MAX5853ETL ,2.7 V to 3.6 V, Dual, 10-bit, 80 Msps, current-output DACApplications3 28DA7/IDE CLKCommunicationsDA6/REN 4 27 CVDDSatCom, LMDS, MMDS, HFC, DSL, WLAN,DA5/G3 ..
MAX5854ETL+T ,Dual, 10-Bit, 165Msps, Current-Output DACElectrical Characteristics(AV = DV = CV = 3V, AGND = DGND = CGND = 0, f = 165Msps, differential clo ..
MAX5877EGK+D ,14-Bit, 250Msps, High-Dynamic-Performance, Dual DAC with LVDS InputsApplicationsBase Stations: Single/Multicarrier UMTS, CDMA, GSM68 67 66 65 64 63 62 61 60 59 58 57 5 ..
MAX5878EGK+ ,16-Bit, 250Msps, High-Dynamic-Performance, Dual DAC with LVDS InputsApplicationsBase Stations: Single/Multicarrier UMTS, CDMA, GSM68 67 66 65 64 63 62 61 60 59 58 57 5 ..
MAX5883EGM ,3.3V, 12-Bit, 200Msps High Dynamic Performance DAC with CMOS InputsApplications1 36N.C. B8Base Stations: Single/Multicarrier UMTS, 2 35 B9N.C.CDMAXOR 3 34 B104 33Comm ..
MAX5883EGM+D ,3.3V, 12-Bit, 200Msps High Dynamic Performance DAC with CMOS InputsApplications1 36N.C. B8Base Stations: Single/Multicarrier UMTS, 2 35 B9N.C.CDMAXOR 3 34 B104 33Comm ..
MAZ8047-H ,Silicon planar typeelectrical characteristicsZ Zwithin part numbersReverse current I V ··············· Specified value ..
MAZ8047-L ,Silicon planar typeAbsolute Maximum Ratings T = 25°CaMarking SymbolParameter Symbol Rating UnitRefer to the list of t ..
MAZ8047M ,Silicon planar typeElectrical Characteristics T = 25°CaParameter Symbol Conditions Min Typ Max UnitForward voltage V ..
MAZ8047-M ,Silicon planar typeZener DiodesMAZ8000 SeriesSilicon planar typeUnit : mmFor stabilization of power supplyKA
MAZ8051-H ,Silicon planar typeElectrical characteristics within part numbers T = 25°CaTemperaturecoefficient ofZener voltage Rev ..
MAZ8051-L ,Silicon planar typeElectrical Characteristics T = 25°CaParameter Symbol Conditions Min Typ Max UnitForward voltage V ..
MAX5853ETL
2.7 V to 3.6 V, Dual, 10-bit, 80 Msps, current-output DAC
General DescriptionThe MAX5853 dual, 10-bit, 80Msps digital-to-analog
converter (DAC) provides superior dynamic performance
in wideband communication systems. The device inte-
grates two 10-bit DAC cores, and a 1.24V reference.The
converter supports single-ended and differential modes
of operation. The MAX5853 dynamic performance is
maintained over the entire 2.7V to 3.6V power-supply
operating range. The analog outputs support a -1.0V to
+1.25V compliance voltage.
The MAX5853 can also operate in interleave data mode
to reduce the I/O pin count. This allows the converter to
be updated on a single, 10-bit bus.
The MAX5853 features digital control of channel gain
matching to within ±0.4dB in sixteen 0.05dB steps.
Channel matching improves sideband suppression in
analog quadrature modulation applications. The on-
chip 1.24V bandgap reference includes a control
amplifier that allows external full-scale adjustments of
both channels through a single resistor. The internal ref-
erence can be disabled and an external reference may
be applied for high-accuracy applications.
The MAX5853 features full-scale current outputs of 2mA
to 20mA and operates from a 2.7V to 3.6V single supply.
The DAC supports three modes of power-control opera-
tion:normal, low-power standby, and complete power-
down. In power-down mode, the operating current is
reduced to 1µA.
The MAX5853 is packaged in a 40-pin thin QFN with
exposed paddle (EP) and is specified for the extended
(-40°C to +85°C) temperature range.
Pin-compatible, higher speed, and lower resolution
versions are also available. Refer to the MAX5854
(10-bit, 165Msps), the MAX5852** (8-bit, 165Msps), and
the MAX5851** (8-bit, 80Msps) data sheets for more
information. See Table 4at the end of the data sheet.
