MAX2023ETX-MAX2023ETX+ Fast Delivery |IC PHOENIX CO.,LIMITED

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MAX2023ETX-MAX2023ETX+
High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2500MHz Quadrature Mod/Demod
General Description
The MAX2023 low-noise, high-linearity, direct upconver-
sion/downconversion quadrature modulator/demodulator
is designed for single and multicarrier 1500MHz to
2500MHz DCS1800/PCS1900 EDGE, cdma2000®,
WCDMA/LTE/TD-LTE,and PHS/PAS base-station appli-
cations. Direct conversion architectures are advanta-
geous since they significantly reduce transmitter or
receiver cost, part count, and power consumption as
compared to traditional IF-baseddouble-conversion
systems.
In addition to offering excellent linearity and noise perfor-
mance, the MAX2023 also yields a high level of compo-
nent integration. This device includes two matched
passive mixers for modulating or demodulating in-phase
and quadrature signals, two LO mixer amplifier drivers,
and an LO quadrature splitter. On-chip baluns are also
integrated to allow for single-ended RF and LO connec-
tions. As an added feature, the baseband inputs have
been matched to allow for direct interfacing to the trans-
mit DAC, thereby eliminating the need for costly I/Q
buffer amplifiers.
The MAX2023 operates from a single +5V supply. It is
available in a compact 36-pin TQFN package (6mm x
6mm) with an exposed pad. Electrical performance is
guaranteed over the extended -40°C to +85°C temper-
ature range.
Applications
Single-Carrier DCS 1800/PCS 1900 EDGEBase
Stations
Single and Multicarrier WCDMA/LTE/TD-LTEBase
Stations
Single and Multicarrier cdmaOne™ and cdma2000
Base Stations
Predistortion Transmitters and Receivers
PHS/PAS Base Stations
Fixed Broadband Wireless Access
Military Systems
Microwave Links
Digital and Spread-Spectrum Communication
Systems
Video-on-Demand (VOD) and DOCSIS Compliant
Edge QAM Modulation
Cable Modem Termination Systems (CMTS)
Features♦1500MHz to 2500MHz RF Frequency Range♦Scalable Power: External Current-Setting
Resistors Provide Option for Operating Device in
Reduced-Power/Reduced-Performance Mode♦36-Pin, 6mm x 6mm TQFN Provides High Isolation
in a Small Package
Modulator Operation:♦Meets GSMSpurious Emission of -75dBc at
600kHz Offset at POUT= +6dBm♦+23.5dBm Typical OIP3♦+61dBm Typical OIP2♦+16dBm Typical OP1dB♦-54dBm Typical LO Leakage♦48dBc Typical Sideband Suppression♦-165dBc/Hz Output Noise Density♦Broadband Baseband Input of 450MHz Allows a
Direct Launch DAC Interface, Eliminating the
Need for Costly I/Q Buffer Amplifiers♦DC-Coupled Input Allows Ability for Offset
Voltage Control
Demodulator Operation:♦+38dBm Typical IIP3♦+59dBm Typical IIP2♦+30dBm Typical IP1dB♦9.5dB Typical Conversion Loss♦9.6dB Typical NF♦0.025dB Typical I/Q Gain Imbalance♦0.56°I/Q Typical Phase Imbalance
MAX2023
High-Dynamic-Range, Direct Up-/Downconversion
1500MHz to 2500MHz Quadrature Mod/Demod
Ordering Information
19-0564; Rev 1; 5/12
PARTTEMP RANGEPIN-PACKAGE
MAX2023ETX+ -40°C to +85°C 36 TQFN-EP*
(6mm x 6mm)
MAX2023ETX+T -40°C to +85°C 36 TQFN-EP*
(6mm x 6mm)
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
T = Tape and reel.
cdma2000 is a registered certification mark and registered service mark of the Telecommunications Industry Association.
