MAX3392EEBC-T ,【15kV ESD-Protected, 1レA, 16Mbps, Dual/Quad Low-Voltage Level Translators in UCSPApplications2SPI™, MICROWIRE™, and I C™ LevelI/O V 2 1 8 I/O V 1CC CCTranslation Low-Voltage ASIC L ..
MAX3392EEUD+ ,±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad Low-Voltage Level Translators in UCSP MAX3372E–MAX3379E/MAX3390E–MAX3393E±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad Low-Voltage Level ..
MAX3393EEUD ,【15kV ESD-Protected, 1レA, 16Mbps, Dual/Quad Low-Voltage Level Translators in UCSPELECTRICAL CHARACTERISTICS(V = +1.65V to +5.5V, V = +1.2V to (V + 0.3V), GND = 0, I/O V and I/O V u ..
MAX3393EEUD+ ,±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad Low-Voltage Level Translators in UCSP MAX3372E–MAX3379E/MAX3390E–MAX3393E±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad Low-Voltage Level ..
MAX3394EEBL+T ,±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/Octal-Level Translators with Speed-Up CircuitryApplicationsSelector Guide appears at end of data sheet.Multivoltage Bidirectional Level Translatio ..
MAX339CEE ,8-Channel/Dual 4-Channel, Low-Leakage, CMOS Analog MultiplexersGeneral DescriptionThe MAX338/MAX339 are monolithic, CMOS analog♦ On-Resistance, <400Ω maxmultiplex ..
MAX706CSA ,Low-Cost, uP Supervisory CircuitsGeneral Description _______
MAX706CSA+ ,Low-Cost, µP Supervisory CircuitsMAX705–MAX708/MAX813L Low-Cost, μP Supervisory Circuits
MAX706CSA+T ,Low-Cost, µP Supervisory CircuitsMAX705–MAX708/MAX813L Low-Cost, μP Supervisory Circuits
MAX706CSA-T ,Low-Cost, µP Supervisory CircuitsGeneral Description Beneits and
MAX706CSA-T ,Low-Cost, µP Supervisory CircuitsApplications lead-free by adding the + symbol at the endof the part number when ordering. ● Comput ..
MAX706CUA+ ,Low-Cost, µP Supervisory CircuitsGeneral Description Beneits and
MAX3390EEUD-MAX3391EEUD-MAX3392EEBC-T-MAX3393EEUD
【15kV ESD-Protected, 1レA, 16Mbps, Dual/Quad Low-Voltage Level Translators in UCSP
General DescriptionThe MAX3372E–MAX3379E and MAX3390E–MAX3393E
±15kV ESD-protected level translators provide the level
shifting necessary to allow data transfer in a multivoltage
system. Externally applied voltages, VCCand VL, set the
logic levels on either side of the device. A low-voltage
logic signal present on the VLside of the device appears
as a high-voltage logic signal on the VCCside of the
device, and vice-versa. The MAX3374E/MAX3375E/
MAX3376E/MAX3379E and MAX3390E–MAX3393E unidi-
rectional level translators level shift data in one direction
(VL→VCCor VCC→VL) on any single data line. The
MAX3372E/MAX3373E and MAX3377E/MAX3378E bidi-
rectional level translators utilize a transmission-gate-
based design (Figure 2) to allow data translation in either
direction (VL↔VCC) on any single data line. The
MAX3372E–MAX3379E and MAX3390E–MAX3393E
accept VLfrom +1.2V to +5.5V and VCCfrom +1.65V to
+5.5V, making them ideal for data transfer between low-
voltage ASICs/PLDs and higher voltage systems.
All devices in the MAX3372E–MAX3379E, MAX3390E–
MAX3393E family feature a three-state output mode that
reduces supply current to less than 1µA, thermal short-
circuit protection, and ±15kV ESD protection on the VCC
side for greater protection in applications that route sig-
nals externally. The MAX3372E/MAX3377E operate at a
guaranteed data rate of 230kbps. Slew-rate limiting
reduces EMI emissions in all 230kbps devices. The
MAX3373E–MAX3376E/MAX3378E/MAX3379E and
MAX3390E–MAX3393E operate at a guaranteed data rate
of 8Mbps over the entire specified operating voltage
range. Within specific voltage domains, higher data rates
are possible. (See Timing Characteristics.)
The MAX3372E–MAX3376E are dual level shifters
available in 3 x 3 UCSP™ and 8-pin SOT23-8 pack-
ages. The MAX3377E/MAX3378E/MAX3379E and
MAX3390E–MAX3393E are quad level shifters avail-
able in 3 x 4 UCSP and 14-pin TSSOP packages.
