MAX2208EBS+T10 ,RF Power Detectors in UCSPELECTRICAL CHARACTERISTICS (MAX2205–MAX2208)(V = +2.7V to +5.0V, SHDN = +2.0V, no RF signal applied ..
MAX2208EBS-T ,RF Power Detectors in UCSPELECTRICAL CHARACTERISTICS (MAX2205)(MAX2205 EV kit, V = +2.7V to +5.0V, SHDN = +2.0V, f = 800MHz t ..
MAX2208EBS-T ,RF Power Detectors in UCSPELECTRICAL CHARACTERISTICS (MAX2205)(MAX2205 EV kit, V = +2.7V to +5.0V, SHDN = +2.0V, f = 800MHz t ..
MAX2209EBS+ ,RF Power DetectorFeaturesThe MAX2209 is a wideband (800MHz to 2GHz) RF S -25dBm to 0dBm Power Detection Rangepower d ..
MAX2209EBS+T ,RF Power DetectorApplications Ordering InformationDual-Band WCDMA HandsetsPIN- TOP PART TEMP RANGEH ..
MAX220CPE ,+5V-Powered, Multichannel RS-232 Drivers/ReceiversELECTRICAL CHARACTERISTICS—MAX220/222/232A/233A/242/243(V = +5V ±10%, C1–C4 = 0.1µF‚ MAX220, C1 = 0 ..
MAX5294EUD ,Buffered, Fast-Settling, Dual, 12-/10-/8-Bit, Voltage-Output DACsApplicationsPART TEMP RANGE PIN-PACKAGEPortable InstrumentationMAX5290AEUD* -40°C to +85°C 14 TSSOP ..
MAX529CAG ,Octal, 8-Bit, Serial DACs with Output BufferFeatures
' Now Available in Space-Saving SSOP
' 8 Buffered Noninverting Outputs
' Buffer D ..
MAX529CPP ,Octal, 8-Bit, Serial DACs with Output BufferGeneral Description
The MAX528/MAX529 are monolithic devices combining
an octal 8-bit, digital- ..
MAX529CWG ,Octal, 8-Bit, Serial DACs with Output BufferELECTRICAL CHARACTERISTICS - MAX528
(Unbuffered Mode: VDD = +12V, Vss = OV; Full-Buffered Mode: ..
MAX529CWG ,Octal, 8-Bit, Serial DACs with Output BufferELECTRICAL CHARACTERISTICS - MAX528
(Unbuffered Mode: VDD = +12V, Vss = OV; Full-Buffered Mode: ..
MAX529CWG+ ,Octal, Serial, 8-Bit DAC with Output BuffersELECTRICAL CHARACTERISTICS - MAX528
(Unbuffered Mode: VDD = +12V, Vss = OV; Full-Buffered Mode: ..
MAX2205EBS+T-MAX2205EBS+T10-MAX2205EBS-T10-MAX2206EBS+-MAX2206EBS+T-MAX2206EBS+T10-MAX2206EBS-T-MAX2208EBS+T-MAX2208EBS+T10-MAX2208EBS-T
RF Power Detectors in UCSP
General DescriptionThe MAX2205–MAX2208 wideband (800MHz to 2GHz)
power detectors are ideal for GSM/EDGE (MAX2206),
TDMA (MAX2207), and CDMA (MAX2205/MAX2208)
applications. The MAX2206/MAX2207/MAX2208 take an
RF signal from a directional coupler at the input, and out-
put a highly repeatable voltage. The output voltage
increases monotonically with increasing input power. The
output is compensated for temperature and process
shifts, reducing the worst-case variation to less than
±1dB at full power and ±2.5dB at the lowest power.
The MAX2206 features 40dB dynamic range, making
it ideally suited to GSM/EDGE applications. The
MAX2207 offers reduced current consumption for TDMA
applications. The MAX2205/MAX2208 each have an inte-
grated filter to allow for average power detection of
CDMA signals over a 25dB dynamic range. The
MAX2206/MAX2207/MAX2208 offer internal 50Ωtermina-
tion for interfacing with a directional coupler. The
MAX2205 has a high-impedance input to provide a low-
loss resistive tap in CDMA applications. All devices allow
the user to control the averaging time constant externally.
The MAX2205–MAX2208 come in a space-saving 2 ✕ 2,
0.5mm-pitch UCSP™ and require only three external
components.
