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MAX2240EBL
2.5GHz, +20dBm Power Amplifier IC in UCSP Package
General DescriptionThe MAX2240 single-supply, low-voltage power amplifi-
er (PA) IC is designed specifically for applications in
the 2.4GHz to 2.5GHz frequency band. The PA is com-
pliant with Bluetooth, HomeRF, and 802.11 standards,
as well as other FSK modulation systems. The PA pro-
vides a nominal +20dBm (100mW) output power in the
highest power mode.
The PA includes a digital power control circuit to greatly
simplify control of the output power. Four digitally con-
trolled output power levels are provided: from +3dBm
to +20dBm. A digital input controls the active or shut-
down operating modes of the PA. In the shutdown
mode, the current reduces to 0.5µA.
The IC integrates the RF input and interstage matching
to simplify application of the IC. Temperature and sup-
ply-independent biasing are also included to provide
stable performance under all operating conditions.
The IC operates from a +2.7V to +5V single-supply volt-
age. No negative bias voltage is required. Current con-
sumption is a modest 105mA at the highest power
level.
The part is packaged in the ultra-chipscale package
(UCSP), significantly reducing the required PC board
area. The chip occupies only a 1.56mm x 1.56mm area.
The 3 x 3 array of solder bumps are spaced with a
0.5mm bump pitch.
________________________ApplicationsBluetooth
HomeRF
802.11 FHSS WLAN
2.4GHz ISM Proprietary Radios
Features2.4GHz to 2.5GHz Frequency RangeHigh +20dBm Output Power2-Bit Digital Power Control: 4 Output LevelsIntegrated Input Match to 50ΩLow 105mA Operating Current0.5µA Low-Power Shutdown Mode Current+2.7V to +5V Single-Supply OperationUltra-Chipscale Package
(1.56mm x 1.56mm)
MAX2240
in UCSP Package
Typical Application Circuit/Functional Diagram
Ordering Information*UCSP reliability is integrally linked to the user’s assembly
methods, circuit board material, and environment. Refer to the
UCSP Reliability Notice in the UCSP Reliability section of this
data sheet for more information.
Pin Configuration appears at end of data sheet.
MAX2240
2.5GHz, +20dBm Power Amplifier IC
in UCSP Package
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
BIAS, VCC, RFOUT to GND......................................-0.3V to +6V
Input Voltages
(SHDN, D0, D1, to GND).......................-0.3V to (VBIAS+ 0.3V)
(RFIN to GND)....................................................-0.7V to +0.7V
Input Current (SHDN, D0, D1)..........................................±10mA
RF Input Power (RFIN)....................................................+10dBm
Continuous Power Dissipation (TA= +85°C)
9-Pin UCSP...................................................................810mW
Operating Temperature Range...........................-40°C to +85°C
Storage Temperature Range.............................-65°C to +150°C
MAX2240
2.5GHz, +20dBm Power Amplifier IC
in UCSP Package
AC ELECTRICAL CHARACTERISTICS(MAX2240 EVkit, VCC= +2.7V to +5V, PRFIN= 0dBm to +4dBm, fRFIN= 2.4GHz to 2.5GHz, SHDN= VCC, TA= +25°C. Typical values
measured at VCC= +3.2V, PRFIN= +3dBm, fRFIN= 2.45GHz, unless otherwise noted.)
Note 1:Limits are 100% production tested at TA= +25°C. Limits over the entire operating temperature range are guaranteed by
design and characterization but are not production tested.
Note 2:Supply current is measured with RF power applied to the input.
Note 3:Measured with an output-matching network to minimize the 2nd and 3rd harmonics (see Applicationssection).
Note 4:Power steps between adjacent power levels. All other operating conditions remain constant during power step change.
Note 5:Output measured in 100kHz RBW. Test signal modulation shall comply with GFSK, BT = 0.5, 1-bit/symbol, 1Mbps, frequency
deviation = 175kHz.
Note 6:The total turn-on time for the PA output power to settle within 1dB of the final value.
Note 7:The total turn-off time for the PA output power to drop to -10dBm.
Note 8:After removal of the load mismatch, the PA returns to operation under normal conditions.
Note 9:Guaranteed by design and characterization.
MAX2240
2.5GHz, +20dBm Power Amplifier IC
in UCSP PackageOUTPUT POWER vs. PINC2 VOLTAGE
MAX2240 toc04
VPINC2 (V)
OUTPUT POWER (dBm)
MAX2240 toc07
INPUT POWER (dBm)
OUTPUT POWER (dBm)
OUTPUT POWER vs. INPUT POWERMAX2240 toc08
SUPPLY CURRENT (mA)
INPUT POWER (dBm)
SUPPLY CURRENT vs. INPUT POWERMAX2240 toc09
FSK MODULATED OUTPUT SPECTRUMCENTER = 2.45GHz
SPAN = 5MHz
OUTPUT POWER (dBm)
Typical Operating Characteristics(MAX2240 EV kit, VCC= +3.2V, PRFIN= +3dBm, fRFIN= 2.45GHz, SHDN= VCC, TA= +25°C, unless otherwise noted. See Table 1
for power level settings P1, P2, P3, P4.)