EVALUATION KIT
AVAILABLE
MAX2023
High-Dynamic-Range, Direct Up-/Downconversion
1500MHz to 2500MHz Quadrature Mod/Demod
ABSOLUTE MAXIMUM RATINGS
VCC_ to GND........................................................-0.3V to +5.5V
BBI+, BBI-, BBQ+, BBQ- to GND..................-4V to (VCC+ 0.3V)
LO, RF to GND Maximum Current......................................30mA
RF Input Power...............................................................+30dBm
Baseband Differential I/Q Input Power ..........................+20dBm
LO Input Power...............................................................+10dBm
RBIASLO1 Maximum Current.............................................10mA
RBIASLO2 Maximum Current.............................................10mA
RBIASLO3 Maximum Current.............................................10mA
Continuous Power Dissipation (Note 1)...............................7.6W
Operating Case Temperature Range (Note 2)....-40°C to +85°C
Maximum Junction Temperature.....................................+150°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
Soldering Temperature (reflow).......................................+260°C
DC ELECTRICAL CHARACTERISTICS
(MAX2023 Typical Application Circuit, VCC= 4.75V to 5.25V, GND = 0V, I/Q inputs terminated into 50Ωto GND, LO input terminated into
50Ω, RF output terminated into 50Ω, 0V common-mode input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, TC= -40°C to +85°C, unless otherwise
noted. Typical values are at VCC= 5V, TC= +25°C, unless otherwise noted.)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Supply Voltage 4.75 5.00 5.25 V
Supply Current (Note 5) 255 295 345 mA
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1:Based on junction temperature TJ= TC+ (θJCx VCCx ICC). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Informationsection for details.
The junction temperature must not exceed +150°C.
Note 2:TCis the temperature on the exposed pad of the package. TAis the ambient temperature of the device and PCB.
Note 3:Junction temperature TJ= TA+ (θJAx VCCx ICC). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 4:Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to /thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS
TQFN
Junction-to-Ambient
Thermal Resistance (θJA) (Notes 3, 4).......................+34°C/W
Junction-to-Case
Thermal Resistance (θJC) (Notes 1, 4)......................+8.5°C/W
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RF Frequency (Note 6) fRF 1500 2500 MHz
LO Frequency (Note 6) fLO 1500 2500 MHz
IF Frequency (Note 6) fIF 1000 MHz
LO Power Range PLO -3 +3 dBm
MAX2023
High-Dynamic-Range, Direct Up-/Downconversion
1500MHz to 2500MHz Quadrature Mod/Demod
AC ELECTRICAL CHARACTERISTICS (Modulator)
(MAX2023 Typical Application Circuit, when operated as a modulator, VCC= 4.75V to 5.25V, GND = 0V, I/Q differential inputs
driven from a 100ΩDC-coupled source, 0V common-mode input, 50ΩLO and RF system impedance, R1 = 432Ω, R2 = 562Ω,
R3 = 301Ω, TC= -40°C to +85°C. Typical values are at VCC= 5V, VBBI= VBBQ= 2.66VP-Pdifferential, fIQ = 1MHz, fLO= 1850MHz,
PLO= 0dBm, TC= +25°C, unless otherwise noted.)
PARAMETER CONDITIONS MIN TYP MAX UNITS
BASEBAND INPUT
Baseband Input Differential
Impedance fI/Q = 1MHz 55
BB Common-Mode Input Voltage
Range VBBI = VBBQ = 1VP-P differential ±3.5 V
Baseband 0.5dB Bandwidth 450 MHz
LO INPUT
LO Input Return Loss 15 dB
RF OUTPUT
fLO = 1750MHz 24.2
fLO = 1850MHz 23.5 Output IP3
POUT = 0dBm,
fBB1 = 1.8MHz,
fBB2 = 1.9MHz fLO = 1950MHz 22
dBm
Output IP2 POUT = 0dBm, fBB1 = 1.8MHz, fBB2 = 1.9MHz,
fLO = 1850MHz 61 dBm
fLO = 1750MHz 15.9
fLO = 1850MHz 14.3 Output P1dB CW tone
fLO = 1950MHz 12.5
dBm
Output Power (Note 7) 5.6 dBm
Output Power Variation Over
Temperature
POUT = +5.6dBm, fI/Q = 100kHz, TC = -40°C to