ApplicationsDual-Band GSM/EDGE Handsets
Dual-Band CDMA/TDMA Handsets
WCDMA Handsets
PA Modules
FeaturesSpace-Saving 2 ✕ 2 UCSP Occupies Only 1mm2Internal Temperature Compensation Gives ±0.3dB
Detection AccuracyNo External Filter or Op Amp RequiredPower-Detection Range
40dB (MAX2206)
25dB (MAX2205/MAX2207/2208)
MAX2205–MAX2208
RF Power Detectors in UCSP TOP VIEW
GND
(B1)
OUT
(B2)
TEMPERATURE-
COMPENSATED
PEAK
DETECTOR
SHUTDOWN
LOGIC
UCSPTO ADC
10kΩ (MAX2205)
240Ω (MAX2206/MAX2207/MAX2208)
27pF
680Ω (MAX2205)
10Ω (MAX2206)
0Ω (MAX2207/MAX2208)
47pFFROM
COUPLER/TAP
(MAX2206/MAX2207/MAX2208)
SHDN LOGIC INPUT
RFIN/
SHDN
(A1)
VCC
(A2)
VCC
CFILTER
(OPTIONAL)
FROM PA
OUTPUT
(MAX2205)
MAX2205
MAX2206
MAX2207
MAX2208
Pin Configuration/Functional
Diagram/Typical Operating Circuit19-2015; Rev 6; 9/06
EVALUATION KITAVAILABLE
Ordering InformationUCSP is a trademark of Maxim Integrated Products, Inc.
*Requires solder temperature profile described in the Absolute
Maximum Ratings section.
PARTTEMP RANGEBUMP-PACKAGE
MAX2205EBS-40°C to +85°C2 × 2 UCSP*
MAX2205EBS+-40°C to +85°C2 × 2 UCSP*
MAX2206EBS-40°C to +85°C2 × 2 UCSP*
MAX2206EBS+-40°C to +85°C2 × 2 UCSP*
MAX2207EBS-40°C to +85°C2 × 2 UCSP*
MAX2208EBS-40°C to +85°C2 × 2 UCSP*
MAX2208EBS+-40°C to +85°C2 × 2 UCSP*
2 ✕ 2 UCSP
1.01 mm ✕1.01 mmIndicates lead-free package.
MAX2205–MAX2208
RF Power Detectors in UCSP
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS (MAX2205–MAX2208)(VCC= +2.7V to +5.0V, SHDN= +2.0V, no RF signal applied, TA= -40°C to +85°C. Typical values are at VCC= +2.85V and = +25°C, unless otherwise noted.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCCto GND...........................................................-0.3V to +6.5V
RFIN/SHDNto GND....................................-0.3V to (VCC+ 0.3V)
RF Input Power (800MHz)
(MAX2206/MAX2207/MAX2208).................................+20dBm
RF Input Power (2GHz)
(MAX2206/MAX2207/MAX2208).................................+17dBm
RF Input Voltage (800MHz) (MAX2205)..............................1.5VP
RF Input Voltage (2GHz) (MAX2205)..................................0.8VP
Continuous Power Dissipation (TA= +70°C)
2 ✕2 UCSP (derate 3.8mW/°C above +70°C)............303mW
Operating Temperature Range...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range.............................-65°C to +160°C
Bump Temperature (soldering) (Note 1)
Infrared (15s) (leaded)................................................+220°C
Vapor Phase (60s) (leaded)........................................+215°C
Infrared (15s) (lead-free).............................................+260°C
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITSSupply VoltageVCC2.75.0V
MAX22063.55.5Idle Supply CurrentIIDLEMAX2205/MAX2207/MAX220823.5mA
Shutdown Supply CurrentI SHDNSHDN = 0V0.510µA
OUT Voltage During ShutdownVOUTSHDN = 0V0.01V
Logic-High ThresholdVH2.0V
Logic-Low ThresholdVL0.6V
IIHSHDN = +2.0V-1+10SHDN Input CurrentIILSHDN = +0.6V-1+1µA
Output Current Source CapabilityMAX2206/MAX2207, VOUT = +2.5V400µA
Output Current Sink CapabilityMAX2206/MAX2207, VOUT = 0V300µA
AC ELECTRICAL CHARACTERISTICS (MAX2205)(MAX2205 EV kit, VCC= +2.7V to +5.0V, SHDN= +2.0V, fRF= 800MHz to 2GHz, 50Ωsystem, TA= -40°C to +85°C. Typical values
are at VCC= +2.85V and TA= +25°C, unless otherwise noted.) (Note 2)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITSRF Input FrequencyfRF8002000MHz
Turn-On TimetON2µs
Response TimetR(Note 3)15µs
High input power
(Note 4)±0.3±1
Variation Due to TemperatureVCC = +2.85V,
TA = -40°C to +85°CLow input power
(Note 5)±1.3±2.5
MAX2205–MAX2208
RF Power Detectors in UCSP
Note 1:This device is constructed using a unique set of packaging techniques that imposes a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020 rev. C or later, paragraph 7.6, Table 3 for IR/VPR and convection
reflow. Preheating is required. Hand or wave soldering is not allowed.