________________________ApplicationsSPI™, MICROWIRE™, and I2C™ Level
Translation
Low-Voltage ASIC Level Translation
Smart Card Readers
Cell-Phone Cradles
Portable POS Systems
Portable Communication Devices
Low-Cost Serial Interfaces
Cell Phones
GPS
Telecommunications Equipment
FeaturesGuaranteed Data Rate Options
230kbps
8Mbps (+1.2V ≤VL≤
VCC≤
+5.5V)
10Mbps (+1.2V ≤VL≤
VCC≤
+3.3V)
16Mbps (+1.8V ≤VL≤
VCC≤
+2.5V and +2.5V ≤≤
VCC≤
+3.3V)Bidirectional Level Translation
(MAX3372E/MAX3373E and
MAX3377E/MAX3378E)Operation Down to +1.2V on VL±15kV ESD Protection on I/O VCCLinesUltra-Low 1µA Supply Current in Three-State
Output ModeLow-Quiescent Current (130µA typ)UCSP, SOT, and TSSOP Packages Thermal Short-Circuit Protection
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
Pin Configurations19-2328; Rev 3; 9/03
Ordering InformationUCSP is a trademark of Maxim Integrated Products, Inc.
SPI is a trademark of Motorola, Inc.
I2C is a trademark of Phillips Corp.
MICROWIRE is a trademark of National Semiconductor Corp.
Ordering Information continued at end of data sheet.
Selector Guide appears at end of data sheet.
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS(VCC= +1.65V to +5.5V, VL= +1.2V to (VCC+ 0.3V), GND = 0, I/O VL_and I/O VCC_unconnected, TA= TMINto TMAX, unless other-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
All Voltages Referenced to GND
VCC...........................................................................-0.3V to +6V
I/O VCC_......................................................-0.3V to (VCC+ 0.3V)
I/O VL_...........................................................-0.3V to (VL+ 0.3V)
THREE-STATE...............................................-0.3V to (VL+ 0.3V)
Short-Circuit Duration I/O VL, I/O VCCto GND...........Continuous
Short-Circuit Duration I/O VLor I/O VCCto GND
Driven from 40mA Source
(except MAX3372E and MAX3377E).....................Continuous
Continuous Power Dissipation (TA= +70°C)
8-Pin SOT23 (derate 8.9mW/°C above +70°C)...........714mW
3 x 3 UCSP (derate 4.7mW/°C above +70°C)............379mW
3 x 4 UCSP (derate 6.5mW/°C above +70°C)............579mW
14-Pin TSSOP (derate 9.1mW/°C above +70°C)........727mW
Operating Temperature Range...........................-40°C to +85°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
ELECTRICAL CHARACTERISTICS (continued)(VCC= +1.65V to +5.5V, VL= +1.2V to (VCC+ 0.3V), GND = 0, I/O VL_and I/O VCC_unconnected, TA= TMINto TMAX, unless other-
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
TIMING CHARACTERISTICS(VCC= +1.65V to +5.5V, VL= +1.2V to (VCC+ 0.3V), GND = 0, RLOAD= 1MΩ, I/O test signal of Figure 1, TA= TMINto TMAX, unless
otherwise noted. Typical values are at VCC= +3.3V, VL= +1.8V, TA= +25°C, unless otherwise noted.) (Notes 1, 2)
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSPand not production tested.
Note 2:For normal operation, ensure VL< (VCC+ 0.3V). During power-up, VL> (VCC+ 0.3V) will not damage the device.
Note 3:To ensure maximum ESD protection, place a 1µF capacitor between VCCand GND. See Applications Circuits.
Note 4:10% to 90%
Note 5:90% to 10%
TIMING CHARACTERISTICS (continued)(VCC= +1.65V to +5.5V, VL= +1.2V to (VCC+ 0.3V), GND = 0, RLOAD= 1MΩ, I/O test signal of Figure 1, TA= TMINto TMAX, unless
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
Typical Operating Characteristics(RL= 1MΩ, TA = +25°C, unless otherwise noted. All 230kbps TOCs apply to MAX3372E/MAX3377E only. All 8Mbps and 500kbps
TOCs apply to MAX3373E–MAX3376E/MAX3378E/MAX3379E and MAX3390E–MAX3393E only.)