+85°C 0.25 dB
Output-Power Flatness fLO = 1850MHz, PRF flatness for fLO swept over
±50MHz range 0.2 dB
RF Return Loss fLO = 1850MHz 17 dB
fLO = 1750MHz 51
fLO = 1850MHz 48 Single Sideband Rejection No external
calibration
fLO = 1950MHz 48
dBc
200kHz offset -37.2
400kHz offset -71.4
600kHz offset -84.7 Spurious Emissions
POUT = +6dBm, fLO
= 1850MHz, EDGE
input
1.2MHz offset -85
dBc/
30kHz
RMS 0.67 Error Vector Magnitude EDGE input Peak 1.5 %
Output Noise Density (Note 8) -174 dBm/Hz
Output Noise Floor POUT = 0dBm (Note 9) -165 dBm/Hz
fLO = 1750MHz -59
fLO = 1850MHz -54 LO Leakage
Unnulled, baseband
inputs terminated in
50fLO = 1950MHz -48
dBm
MAX2023
High-Dynamic-Range, Direct Up-/Downconversion
1500MHz to 2500MHz Quadrature Mod/Demod
PARAMETER CONDITIONS MIN TYP MAX UNITS
RF INPUT
Conversion Loss fBB = 25MHz 9.5 dB
Noise Figure 9.6 dB
Noise Figure Underblocking
Conditions
fBLOCKER = 1950MHz, PBLOCKER = +11dBm,
fRF = 1850MHz (Note 10) 20.3 dB
Input Third-Order Intercept
Point
fRF1 = 1875MHz, fRF2 = 1876MHz, fLO = 1850MHz,
PRF = PLO = 0dBm, fIM3 = 24MHz 38 dBm
Input Second-Order Intercept
Point
fRF1 = 1875MHz, fRF2 = 1876MHz, fLO = 1850MHz,
PRF = PLO = 0dBm, fIM2 = 51MHz 59 dBm
Input 1dB Compression Point fBB = 25MHz 29.7 dBm
I/Q Gain Mismatch fBB = 1MHz 0.025 dB
I/Q Phase Mismatch fBB = 1MHz 0.56 Degrees
AC ELECTRICAL CHARACTERISTICS (Demodulator, LO = 1850MHz)
(MAX2023 Typical Application Circuitwhen operated as a demodulator, VCC= 4.75V to 5.25V, GND = 0V, VDCfor BBI+, BBI-, BBQ+,
BBQ- = 0V, 50ΩLO and RF system impedance, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, TC= -40°C to +85°C. Typical values are at
VCC=5V, PRF= 0dBm, fBB= 1MHz, PLO= 0dBm, fLO= 1850MHz, TC= +25°C, unless otherwise noted.)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
Conversion Loss LC 10.9 dB
Noise Figure NFSSB 11 dB
Input Third-Order Intercept Point IIP3
fRF1 = 2135MHz,
fRF2 = 2140MHz,
PRF1 = PRF2 = 0dBm,
fIF1 = 215MHz,
fIF2 = 210MHz
31.5 dBm
Input Second-Order Intercept
PointIIP2
fRF1 = 2135MHz,
fRF2 = 2140MHz,
PRF1 = PRF2 = 0dBm,
fIF1 = 215MHz,
fIF2 = 210MHz,
fIM2nd = 425MHz dBm
LO Leakage at RF Port -50 dBm
LO Leakage at I/Q Ports -38 dBm
Gain Compression PRF = 21dBm 0.17 dB
I/Q Gain Mismatch 0.025 dB
I/Q Phase Mismatch 0.6 Degrees
RF Port Return Loss C9 = 2pF 13 dB
AC ELECTRICAL CHARACTERISTICS (Demodulator, LO = 2350MHz)
(MAX2023 Typical Application Circuitwhen operated as a demodulator. I/Q outputs are recombined using network shown in
Figure5. Losses of combining network not included in measurements. RF and LO ports are driven from 50Ωsources. Typical values
are for TC=+25°C, VCC= 5V, I/Q DC returns = 160Ωresistors to GND, PRF= 0dBm, PLO= 0dBm, fRF= 2140MHz, fLO= 2350MHz,
fIF=210MHz, unless otherwise noted.)
MAX2023
High-Dynamic-Range, Direct Up-/Downconversion
1500MHz to 2500MHz Quadrature Mod/Demod
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
Real 74.7 RF Port Impedance (R+jX)
(At RF Pin)
RF = 2140MHz,
C9 = short Imag +j46.3
LO Port Return Loss C3 = 3pF 23 dB
Real 38.0 LO Port Impedance (R+jX)
(At LO Pin)
LO = 2350MHz,
C3 = short Imag +j20.7
IF Port Differential Return Loss 27dB
Real 53.2 IF Port Differential Impedance
(At IF Pins) (R+jX)
IF = 210MHz,
LO = 2350MHz Imag -j2.8
Minimum Demodulation 3dB
Bandwidth > 1000 MHz
Minimum 1dB Gain Flatness > 800 MHz
AC ELECTRICAL CHARACTERISTICS (Demodulator, LO = 2350MHz) (continued)
(MAX2023 Typical Application Circuitwhen operated as a demodulator. I/Q outputs are recombined using network shown in
Figure5. Losses of combining network not included in measurements. RF and LO ports are driven from 50Ωsources. Typical values
are for TC=+25°C, VCC= 5V, I/Q DC returns = 160Ωresistors to GND, PRF= 0dBm, PLO= 0dBm, fRF= 2140MHz, fLO= 2350MHz,
fIF=210MHz, unless otherwise noted.)
