MAX4717EBC-T ,4.5/20 om, 300 MHz bandwidth, dual SPDT analog switchApplicationsOrdering InformationUSB 1.1 Signal Switching CircuitsPIN/BUMP- TOPPART TEMP RANGEBatter ..
MAX4717ETB , 4.5OHM/20OHM, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP
MAX4717ETB+ ,4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSPfeatures two 4.5Ω R (max) SPDTON♦ Single-Supply Operation from +1.8V to +5.5Vswitches with 1.2Ω fla ..
MAX4717ETB+T ,4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSPfeatures one 4.5Ω R (max)ON ON0.3Ω (max) R Match (+3.0V Supply)SPDT switch and one 20Ω R (max) SPDT ..
MAX4717EUB ,4.5 /20 / 300MHz Bandwidth / Dual SPDT Analog Switches in UCSPELECTRICAL CHARACTERISTICS—Single +3V Supply(V+ = +2.7V to +3.6V, V = +1.4V, V = +0.5V, T = T to T ..
MAX4717EUB ,4.5 /20 / 300MHz Bandwidth / Dual SPDT Analog Switches in UCSPfeatures one 4.5Ω R (max)ON0.3Ω (max) R Match (+3.0V Supply)ONSPDT switch and one 20Ω R (max) SPDT ..
MAX8867EUK28-T ,Low-noise, low-dropout, 150mA linear regulator. Preset output voltage 2.80V
MAX8867EUK29-T ,Low-noise, low-dropout, 150mA linear regulator. Preset output voltage 2.84V
MAX8867EUK29-T ,Low-noise, low-dropout, 150mA linear regulator. Preset output voltage 2.84V
MAX8867EUK33 ,Low-Noise, Low-Dropout, 150mA Linear Regulators in SOT23
MAX8867EUK33+ ,Low-Noise, Low-Dropout, 150mA Linear Regulators in SOT23
MAX8867EUK33+T ,Low-Noise, Low-Dropout, 150mA Linear Regulators in SOT23
MAX4717EBC-T
4.5/20 om, 300 MHz bandwidth, dual SPDT analog switch
General DescriptionThe MAX4717/MAX4718 low-voltage, low on-resistance
(RON), dual single-pole/double throw (SPDT) analog
switches operate from a single +1.8V to +5.5V supply.
These devices are designed for USB 1.1 and audio
switching applications.
The MAX4717 features two 4.5ΩRON(max) SPDT
switches with 1.2Ωflatness and 0.3Ωmatching between
channels. The MAX4718 features one 4.5ΩRON(max)
SPDT switch and one 20ΩRON(max) SPDT switch. The
20Ωswitch has a guaranteed matching and flatness of
0.4Ωand 1.2Ω, respectively. These switches offer break-
before-make switching (1ns) with tON<80ns and tOFF
<40ns at +2.7V. The digital logic inputs are +1.8V logic
compatible with a +2.7V to +3.6V supply.
These switches are packaged in a chip-scale package
(UCSP™), significantly reducing the required PC board
area. The chip occupies only a 2.0mm ✕1.50mm area
and has a 4 ✕3 bump array with a bump pitch of
0.5mm. These switches are also available in a 10-pin
µMAX package.
ApplicationsUSB 1.1 Signal Switching Circuits
Battery-Operated Equipment
Audio/Video-Signal Routing
Headphone Switching
Low-Voltage Data-Acquisition Systems
Sample-and-Hold Circuits
Cell Phones
PDAs
FeaturesUSB 1.1 Signal Switching Compliant2ns (max) Differential Skew-3dB Bandwidth: >300MHz Low 15pF On-Channel CapacitanceSingle-Supply Operation from +1.8V to +5.5V4.5ΩRON(max) Switches (MAX4717/MAX4718)
0.3Ω(max) RONMatch (+3.0V Supply)
1.2Ω(max) Flatness (+3.0V Supply)20ΩRON(max) Switch (MAX4718)
0.4Ω(max) RONMatch (+3.0V Supply)
1.2Ω(max) Flatness (+3.0V Supply)Rail-to-Rail®Signal HandlingHigh Off-Isolation: -55dB (10MHz)Low Crosstalk: -80dB (10MHz)Low Distortion: 0.03%+1.8V CMOS-Logic Compatible<0.5nA Leakage Current at +25°C
MAX4717/MAX4718
4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
Ordering Information19-2627; Rev 0; 10/02
Pin Configurations/Functional Diagrams/Truth TablesUCSP is a trademark of Maxim Integrated Products, Inc.
Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd.
Note:UCSP package requires special solder temperature pro-
file described in the Absolute Maximum Ratings section.
*UCSP reliability is integrally linked to the user’s assembly meth-
ods, circuit board material, and environment. See the UCSP reli-
ability notice in the UCSP Reliability section of this data sheet for
more information.
MAX4717/MAX4718
4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS—Single +3V Supply(V+ = +2.7V to +3.6V, VIH= +1.4V, VIL= +0.5V, TA= TMINto TMAX, unless otherwise noted. Typical values are at V+ = +3.0V,
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All Voltages Referenced to GND)
V+, IN_...................................................................-0.3V to +6.0V
COM_, NO_, NC_ (Note 1)...........................-0.3V to (V+ + 0.3V)
Continuous Current COM_, NO_, NC_...........................±100mA
Peak Current COM_, NO_, NC_
(pulsed at 1ms, 10% duty cycle)................................±200mA
Continuous Power Dissipation (TA= +70°C)
10-Pin µMAX (derate 5.6mW/°C above +70°C)...........444mW
12-Bump UCSP (derate 11.4mW/°C above +70°C)....909mW
ESD Method 3015.7.............................................................>2kV
Operating Temperature Range...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
Bump Temperature (soldering) (Note 2)
Infrared (15s)...............................................................+220°C
Vapor Phase (60s).......................................................+215°C
Note 1:Signals on COM_, NO_, or NC_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maxi-
mum current rating.
Note 2:This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry standard specification, JEDEC 020A, paragraph 7.6, table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
MAX4717/MAX4718
4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
ELECTRICAL CHARACTERISTICS—Single +3V Supply (continued)(V+ = +2.7V to +3.6V, VIH= +1.4V, VIL= +0.5V, TA= TMINto TMAX, unless otherwise noted. Typical values are at V+ = +3.0V,
MAX4717/MAX4718
4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
ELECTRICAL CHARACTERISTICS—Single +3V Supply (continued)(V+ = +2.7V to +3.6V, VIH= +1.4V, VIL= +0.5V, TA= TMINto TMAX, unless otherwise noted. Typical values are at V+ = +3.0V,
ELECTRICAL CHARACTERISTICS—Single +5V Supply(V+ = +4.2V to +5.5V, VIH= +2.0V, VIL= +0.8V, TA= TMINto TMAX, unless otherwise noted. Typical values are at V+ = +5.0V,
MAX4717/MAX4718
4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
ELECTRICAL CHARACTERISTICS—Single +5V Supply (continued)(V+ = +4.2V to +5.5V, VIH= +2.0V, VIL= +0.8V, TA= TMINto TMAX, unless otherwise noted. Typical values are at V+ = +5.0V, = +25°C, unless otherwise noted.) (Notes 3, 4)
MAX4717/MAX4718
4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSPare 100% tested at TMAXand guaranteed by design over the specified temperature range.
Note 4:The algebraic convention used in this data sheet is where the most negative value is a minimum and the most positive
value is a maximum.
Note 5:Guaranteed by design for UCSP parts.
Note 6:∆RON= RON(MAX)- RON(MIN).
Note 7:Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the
specified analog signal ranges.
Note 8:Guaranteed by design.
Note 9:Between any two switches.
