators With Reference B. Process: B8 (Standard 0.8 micron silicon gate CMOS) C. Number of Device Transistors: 349
D. Fabrication Location: California, USA
E. Assembly Location: Malaysia or Thailand F. Date of Initial Production: July, 2003
III. Packaging Information A. Package Type:
8-Pin SOT23 B. Lead Frame: Copper C. Lead Finish: Solder Plate D. Die Attach: Non-Conductive Epoxy E. Bondwire: Gold (1.0 mil dia.) F. Mold Material: Epoxy with silica filler
G. Assembly Diagram: # 05-9000-0428
H. Flammability Rating: Class UL94-V0
I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-112: Level 1
IV. Die Information A. Dimensions: 24 x 80 mils B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: Aluminum/Si (Si = 1%) D. Backside Metallization: None E. Minimum Metal Width: 0.8 microns (as drawn) F. Minimum Metal Spacing: 0.8 microns (as drawn) G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO2
V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord (Manager, Reliability Operations) Bryan Preeshl (Executive Director) Kenneth Huening (Vice President) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation A. Accelerated Life Test
B.
The results of the 135°C biased (static) life test are shown in
Table 1. Using these results, the Failure Rate (l) is calculated as follows:
l = 1 = 1.83 (Chi square value for MTTF upper limit)
MTTF 192 x 4389 x 48 x 2 Temperature Acceleration factor assuming an activation energy of 0.8eV l = 22.62 x 10-9 l = 22.62 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to
routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects
it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be
shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece
sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In
Schematic (Spec. # 06-6200) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test
monitors. This data is published in the Product Reliability Report (RR-1M). B. Moisture Resistance Tests
Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85°C/85%RH testing is done per generic device/package family once a quarter.
C. E.S.D. and Latch-Up Testing The CM90-1 die type has been found to have all pins able to withstand a transient pulse of ±1000V, per Mil-
Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of ±250mA.
Table 1 Reliability Evaluation Test Results
MAX9018AEKA
TEST ITEM TEST CONDITION FAILURE SAMPLE NUMBER OF IDENTIFICATION PACKAGE SIZE FAILURES
Static Life Test (Note 1) Ta = 135°C DC Parameters 48 0 Biased & functionality Time = 192 hrs.
Moisture Testing (Note 2) Pressure Pot Ta = 121°C DC Parameters SOT23 77 0 P = 15 psi. & functionality RH= 100% Time = 168hrs. 85/85 Ta = 85°C DC Parameters 77 0 RH = 85% & functionality Biased Time = 1000hrs.
Mechanical Stress (Note 2) Temperature -65°C/150°C DC Parameters 77 0 Cycle 1000 Cycles & functionality Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/ 1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 Pin combinations to be tested. a. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. b. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1, or VCC2) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. c. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open.
TERMINAL B
TERMINAL A
CURRENT
PROBE
(NOTE 6)
R = 1.5kW
C = 100pf
SHORT
R2
S2 R1
