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MAX3209ECUU+ |MAX3209ECUUMAXN/a260avai±15kV ESD-Protected, 12V, Dual RS-232 Serial Port with Low-Power Standby for Motherboards/Desktops
MAX3209ECUU-T |MAX3209ECUUTMAXIMN/a322avai±15kV ESD-Protected, 12V, Dual RS-232 Serial Port with Low-Power Standby for Motherboards/Desktops
MAX3209EEUU+ |MAX3209EEUUMAXN/a95avai±15kV ESD-Protected, 12V, Dual RS-232 Serial Port with Low-Power Standby for Motherboards/Desktops


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MAX3209ECUU+-MAX3209ECUU-T-MAX3209EEUU+
±15kV ESD-Protected, 12V, Dual RS-232 Serial Port with Low-Power Standby for Motherboards/Desktops
General Description
The MAX3209E is a complete, dual DTE RS-232 serial
port (6 transmitters, 10 receivers) for motherboards and
desktop PCs that ensures compliance with the stringent
ESD requirements of the European Community. The
device minimizes board space and power consumption
by eliminating the need for a negative power supply; it
integrates two serial ports and a charge pump into a sin-
gle 38-pin TSSOP package.
The MAX3209E features a 50µA low-power standby
mode for compliance with system power-management
requirements. During standby, while the device oper-
ates from the single +3V to +5.5V logic supply, one
receiver on each port remains active, allowing automatic
system wake-up when peripheral communications
resume.
All transmitter outputs and receiver inputs are protected
to ±15kV using IEC 1000-4-2 Air-Gap Discharge, ±8kV
using IEC 1000-4-2 Contact Discharge, and ±15kV
using the Human Body Model, making the device ideal
for use in harsh environments or mission-critical equip-
ment. In addition, the MAX3209E withstands ±4kV per
IEC 1000-4-4 Electrical Fast Transient/Burst Stressing.
As a result of its robust charge-pump structure, the
MAX3209E guarantees mouse driveability and true RS-
232 operation at data rates up to 460kbps, ensuring
compatibility with PC-to-PC communication software
(such as LapLink™).
________________________Applications

Desktop PCs
Motherboards
Instruments
Equipment Requiring IEC 1000-4-2 Compliance
Telecommunications
Network Servers
Features
Two Complete Serial Ports in a Single 38-Pin
TSSOP Package
Requires Only +12V Supply and Logic
Supply (+3V to +5.5V)
No Negative Supply RequiredOne Receiver Active per Port in Standby
for System Wake-Up
460kbps Data Rate; LapLink CompatibleEnhanced ESD Protection
±15kV—Human Body Model
±8kV—IEC 1000-4-2, Contact Discharge
±15kV—IEC 1000-4-2, Air-Gap Discharge
±4kV Fast Transient Burst Immunity per
IEC 1000-4-4
Low 50µA Standby CurrentOperates with Either +3V or +5V LogicGuaranteed Mouse DriveabilitySmall 0.1µF CapacitorsFlow-Through Pinout
MAX3209E
±15kV ESD-Protected, 12V, Dual RS-232 Serial Port
with Low-Power Standby for Motherboards/Desktops

19-1471; Rev 5; 9/02
Ordering Information
Typical Operating Circuit appears at end of data sheet.
Pin Configurations continued at end of data sheet.

LapLink is a trademark of Traveling Software.363738392016171213141532333435
N.C.
R7OUT
R1OUT
MAX3209E
6 X 6 QFN

TOP VIEW
R2OUTR3OUTR4OUTR5OUTR5INR4INR3INR2INR1IN
R6OUTR9OUTR8OUT
R10IN
R10OUT
R8INR9INR6INR7IN
T3OUT
T2OUT
T1OUT
GND
T4OUT
T5OUT
T6OUT
N.C.
T6IN
T5IN
T4IN
VDD
VSTBY
T1IN
T2IN
T3IN
Pin Configurations
PARTTEMP RANGEPIN-PACKAGE

38 TSSOP0°C to +70°CMAX3209ECUU
MAX3209EEUU
MAX3209EEGL
-40°C to +85°C
-40°C to +85°C
38 TSSOP
6 ✕6 40 QFN
MAX3209E
±15kV ESD-Protected, 12V, Dual RS-232 Serial Port
with Low-Power Standby for Motherboards/Desktops
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS

(VDD= +10.8V to +13.2V, VSTBY= +3V to +5.5V, C1 = C2 = 0.1µF, TA= TMINto TMAX, unless otherwise noted. Typical values are at= +25°C, VDD= +12V, VSTBY= +3.3V.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDD.........................................................................-0.3V to +15V
VSTBY.......................................................................-0.3V to +7V...........................................................................+0.3V to -15V
Input Voltages
T_IN......................................................................-0.3V to +7V
R_IN.................................................................................±30V
Output Voltages
T_OUT..............................................................................±15V
R_OUT.................................................-0.3V to (VSTBY+ 0.3V)
Short-Circuit Duration
T_OUT (one at a time)............................................Continuous
R_OUT (one at a time)............................................Continuous
Continuous Power Dissipation (TA= +70°C)
TSSOP (derate 11.8mW/°C above +70°C)..................941mW
QFN 6 ✕6mm (derate 23.2mW/°C above +70°C)......1860mW
Operating Temperature Ranges
MAX3209EC__...................................................0°C to +70°C
MAX3209EE__................................................-40°C to +85°C
Storage Temperature Range ............................-65°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C= +25°C
VDD= VSTBY= 0, VOUT= ±2V
VT_OUT= 0
Transmitter input at GND
T_IN, VSTBY= +3V to +5.25V
All transmitter outputs loaded with 3kΩto GND
T_IN
VDD= +12V, no load, all transmitter inputs at
VSTBY, all receiver inputs at VSTBYor uncon-
nected
R_OUT
CONDITIONS
2.4RS-232 Input Threshold High0.4RS-232 Input Threshold Low-2525Receiver Input Voltage Range300Transmitter Output Resistance±10±60RS-232 Output Short-Circuit
CurrentOutput Voltage Swing±5.0VSTBY- 0.3VOHROutput Voltage High
10.813.2VDD25Input Pull-Up Current2.1VIHTInput Logic Threshold High0.4VILTInput Logic Threshold Low5.5STBY
0.51IDDmA
Supply Current
UNITSMINTYPMAXSYMBOLPARAMETER

VSTBY= 3.3VV0.21RS-232 Input Hysteresis= +25°CkΩ357RS-232 Input Resistance= +25°C
Operating Voltage RangeV
VDD= 0, VSTBY= +3.3V, no load, all transmit-
ter inputs at VSTBY, all receiver inputs at VSTBY
or unconnected100ISTBYµA
R_OUT; ISINK= 1.6mAV0.4VOLROutput Voltage Low
VDD= 0, VSTBY= 5VµA0.05±5Receiver Output Leakage
Current
VSTBY- 0.6
ISOURCE= 40µA
ISOURCE= 1mA
RS-232 RECEIVER INPUTS
RS-232 TRANSMITTER OUTPUTS
TRANSMITTER LOGIC INPUTS
DC CHARACTERISTICS
RECEIVER LOGIC OUTPUTS
MAX3209E
±15kV ESD-Protected, 12V, Dual RS-232 Serial Port
with Low-Power Standby for Motherboards/Desktops
ELECTRICAL CHARACTERISTICS (continued)

(VDD= +10.8V to +13.2V, VSTBY= +3V to +5.5V, C1 = C2 = 0.1µF, TA= TMINto TMAX, unless otherwise noted. Typical values are at= +25°C, VDD= +12V, VSTBY= +3.3V.)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
ESD/BURST CHARACTERISTICS

Human Body Model±15
IEC 1000-4-2 (Contact Discharge)±8ESD Protection
IEC 1000-4-2 (Air-Gap Discharge)±15
Electrical Fast Transient/Burst
ImmunityIEC 1000-4-4±4kV
TRANSMITTER TIMING CHARACTERISTICS (Figure 1)