ELECTRICAL CHARACTERISTICS—Single +5V Supply (continued)(V+ = +4.2V to +5.5V, VIH= +2.0V, VIL= +0.8V, TA= TMINto TMAX, unless otherwise noted. Typical values are at V+ = +5.0V, = +25°C, unless otherwise noted.) (Notes 3, 4)
ON-RESISTANCE vs. VCOMMAX4717/18 toc01
VCOM (V)321
ON-RESISTANCE vs. VCOMMAX4717/18 toc02
VCOM (V)
ON-RESISTANCE vs. VCOM
MAX4717/18 toc03
VCOM (V)321
Typical Operating Characteristics(TA = +25°C, unless otherwise noted.)
MAX4717/MAX4718
4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
ON-RESISTANCE vs. VCOMMAX4717/18 toc04
VCOM (V)321
ON-RESISTANCE vs. VCOMMAX4717/18 toc05
VCOM (V)
ON-RESISTANCE vs. VCOM
MAX4717/18 toc06
VCOM (V)321
LEAKAGE CURRENT vs. TEMPERATUREMAX4717/18 toc07
TEMPERATURE (°C)
LEAKAGE CURRENT (pA)3510-15
LEAKAGE CURRENT vs. TEMPERATURE
MAX4717/18 toc08
TEMPERATURE (°C)
LEAKAGE CURRENT (pA)3510-15
LEAKAGE CURRENT vs. TEMPERATURE
MAX4717/18 toc09
TEMPERATURE (°C)
LEAKAGE CURRENT (pA)3510-15
LEAKAGE CURRENT vs. TEMPERATURE
MAX4717/18 toc10
TEMPERATURE (°C)
LEAKAGE CURRENT (pA)3510-15
CHARGE INJECTION vs. VCOM
MAX4717/18 toc11
VCOM (V)
CHARGE INJECTION (pC)321
SUPPLY CURRENT vs. TEMPERATUREMAX4717/18 toc12
TEMPERATURE (°C)
SUPPLY CURRENT (nA)3510-15
Typical Operating Characteristics (continued)
(TA = +25°C, unless otherwise noted.)
MAX4717/MAX4718
4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT
Analog Switches in UCSP
SUPPLY CURRENT vs. LOGIC LEVELMAX4717/18 toc13
LOGIC LEVEL (V)
SUPPLY CURRENT (321
LOGIC THRESHOLD vs. SUPPLY VOLTAGE
MAX4717/18 toc14
SUPPLY VOLTAGE (V)
LOGIC THRESHOLD (V)
TURN-ON/OFF TIME
vs. SUPPLY VOLTAGE
MAX4717/18 toc15
SUPPLY VOLTAGE (V)
tON
OFF
(ns)
TURN-ON/OFF TIME
vs. SUPPLY VOLTAGE
MAX4717/18 toc16
SUPPLY VOLTAGE (V)
OFF
(ns)
TURN-ON/OFF TIME
vs. TEMPERATURE
MAX4717/18 toc17
TEMPERATURE (°C)
tON
OFF
(ns)3510-15
TURN-ON/OFF TIME
vs. TEMPERATURE
MAX4717/18 toc18
TEMPERATURE (°C)
tON
OFF
(ns)3510-15
RISE/FALL-TIME DELAY
vs. SUPPLY VOLTAGE
MAX4717/18 toc19
SUPPLY VOLTAGE (V)
OUTPUT RISE/FALL-TIME DELAY (ps)
RISE/FALL-TIME DELAY
vs. TEMPERATURE
MAX4717/18 toc20
TEMPERATURE (°C)
OUTPUT RISE/FALL-TIME DELAY (ns)3510-15
RISE TIME TO FALL TIME MISMATCH
vs. SUPPLY VOLTAGE
MAX4717/18 toc21
SUPPLY VOLTAGE (V)
MISMATCH (ps)
Typical Operating Characteristics (continued)
(TA = +25°C, unless otherwise noted.)