MAX2240
2.5GHz, +20dBm Power Amplifier IC
in UCSP Package
Pin Descriptionypical Operating Characteristics(continued)(MAX2240 EV kit, VCC= +3.2V, PRFIN= +3dBm, fRFIN= 2.45GHz, SHDN= VCC, TA= +25°C, unless otherwise noted. See Table 1
_______________Detailed DescriptionThe MAX2240 PA is guaranteed to operate over a
2.4GHz to 2.5GHz frequency range with a +2.7V to
+5V single supply. The PA provides a nominal +20dBm
output power in the highest power mode setting (D0 =
D1 = 1). The signal path consists of two amplifier
stages: an input amplifier stage and a PA stage. A
matching circuit is provided between the two stages to
match the amplifiers’ impedance. The PA also contains
bias circuits that interface to external logic commands
(D0, D1, and SHDN) to control output power and
power-up/down of the amplifier.
The input amplifier is an AC-coupled variable gain
amplifier (VGA) with its input port internally matched to
50Ω. The amplifier is AC-coupled; hence, a DC block-
ing capacitor is not required at the RFIN port. The VGA
gain is varied by changing the bias current through a
current driver circuit. The current driver circuit provides
four levels (magnitudes) of precisely controlled currents
to the VGA, depending on power control digital inputs
D0 and D1. Each current level presents a different
power level to the final amplifier stage, therefore con-
trolling the output power.
The digital power control circuit of the PA greatly sim-
plifies control of the output power. The two digital bits
D0 and D1 control the output power in four steps with
approximately a 6dB/step. The PA is optimized to pro-
vide power control steps within a 2dB/step to 8.6dB/
step over the full temperature range and VCCand RF
input power variations. Table 1 shows the D0 and D1
digital control states, the corresponding nominal output
power, and the typical current consumption of the IC.
The bias circuit provides separate bias voltages and
currents to the amplifier stages. An internal lowpass RC
filter isolates the bias circuit from being corrupted by
the RF signals. The bias circuit is optimized to minimize
output power variations due to the variations in temper-
ature, VCC, and RF power input. The bias circuit design
also ensures the stability of the PA when connected to
high VSWR loads over all power levels. A digital low at
the SHDNport turns the amplifier down with a current
consumption of less than 1µA.
The MAX2240 integrates all the RF matching compo-
nents on-chip, except for the output stage match. The
internal input match enables the RF input with 50Ω
impedance to be directly connected to the RFIN port
through a 50Ωtransmission line.
The MAX2240 PA requires an external match at the
RFOUT port to optimize the amplifier for output power
and efficiency. For an optimum match at 2.45GHz, the
load impedance at the RFOUT port is approximately
15Ω+ j18Ω(Figure 1). There are numerous ways of
transforming 50Ωto the optimum impedance. The out-
put matching in the typical operating circuit is imple-
mented using a series transmission line of 75Ωand
electrical length of 26°, and an open-ended shunt stub
of 65Ωand 41°in length. The shunt stub also reduces
the second harmonic at the output.
Applications InformationThe MAX2240 power amplifier requires a relatively
small number of external components. These compo-
nents are small, low-cost surface-mount passive ele-
ments. The capacitors are all 0402 multilayer ceramic
chip capacitors. These capacitors possess excellent
high-frequency properties and are cost effective. The
Typical Application Circuit is shown on page 1.
The inductor is a Q (>25) 0603 chip inductor. All trans-
mission lines are simple microstrip structures printed
on the PC board.
Power-Supply ConsiderationsThe MAX2240 is designed to operate from a single, posi-
tive supply voltage (VCC). Three pins are fed by the sup-
ply voltage: BIAS, VCC, and RFOUT. Each supply
voltage connection requires a separate RF bypass
capacitor for proper operation. Use a 0.1µF bypass
capacitor to filter the supply at the common VCCnode
(see Typical Application Circuit).
BIAS requires a 220pF capacitor to ground. Locate one
end of the capacitor as close as possible to BIAS and
the other end of the capacitor near GND1 with several
vias to the ground plane.
VCCpowers the amplifier 1st stage output. A 1.2nH
inductor in series with VCCand the VCCbypass capaci-
tor is needed for optimal output power and efficiency.
An 18pF bypass capacitor to ground is required at the
supply end of the 1.2nH inductor.
RFOUT is connected to the power supply through a
choke inductor (through transmission line section T1).
Select a choke with a self-resonant frequency at or
slightly below 2.4GHz. A 220pF bypass capacitor is
needed at the supply voltage end of the inductor.
MAX2240
2.5GHz, +20dBm Power Amplifier IC
in UCSP Package