Note 2:Specifications over TA= -40°C to +85°C are guaranteed by design. Production tests are performed at TA= +25°C.
Note 3:Response time is taken from the time the RF signal is applied to 90% of the final value of VOUT.
Note 4:At 800MHz, output voltage is held at a value that nominally results from the final value of +31dBm input power. Deviation from
+31dBm is specified. At 2GHz, output voltage is held at a value that nominally results from +28dBm input power. Deviation
from +28dBm is specified.
Note 5:At 2GHz, output voltage is held 22dB lower than specified in Note 4. At 800MHz, output voltage is held 25dB lower than spec-
ified in Note 4.
Note 6:At 800MHz, output voltage is held at a value that nominally results from +15dBm input power. Deviation from +15dBm is
specified. At 2GHz, output voltage is held at a value that nominally results from +13dBm input power. Deviation from +13dBm
is specified.
Note 7:For MAX2206, the output voltage is held at 40dB lower input power than specified in Note 6; for MAX2207/MAX2208, output
voltage is held at a value that nominally results from 25dB lower input power than specified in Note 6. Deviation from the
nominal input power is specified.
AC ELECTRICAL CHARACTERISTICS (MAX2206/MAX2207/MAX2208)(MAX2206/MAX2207/MAX2208 EV kit, VCC= +2.7V to +5.0V, SHDN= 2.0V, fRF= 800MHz to 2GHz, 50Ωsystem, TA= -40°C to
+85°C. Typical values are at VCC= +2.85V and TA= +25°C, unless otherwise noted.) (Note 2)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITSRF Input FrequencyfRF8002000MHz
RF Input VSWRVSWR2:1
Turn-On TimetON2µs
MAX2206/MAX2207300nsResponse Time (Note 3)tRMAX220815µsi g h i np ut p ow er ( N ote 6) ±0.3±1Variation Due to TemperatureVCC = +2.85V,
TA = -40°C to +85°CLow i np ut p ow er ( N ote 7) ±1.3±2.5dB
Typical Operating Characteristics(MAX2206/MAX2207/MAX2208 EV kit, TA = +25°C, unless otherwise noted.)
MAX2206
OUTPUT VOLTAGE vs. INPUT POWER
MAX2205/06/07/08 toc01
POWER (dBm)
OUTPUT VOLTAGE (V)
VCC = +2.7V to +3.5V
fRF = 800MHz
TA = -40°C TO +85°C
VCC = +3.5V
TA = +85°C
VCC = +2.7V
TA = -40°C
MAX2206
OUTPUT VOLTAGE vs. INPUT POWER
MAX2205/06/07/08 toc02
POWER (dBm)
OUTPUT VOLTAGE (V)
VCC = +2.7V to +3.5V
fRF = 2GHz
TA = -40°C TO +85°C
VCC = +3.5V
TA = +85°C
VCC = +2.7V
TA = -40°C265
MAX2206
RESPONSE TIME vs. TEMPERATURE
MAX2205/06/07/08 toc03
TEMPERATURE (°C)
RESPONSE TIME (ns)
VCC = +2.7V
VCC = +3.5VVCC = +3.0V
fRF = 900MHz
PIN = +15dBm
MAX2205–MAX2208
RF Power Detectors in UCSPMAX2207/MAX2208
OUTPUT VOLTAGE vs. INPUT POWER
MAX2205/06/07/08 toc04
POWER (dBm)
OUTPUT VOLTAGE (V)
VCC = +2.7V to +3.5V
fRF = 800MHz
TA = -40°C TO +85°C
VCC = +3.5V
TA = +85°C
VCC = +2.7V
TA = -40°C
MAX2207/MAX2208
OUTPUT VOLTAGE vs. INPUT POWER
MAX2205/06/07/08 toc05
POWER (dBm)
OUTPUT VOLTAGE (V)
VCC = +2.7V to +3.5V
fRF = 2GHz
TA = -40°C TO +85°C
VCC = +3.5V
TA = +85°C
VCC = +2.7V
TA = -40°C
MAX2207
RESPONSE TIME vs. TEMPERATURE
MAX2205/06/07/08 toc06
TEMPERATURE (°C)
RESPONSE TIME (ns)
fRF = 900MHz
PIN = +15dBm
VCC = +3.5V
VCC = +3.0V
VCC = +2.7V
MAX2205/MAX2208
RESPONSE TIME vs. TEMPERATURE
MAX2205/06/07/08 toc07
TEMPERATURE (°C)
RESPONSE TIME (
fRF = 900MHz
PIN = +15dBm (MAX2208)
PIN = +31dBm (MAX2205)
VCC = +2.7V
VCC = +3.0V
VCC = +3.5V
MAX2205
OUTPUT VOLTAGE vs. INPUT POWER
MAX2205/06/07/08 toc08
INPUT POWER (dBm)
OUTPUT VOLTAGE (V)
VCC = +2.7V to +3.5V
fRF = 836MHz
TA = -40°C to +85°C
MAX2205 EV KIT
VCC = +3.5V
TA = +85°C
VCC = +2.7V
TA = -40°C
MAX2205
OUTPUT VOLTAGE vs. INPUT POWER
MAX2205/06/07/08 toc09
INPUT POWER (dBm)
OUTPUT VOLTAGE (V)
VCC = +2.7V to +3.5V
fRF = 1880MHz
TA = -40°C to +85°C
MAX2205 EV KIT
VCC = +3.5V
TA = +85°C
VCC = +2.7V
TA = -40°C
Typical Operating Characteristics (continued)(MAX2206/MAX2207/MAX2208 EV kit, TA = +25°C, unless otherwise noted.)