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
PROPAGATION DELAY vs. CAPACITIVE LOAD
(DRIVING I/O VL, VCC = +3.3V, VL = +1.8V)MAX3372E toc10
CAPACITIVE LOAD (pF)
PROPAGATION DELAY (ns)807060504030
PROPAGATION DELAY vs. CAPACITIVE LOAD
(DRIVING I/O VL, VCC = +3.3V, VL = +1.8V)
MAX3372E toc11
CAPACITIVE LOAD (pF)
PROPAGATION DELAY (ns)40353025201550
PROPAGATION DELAY vs. CAPACITIVE LOAD
(DRIVING I/O VL, VCC = +3.3V, VL = +1.8V)MAX3372E toc12
CAPACITIVE LOAD (pF)
PROPAGATION DELAY (ns)403530252015
RISE/FALL TIME vs. CAPACITIVE LOAD
(DRIVING I/O VL, VCC = +2.5V, VL = +1.8V)
MAX3372E toc13
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)807060504030
RISE/FALL TIME vs. CAPACITIVE LOAD
(DRIVING I/O VL, VCC = +2.5V, VL = +1.8V)
MAX3372E toc14
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)40353025201550
RISE/FALL TIME vs. CAPACITIVE LOAD
(DRIVING I/O VCC, VCC = +2.5V, VL = +1.8V)MAX3372E toc15
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)403530252015
RISE/FALL TIME vs. CAPACITIVE LOAD
(DRIVING I/O VCC, VCC = +3.3V, VL = +1.8V)
MAX3372E toc16
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)807060504030
RISE/FALL TIME vs. CAPACITIVE LOAD
(DRIVING I/O VCC, VCC = +3.3V, VL = +1.8V)
MAX3372E toc17
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)40353025201550
RISE/FALL TIME vs. CAPACITIVE LOAD
(DRIVING I/O VCC, VCC = +3.3V, VL = +1.8V)MAX3372E toc18
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)403530252015
Typical Operating Characteristics (continued)
(RL= 1MΩ, TA = +25°C, unless otherwise noted. All 230kbps TOCs apply to MAX3372E/MAX3377E only. All 8Mbps and 500kbps
TOCs apply to MAX3373E–MAX3376E/MAX3378E/MAX3379E and MAX3390E–MAX3393E only.)
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
Typical Operating Characteristics (continued)(RL= 1MΩ, TA = +25°C, unless otherwise noted. All 230kbps TOCs apply to MAX3372E/MAX3377E only. All 8Mbps and 500kbps
TOCs apply to MAX3373E–MAX3376E/MAX3378E/MAX3379E and MAX3390E–MAX3393E only.)
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSPypical Operating Characteristics (continued)(RL= 1MΩ, TA = +25°C, unless otherwise noted. All 230kbps TOCs apply to MAX3372E/MAX3377E only. All 8Mbps and 500kbps
TOCs apply to MAX3373E–MAX3376E/MAX3378E/MAX3379E and MAX3390E–MAX3393E only.)
Configurationsfor input/output configurations.
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
Detailed DescriptionThe MAX3372E–MAX3379E and MAX3390E–MAX3393E
ESD-protected level translators provide the level shifting
necessary to allow data transfer in a multivoltage system.
Externally applied voltages, VCCand VL, set the logic lev-
els on either side of the device. A low-voltage logic signal
present on the VLside of the device appears as a high-
voltage logic signal on the VCCside of the device, and
vice-versa. The MAX3374E/MAX3375E/MAX3376E/
MAX3379E and MAX3390E–MAX3393E unidirectional
level translators level shift data in one direction (VL→
VCCor VCC→VL) on any single data line. The
MAX3372E/MAX3373E and MAX3377E/MAX3378E bidi-
rectional level translators utilize a transmission-gate-
based design (see Figure 2) to allow data translation in
either direction (VL↔VCC) on any single data line. The
MAX3372E–MAX3379E and MAX3390E–MAX3393E
accept VLfrom +1.2V to +5.5V and VCCfrom +1.65V to
+5.5V, making them ideal for data transfer between low-
voltage ASICs/PLDs and higher voltage systems.
All devices in the MAX3372E–MAX3379E, MAX3390E–
MAX3393E family feature a three-state output mode that
reduces supply current to less than 1µA, thermal short-
circuit protection, and ±15kV ESD protection on the VCC
side for greater protection in applications that route sig-
nals externally. The MAX3372E/MAX3377E operate at a
guaranteed data rate of 230kbps. Slew-rate limiting
reduces EMI emissions in all 230kbps devices. The
MAX3373E–MAX3376E/MAX3378E/MAX3379E and
MAX3390E–MAX3393E operate at a guaranteed data rate
of 8Mbps over the entire specified operating voltage
range. Within specific voltage domains, higher data rates
are possible. (See Timing Characteristics.)
Level TranslationFor proper operation ensure that +1.65V ≤VCC≤+5.5V,
+1.2V ≤VL≤+5.5V, and VL≤(VCC+ 0.3V). During
power-up sequencing, VL≥(VCC+ 0.3V) will not damage
the device. During power-supply sequencing, when VCC
is floating and VLis powering up, a current may be
sourced, yet the device will not latch up. The speed-up
Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd.