Data RateDRRL = 3kΩ to 7kΩ, CL = 50pF to 1000pF,
two transmitters switching460kbps
Mouse Driveability
T1IN = T2IN = GND, T3IN = VCC,
T3OUT loaded with 3kΩ to GND, T1OUT
and T2OUT loaded with 2.5mA each-5V
Transmitter Output Propagation
Delay, Low to HightPLHTCL = 1000pF1µs
Transmitter Output Propagation
Delay, High to LowtPHLTCL = 1000pF1µs
RL = 3kΩ to 7kΩ, VSTBY = 3.3V,
CL = 50pF to 470pF, TA = +25°C,
measured from +3V to -3V or -3V to +3V
Transmitter Output Slew RateSR
RL = 3kΩ to 7kΩ, VSTBY = 3.3V,
CL = 50pF to 1000pF, TA = +25°C,
measured from +3V to -3V or -3V to +3V
V/µs
RECEIVER TIMING CHARACTERISTICS

Receiver Output Propagation
Delay, Low to HightPLHRCL = 150pF0.41µs
Receiver Output Propagation
Delay, High to LowtPHLRCL = 150pF0.41µs
MAX3209E
±15kV ESD-Protected, 12V, Dual RS-232 Serial Port
with Low-Power Standby for Motherboards/Desktops

RECEIVER OUTPUT LOW VOLTAGE
vs. SINK CURRENT
MAX3209E-03
ISINK (mA)
RECEIVER OUTPUT LOW VOLTAGE (V)
RECEIVER OUTPUT HIGH VOLTAGE
vs. SOURCE CURRENT
MAX3209E-04
ISOURCE (mA)
RECEIVER OUTPUT HIGH VOLTAGE (V)20001000300040005000
SUPPLY CURRENT
vs. LOAD CAPACITANCE

MAX3209E-02
LOAD CAPACITANCE (pF)
SUPPLY CURRENT (mA)
120kbps
240kbps
460kbps
2 TRANSMITTERS AT DATA RATE
4 TRANSMITTERS AT 1/16 DATA RATE
3kΩ + CL
SUPPLY CURRENT vs. SUPPLY VOLTAGE
MAX3209E-01
SUPPLY VOLTAGE (V)
SUPPLY CURRENT (mA)
460kbps
240kbps
120kbps
C1 = C2 = 0.1μF
2 TRANSMITTERS AT DATA RATE
4 TRANSMITTERS AT 1/16 DATA RATE
ALL TRANSMITTERS AT 3kΩ + 1000pF
Typical Operating Characteristics

(VSTBY= +5V, VDD= +12V, C1 = C2 = 0.1µF, TA = +25°C, unless otherwise noted.)
Detailed Description
±15kV ESD Protection

As with all Maxim devices, ESD-protection structures
are incorporated on all pins to protect against electro-
static discharges (ESD) encountered during handling
and assembly. The MAX3209E driver outputs and
receiver inputs have extra protection against static
electricity found in normal operation. Maxim’s engi-
neers developed state-of-the-art structures to protect
these pins against ±15kV ESD, without damage. After
an ESD event, theMAX3209E continues working without
latchup.
ESD protection can be tested in several ways. The
transmitter outputs and receiver inputs are character-
ized for protection to the following:±15kV using the Human Body Model±8kV using the Contact-Discharge Method specified
in IEC 1000-4-2 (formerly IEC 801-2)±15kV using the Air-Gap Method specified in
IEC 1000-4-2 (formerly IEC 801-2)
ESD Test Conditions

ESD performance depends on a number of conditions.
Contact Maxim for a reliability report that documents
test setup, methodology, and results.
Human Body Model

Figure 2a shows the Human Body Model, and Figure
2b shows the current waveform it generates when dis-
charged into a low impedance. This model consists of
a 100pF capacitor charged to the ESD voltage of inter-
est, which is then discharged into the device through a
1.5kΩresistor.
IEC 1000-4-2

Since January 1996, all equipment manufactured
and/or sold in the European community has been
required to meet the stringent IEC 1000-4-2 specifica-
tion. The IEC 1000-4-2 standard covers ESD testing
and performance of finished equipment; it does not
specifically refer to integrated circuits. The MAX3209E
helps you design equipment that meets Level 4 (the
highest level) of IEC 1000-4-2, without additional ESD-
protection components.
The main difference between tests done using the
Human Body Model and IEC 1000-4-2 is higher peak
current in IEC 1000-4-2. Because series resistance is
lower in the IEC 1000-4-2 ESD test model (Figure 3a), the
ESD withstand voltage measured to this standard is gen-
erally lower than that measured using the Human Body
Model. Figure 3b shows the current waveform for the
±8kV IEC 1000-4-2 Level 4 ESD Contact-Discharge test.
The Air-Gap test involves approaching the device with a
charge probe. The Contact-Discharge method connects
the probe to the device before the probe is energized.
Machine Model

