MAX2682EUT ,PLASTIC ENCAPSULATED DEVICESTable of Contents I. ........Device Description V. ........Quality Assurance Information II ..
MAX2682EUT ,PLASTIC ENCAPSULATED DEVICESTable of Contents I. ........Device Description V. ........Quality Assurance Information II ..
MAX2682EUT ,PLASTIC ENCAPSULATED DEVICES MAX2682EUT Rev. A RELIABILITY REPORT FOR MAX2682EUT PLASTIC ENC ..
MAX2682EUT+ ,400MHz to 2.5GHz, Low-Noise, SiGe Downconverter MixersEVALUATION KIT AVAILABLEMAX2680/MAX2681/ 400MHz to 2.5GHz, Low-Noise,MAX2682 SiGe Downconverter Mix ..
MAX2682EUT+T ,400MHz to 2.5GHz, Low-Noise, SiGe Downconverter Mixersfeatures a low-power shutdown mode in which it typically draws less than 0.1μA of supply current. C ..
MAX2682EUT-T ,400MHz to 2.5GHz / Low-Noise / SiGe Downconverter MixersFeaturesThe MAX2680/MAX2681/MAX2682 miniature, low-cost,' 400MHz to 2.5GHz Operationlow-noise downc ..
MAX6033BAUT25#TG16 ,Ultra-High-Precision SOT23 Series Voltage ReferenceELECTRICAL CHARACTERISTICS—V = 3.000VOUT (V = 5V, C = 0.1µF, I = 0A, T = T to T , unless otherwise ..
MAX6034AEXR25+T ,Precision, Micropower, Low-Dropout, SC70 Series Voltage ReferenceApplicationsMAX6034AEXR41-T -40°C to +85°C 3 SC70-3 AJLHand-Held EquipmentMAX6034BEXR41-T -40°C to ..
MAX6034BEXR25+ ,Precision, Micropower, Low-Dropout, SC70 Series Voltage ReferenceFeaturesThe MAX6034 family of precision, low-dropout, microp-♦ Ultra-Small, 3-Pin SC70 Packageower ..
MAX6035AAUR50+ ,High-Supply-Voltage, Precision Voltage Reference in SOT23features a proprietary 10mA Source Current, 2mA Sink Currenttemperature coefficient curvature-corr ..
MAX6035AAUR50+T ,High-Supply-Voltage, Precision Voltage Reference in SOT23ELECTRICAL CHARACTERISTICS—MAX6035_AUR25 (2.5V)(V = 5V, I = 0, T = T to T , unless otherwise noted. ..
MAX6035BAUR25+ ,High-Supply-Voltage, Precision Voltage Reference in SOT23Applications PART VOLTAGE(ppm/°C) ACCURACY(V)4mA to 20mA Industrial Digital Multimeters (-40°C to + ..
MAX2682EUT
PLASTIC ENCAPSULATED DEVICES
MAX2682EUT Rev. A RELIABILITY REPORT FOR
MAX2682EUT PLASTIC ENCAPSULATED DEVICES October 4, 2002
MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086
Written by Reviewed by Jim Pedicord Bryan J. Preeshl Quality Assurance Quality Assurance
Conclusion The MAX2682 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality and reliability standards.
Table of Contents
I. ........Device Description V. ........Quality Assurance Information
II. ........Manufacturing Information VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information ......Attachments
I. Device Description A. General The MAX2682 miniature, low-cost, low-noise downconverter mixer is designed for low-voltage operation and is ideal for use in portable communications equipment. Signals at the RF input port are mixed with signals at the local oscillator (LO) port using a double-balanced mixer. This downconverter mixer operates with RF input frequencies between 400MHz and 2500MHz, and downconvert to IF output frequencies between 10MHz and 500MHz.
The MAX2682 operates from a single +2.7V to +5.5V supply, allowing it to be powered directly from a 3-cell NiCd or a 1-cell Lithium battery. This device offers a wide range of supply currents and input intercept (IIP3) levels to optimize system performance. Additionally, this device features a low-power shutdown mode in which it typically draws less than 0.1µA of supply current. Consult the Selector Guide for various combinations of IIP3 and supply current.