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSPcircuitry limits the maximum data rate for devices in the
MAX3372E–MAX3379E, MAX3390E–MAX3393E family to
16Mbps. The maximum data rate also depends heavily
on the load capacitance (see Typical Operating
Characteristics), output impedance of the driver, and the
operational voltage range (see Timing Characteristics).
Speed-Up CircuitryThe MAX3373E–MAX3376E/MAX3378E/MAX3379E and
MAX3390E–MAX3393E feature a one-shot generator that
decreases the rise time of the output. When triggered,
MOSFETs PU1 and PU2 turn on for a short time to pull up
I/O VL_and I/O VCC_to their respective supplies (see
Figure 2b). This greatly reduces the rise time and propa-
gation delay for the low-to-high transition. The scope
photo of Rail-to-Rail Driving for 8Mbps Operation in the
Typical Operating Characteristicsshows the speed-up
circuitry in operation.
Three-State Output ModePull THREE-STATElow to place the MAX3372E–
MAX3379E and MAX3390E–MAX3393E in three-state out-
put mode. Connect THREE-STATEto VL(logic high) for
normal operation. Activating the three-state output mode
disconnects the internal 10kΩpullup resistors on the I/O
VCCand I/O VLlines. This forces the I/O lines to a high-
impedance state, and decreases the supply current to
less than 1µA. The high-impedance I/O lines in three-
state output mode allow for use in a multidrop network.
When in three-state output mode, do not allow the voltage
at I/O VL_to exceed (VL+ 0.3V), or the voltage at I/O
VCC_to exceed (VCC+ 0.3V).
Thermal Short-Circuit Protection Thermal overload detection protects the MAX3372E–
MAX3379E and MAX3390E–MAX3393E from short-circuit
fault conditions. In the event of a short-circuit fault, when
the junction temperature (TJ) reaches +152°C, a thermal
sensor signals the three-state output mode logic to force
the device into three-state output mode. When TJhas
cooled to +142°C, normal operation resumes.
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
±15kV ESD Protection As with all Maxim devices, ESD-protection structures are
incorporated on all pins to protect against electrostatic
discharges encountered during handling and assembly.
The I/O VCClines have extra protection against static
electricity. Maxim’s engineers have developed state-of-
the-art structures to protectthese pins against ESD of
±15kV without damage. The ESD structures withstand
high ESD in all states: normal operation, three-state out-
put mode, and powered down. After an ESD event,
Maxim’s E versions keep working without latchup,
whereas competing products can latch and must be
powered down to remove latchup.
ESD protection can be tested in various ways. The I/O
VCClines of this product family are characterized for
protection to the following limits:±15kV using the Human Body Model±8kV using the Contact Discharge method specified
in IEC 1000-4-2±10kV using IEC 1000-4-2’s Air-Gap Discharge
method
ESD Test Conditions ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents
test setup, test methodology, and test results.
Human Body Model Figure 3a shows the Human Body Model and Figure 3b
shows the current waveform it generates when dis-
charged into a low impedance. This model consists of
a 100pF capacitor charged to the ESD voltage of inter-
est, which is then discharged into the test device
through a 1.5kΩresistor.
IEC 1000-4-2 The IEC 1000-4-2 standard covers ESD testing and
performance of finished equipment; it does not specifi-
cally refer to integrated circuits. The MAX3372E–
MAX3379E and MAX3390E–MAX3393E help to design
equipment that meets Level 3 of IEC 1000-4-2, without
the need for additional ESD-protection components.
The major difference between tests done using the
Human Body Model and IEC 1000-4-2 is higher peak cur-
rent in IEC 1000-4-2, because series resistance is lower
in the IEC 1000-4-2 model. Hence, the ESD withstand
voltage measured to IEC 1000-4-2 is generally lower than
that measured using the Human Body Model. Figure 4a
shows the IEC 1000-4-2 model, and Figure 4b shows the
current waveform for the ±8kV, IEC 1000-4-2, Level 4,
ESD contact-discharge test.
The air-gap test involves approaching the device with a
charged probe. The contact-discharge method connects
the probe to the device before the probe is energized.
Machine Model The Machine Model for ESD tests all pins using a
200pF storage capacitor and zero discharge resis-
tance. Its objective is to emulate the stress caused by
contact that occurs with handling and assembly during
manufacturing. Of course, all pins require this protec-
tion during manufacturing, not just inputs and outputs.
Therefore, after PC board assembly, the Machine
Model is less relevant to I/O ports.