The Machine Model for ESD testing uses a 200pF stor-
age capacitor and zero-discharge resistance. It mimics
the stress caused by handling during manufacturing
and assembly. Of course, all pins (not just RS-232
MAX3209E
±15kV ESD-Protected, 12V, Dual RS-232 Serial Port
with Low-Power Standby for Motherboards/Desktops
Pin Description
PIN
TSSOPQFN
NAMEFUNCTION

1–5, 15–1911–15, 36–40R_OUTTTL/CMOS Receiver Outputs
6, 7, 8, 12, 13,1, 2, 3, 7, 8, 9T_INTTL/CMOS Transmitter InputsVSTBYStandby Power Supply for R5 and R105VDD+12V Single-Supply Voltage6C+Positive Terminal of the Inverting Charge-Pump Capacitor
20–24, 34–3816–20, 31–35R_INRS-232 Receiver Inputs
25, 26, 27, 31,
32, 3322, 24, 28, 30T_OUTRS-232 Transmitter Outputs25GNDGround (for QFN package, connect the exposed pad and corner tabs to GND)26C-Negative Terminal of the Inverting Charge-Pump Capacitor27V--12V Generated by the Inverting Charge Pump10, 21N.C.No Connection. Not internally connected.
MAX3209E
±15kV ESD-Protected, 12V, Dual RS-232 Serial Port
with Low-Power Standby for Motherboards/Desktops

inputs and outputs) require this protection during man-
ufacturing. Therefore, the Machine Model is less rele-
vant to the I/O ports than are the Human Body Model
and IEC 1000-4-2.
±4kV Electrical Fast Transient/Burst Testing
(IEC 1000-4-4)

IEC 1000-4-4 Electrical Fast Transient/Burst (EFT/B) is
an immunity test for the evaluation of electrical and
electronic systems during operating conditions. The
test was adapted for evaluation of integrated circuits
with power applied. Repetitive fast transients with
severe pulsed EMI were applied to signal and control
ports. Over 15,000 distinct discharges per minute are
sent to each interface port of the IC or equipment under
test (EUT) simultaneously with a minimum test duration
time of one minute. This simulates stress due to dis-
placement current from electrical transients on AC
mains, or other telecommunication lines in close prox-
imity. Short rise times and very specific repetition rates
are essential to the validity of the test.
Stress placed on the EUT is severe. In addition to the
controlled individual discharges placed on the EUT,
extraneous noise and ringing on the transmission line
can multiply the number of discharges as well as
increase the magnitude of each discharge. All cabling
was left unterminated to simulate worst case reflections.
The MAX3209E was set up as specified in IEC 1000-4-4
and the Typical Operating Circuitof this data sheet.
The amplitude, pulse rise time, pulse duration, pulse
repetition period, burst duration, and burst period
(Figure 5) of the burst generator were all verified with a
tF2
tF1
tPHLtPLH
tR1
tR2
1.5V
3.0V
DRIVER
INPUT
VOUT
VOH
VOL
3.3V
3.0V
-3.0V
-3.3VCLSIGNAL
GENERATOR
Figure 1. Slew-Rate Test Circuit and Timing Diagram
CHARGE-CURRENT
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
100pF
1MΩ
RD
1500Ω
HIGH-
VOLTAGE
SOURCE
DEVICE
UNDER
TEST
IP 100%
90%
36.8%
tRLTIME
tDL
CURRENT WAVEFORM
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
10%
AMPERES
CHARGE-CURRENT
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
150pF
50MΩ to 100MΩ
RD
330Ω
HIGH-
VOLTAGE
SOURCE
DEVICE
UNDER
TEST
Figure 3a. IEC 1000-4-2 ESD Test Model
Figure 2b. Human Body Model Current Waveform
Figure 2a. Human Body ESD Test Model
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