ApplicationsCommunications
SatCom, LMDS, MMDS, HFC, DSL, WLAN,
Point-to-Point Microwave Links
Wireless Base Stations
Quadrature Modulation
Direct Digital Synthesis (DDS)
Instrumentation/ATE
Features10-Bit, 80Msps Dual DACLow Power
77mW with IFS= 5mA at fCLK= 80MHz2.7V to 3.6V Single Supply Full Output Swing and Dynamic Performance at
2.7V SupplySuperior Dynamic Performance
78dBc SFDR at fOUT= 20MHzProgrammable Channel Gain MatchingIntegrated 1.24V Low-Noise Bandgap ReferenceSingle-Resistor Gain ControlInterleaved Data ModeSingle-Ended and Differential Clock Input ModesMiniature 40-Pin Thin QFN Package, 6mm x 6mmEV Kit Available—MAX5854 EV Kit
MAX5853
Dual, 10-Bit, 80Msps, Current-Output DAC
Ordering Information
Pin Configuration*EP = Exposed paddle.
MAX5853
Dual, 10-Bit, 80Msps, Current-Output DAC
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS(AVDD= DVDD= CVDD= 3V, AGND = DGND = CGND = 0, fDAC= 80Msps, differential clock, external reference, VREF= 1.2V, IFS=
20mA, differential output, output amplitude = 0dBFS, TA= TMINto TMAX, unless otherwise noted. TA ≥+25°C, guaranteed by produc-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDDto AGND.........................................................-0.3V to +4V
DVDDto DGND.........................................................-0.3V to +4V
CVDDto CGND.........................................................-0.3V to +4V
AVDDto DVDD.............................................................-4V to +4V
AGND to DGND.....................................................-0.3V to +0.3V
AGND to CGND.....................................................-0.3V to +0.3V
DGND to CGND....................................................-0.3V to +0.3V
DA9–DA0, DB9–DB0, CW, DCEto DGND...............-0.3V to +4V
CLK to CGND..........................................-0.3V to (CVDD+ 0.3V)
CLKXN, CLKXP to CGND.........................................-0.3V to +4V
REFR, REFO to AGND.............................-0.3V to (AVDD+ 0.3V)
OUTPA, OUTNA to AGND..........(AVDD- 4.8V) to (AVDD+ 0.3V)
OUTPB, OUTNB to AGND..........(AVDD- 4.8V) to (AVDD+ 0.3V)
Maximum Current into Any Pin
(excluding power supplies)..........................................±50mA
Continuous Power Dissipation (TA= +70°C)
40-Pin Thin QFN (derate 26.3mW/°C above +70°C)....2105mW
Operating Temperature Range...........................-40°C to +85°C
Storage Temperature Range.............................-65°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (soldering, 10s).................................+300°C
MAX5853
Dual, 10-Bit, 80Msps, Current-Output DAC
ELECTRICAL CHARACTERISTICS (continued)(AVDD= DVDD= CVDD= 3V, AGND = DGND = CGND = 0, fDAC= 80Msps, differential clock, external reference, VREF= 1.2V, IFS=
20mA, differential output, output amplitude = 0dBFS, TA= TMINto TMAX, unless otherwise noted. TA ≥+25°C, guaranteed by produc-
MAX5853
Dual, 10-Bit, 80Msps, Current-Output DAC
ELECTRICAL CHARACTERISTICS (continued)(AVDD= DVDD= CVDD= 3V, AGND = DGND = CGND = 0, fDAC= 80Msps, differential clock, external reference, VREF= 1.2V, IFS=
20mA, differential output, output amplitude = 0dBFS, TA= TMINto TMAX, unless otherwise noted. TA ≥+25°C, guaranteed by produc-
MAX5853
Dual, 10-Bit, 80Msps, Current-Output DAC
ELECTRICAL CHARACTERISTICS (continued)(AVDD= DVDD= CVDD= 3V, AGND = DGND = CGND = 0, fDAC= 80Msps, differential clock, external reference, VREF= 1.2V, IFS=
20mA, differential output, output amplitude = 0dBFS, TA= TMINto TMAX, unless otherwise noted. TA ≥+25°C, guaranteed by produc-