Pin Description
PINNAMEFUNCTIONRFIN/SHDNRF Input and Shutdown Logic Input. AC-couple the RF input to this pin and apply the shutdown logic
input through a resistor. Drive low to turn the part off, drive high, or connect to VCC to turn the part on.VCCPower-Supply Pin. Bypass to GND with a capacitor as close to the bump as possible.GND
Ground Connection. Multiple ground vias placed as close to the IC as possible should be used to
connect the ground pin to the ground plane. Connect to PC board ground plane with as low
inductance as possible.OUTDetector Output
Applications InformationThe MAX2205–MAX2208 have internal termination
resistors for use with directional couplers. The applica-
tion circuit is shown in Figure 1. The output of the
detector goes to an op amp in an analog GSM power-
control scheme, or to an ADC in other systems such as
TDMA or discrete-time GSM power control.
The MAX2205 has high-input impedance for use with
high-value resistive tapping from a CDMA power ampli-
fier. This coupling method is the lowest cost and lowest
loss when used with an isolator. The application circuit
is shown in Figure 2. Connect CFILTERfrom the
MAX2205 output to GND to reduce residual amplitude
ripple. For IS98A reverse channel signal with peak-to-
avg ratio of 3.9dB, a 1.5nF capacitor gives 43mVP-Prip-
ple at 28dBm PA output and 390µs response time. For
CDMA2000 (pilot + DCCH) with peak-to-avg ratio of
5.4dB, the ripple is about 65mVP-Pat 26dBm PA output.
The MAX2205 input impedance is listed in Table 1.
LayoutAs with any RF circuit, the layout of the MAX2205–
MAX2208 circuits affects performance. Use a short
50Ωline at the input with multiple ground vias along the
length of the line. The input capacitor and resistor
should be placed as close to the IC as possible. The
VCCinput should be bypassed as close as possible to
the IC with multiple vias connecting the capacitor to
ground. Refer to the MAX2205–MAX2208 EV kit data
sheet for a sample layout and details.
UCSP ReliabilityThe UCSP is a unique package that greatly reduces
board space compared to other packages. UCSP relia-
bility is integrally linked to the user’s assembly methods,
circuit board material, and usage environment. The user
should closely review these areas when considering
using a UCSP. This form factor might not perform equally
to a packaged product through traditional mechanical
reliability tests. Performance through operating life test
and moisture resistance remains uncompromised, as it
is determined primarily by the wafer-fabrication process.
Mechanical stress performance is a greater considera-
tion for a UCSP. UCSP solder-joint contact integrity must
be considered because the package is attached through
direct solder contact to the user’s PC board. Testing
done to characterize the UCSP reliability performance
shows that it is capable of performing reliably through
environmental stresses. Results of environmental stress
tests and additional usage data and recommendations
are detailed in the UCSP application note, which can be
found on Maxim’s website, .
Chip InformationTRANSISTOR COUNT: 344
MAX2205–MAX2208
RF Power Detectors in UCSP TO ANT
CFILTER
TO ADC
ISOLATOR/
CIRCULATOR
PEAK
DETECTOR
47pF
680Ω
MAX2205
TO ANT
TO ADC
OR OP AMP
50Ω
PEAK
DETECTOR
COUPLER
MAX2206
MAX2207
MAX2208
Figure 2. MAX2205 TypicalApplication CircuitFigure 1. MAX2206/MAX2207/MAX2208 Typical Application
Circuit
MAX2205–MAX2208
RF Power Detectors in UCSP
DEVICECODEMAX2205EBSAFR
MAX2206EBSAFO
MAX2207EBSAFP
MAX2208EBSAFQ
Table 2. MAX2205–MAX2208 Device
Marking Codes
PIN = -30dBmPIN = +5dBmFREQUENCY (GHz)REALIMAGREALIMAGTable 1. MAX2205 Input Impedance (R || jX, PC Board De-Embedded)