The MAX2682 is manufactured on a high-frequency, low-noise, advanced silicon-germanium process and is offered in the space-saving 6-pin SOT23 package. B. Absolute Maximum Ratings Item Rating VCC to GND -0.3V to +6.0V RFIN Input Power (50½ Source) +10dBm LO Input Power (50½ Source) +10dBm SHDN, IFOUT, RFIN to GND -0.3V to (VCC + 0.3V) LO to GND (VCC - 1V) to (VCC + 0.3V) Continuous Power Dissipation (TA = +70°C) SOT23-6 (derate 8.7mW/°C above +70°C) 696mW Operating Temperature Range -40°C to +85°C Junction Temperature +150°C Storage Temperature Range -65°C to +160°C Lead Temperature (soldering, 10sec) +300°
II. Manufacturing Information A. Description/Function: 400MHz to 2.5GHz, Low-Noise, SiGe Downconverter Mixers B. Process: GST33 C. Number of Device Transistors: 83 D. Fabrication Location: Oregon, USA E. Assembly Location: Malaysia or Thailand F. Date of Initial Production: October, 1998
III. Packaging Information A. Package Type: 6-Pin SOT B. Lead Frame: Copper C. Lead Finish: Solder Plate D. Die Attach: Silver-filled Epoxy E. Bondwire: Gold (1.0 mil dia.) F. Mold Material: Epoxy with silica filler G. Assembly Diagram: Buildsheet # 05-7001-0322 H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1
IV. Die Information A. Dimensions: 36 x 33 mils B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: Poly / Au D. Backside Metallization: None E. Minimum Metal Width: Metal1: 1.2; Metal2: 1.2; Metal3: 2.8; Metal4: 5.6 microns (as drawn) F. Minimum Metal Spacing: Metal1: 1.3; Metal2: 1.4; Metal3: 2.6; Metal4: 2.6 microns (as drawn) G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO2
V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord (Reliability Lab Manager) Bryan Preeshl (Executive Director of QA) Kenneth Huening (Vice President) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation A. Accelerated Life Test The results of the 150°C biased (static) life test are shown in
Table 1. Using these results, the Failure Rate (l) is calculated as follows: l = 1 = 1.83 (Chi square value for MTTF upper limit) MTTF 192 x 9823 x 45 x 2 Temperature Acceleration factor assuming an activation energy of 0.8eV l = 10.78 x 10-8 l = 10.78 F.I.T. (60% confidence level @ 25°C) This low failure rate represents data collected from Maxim’s reliability qualification and monitor programs. Maxim also performs weekly Burn-In on samples from production to assure reliability of its processes. The reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on rejects from lots exceeding this level. The aBurn-In Schematic shows the static circuit used for this test. Maxim also performs 1000 hour life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1M). B. Moisture Resistance Tests Maxim evaluates pressure pot stress from every assembly process during qualification of each new design. Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85°C/85%RH or HAST tests are performed quarterly per device/package family. C. E.S.D. and Latch-Up Testing The WR22-2 die type has been found to have all pins able to withstand a transient pulse of <250V, per Mil-Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of ±50mA.
Table 1 Reliability Evaluation Test Results
MAX2682EUT
TEST ITEM TEST CONDITION FAILURE SAMPLE NUMBER OF IDENTIFICATION SIZE FAILURES
Static Life Test (Note 1) Ta = 135°C DC Parameters 45 0 Biased & functionality Time = 192 hrs.
Moisture Testing (Note 2) Pressure Pot Ta = 121°C DC Parameters 77 0 P = 15 psi. & functionality RH= 100% Time = 168hrs. 85/85 Ta = 85°C DC Parameters 77 0 RH = 85% & functionality Biased Time = 1000hrs.
Mechanical Stress (Note 2) Temperature -65°C/150°C DC Parameters 77 0 Cycle 1000 Cycles Method 1010 Note 1: Life Test Data may represent plastic D.I.P. qualification lots. Note 2: Generic process/package data.
Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/ 1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 Pin combinations to be tested. a. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. b. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1, or VCC2) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. c. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open.
TERMINAL B
TERMINAL A
CURRENT
PROBE
(NOTE 6)
R = 1.5kWW
C = 100pf
SHORT
R2
S2 R1