Note 5:Guaranteed by production test.
Note 6:Recommended functional range. Not production tested. Operation outside this range is possible, but with degraded
performance of some parameters.
Note 7:VI/Q= 2.66VP-Pdifferential CWinput.
Note 8:No baseband drive input. Measured with the baseband inputs terminated in 50Ω. At low output power levels, the output
noise density is equal to the thermal noise floor. See Output Noise Density vs. Output Power plots in Typical Operating
Characteristics.
Note 9:The output noise vs. POUTcurve has the slope of LO noise (Ln dBc/Hz) due to reciprocal mixing. Measured at 10MHz off-
set from carrier.
Note 10:The LO noise (L = 10(Ln/10)), determined from the modulator measurements can be used to deduce the noise figure
under-blocking at operating temperature (TPin Kelvin), fBLOCK= 1 + (LCN- 1) TP/ TO+ LPBLOCK/ (1000kTO), where= 290K, PBLOCKin mW, k is Boltzmann’s constant = 1.381 x 10(-23) J/K, and LCN= 10(LC/10), LCis the conversion loss.
Noise figure underblocking in dB is NFBLOCK= 10 x log (fBLOCK). Refer to Application Note 3632.
MAX2023
High-Dynamic-Range, Direct Up-/Downconversion
1500MHz to 2500MHz Quadrature Mod/Demod
Typical Operating Characteristics
(MAX2023 Typical Application Circuit, VCC= 4.75V to 5.25V, GND = 0V, I/Q differential inputs driven from a 100ΩDC-coupled source
(modulator), VBBI= VBBQ= 2.6VP-Pdifferential (modulator), PRF= +6dBm (demodulator), I/Q differential output drives 50Ωdifferential load
(demodulator), 0V common-mode input/output, PLO= 0dBm, 1500MHz ≤fLO≤2300MHz, 50ΩLO and RF system impedance, R1 = 432Ω,
R2 = 562Ω, R3 = 301Ω, TC= -40°C to +85°C. Typical values are at VCC= 5V, fLO= 1850MHz, TC= +25°C, unless otherwise noted.)
SUPPLY CURRENT vs. TEMPERATURE (TC)
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
MAX2023 toc01
VCC = 4.75V
VCC = 5.25V
VCC = 5V
MODULATOR SINGLE-SIDEBAND SUPPRESSION
vs. LO FREQUENCY
LO FREQUENCY (GHz)
SIDEBAND REJECTION (dBc)
MAX2023 toc02
PLO = -3dBm
PLO = 0dBm
PLO = +3dBm
MODULATOR SINGLE-SIDEBAND SUPPRESSION
vs. LO FREQUENCY
LO FREQUENCY (GHz)
SIDEBAND REJECTION (dBc)
MAX2023 toc03
VCC = 4.75V
VCC = 5V
VCC = 5.25V
MODULATOR SINGLE-SIDEBAND SUPPRESSION
vs. LO FREQUENCY
LO FREQUENCY (GHz)
SIDEBAND REJECTION (dBc)
MAX2023 toc04
TC = +85°C
TC = +25°C
TC = -40°C
MODULATOR OUTPUT IP3
vs. LO FREQUENCY
LO FREQUENCY (GHz)
OUTPUT IP3 (dBm)
MAX2023 toc05
TC = +85°C
TC = +25°C
TC = -40°C
f1 = 1.8MHz
f2 = 1.9MHz
MODULATOR OUTPUT IP3
vs. LO FREQUENCY
LO FREQUENCY (GHz)
OUTPUT IP3 (dBm)
MAX2023 toc06
VCC = 4.75V, 5V, 5.25V
f1 = 1.8MHz
f2 = 1.9MHz
MAX2023
High-Dynamic-Range, Direct Up-/Downconversion
1500MHz to 2500MHz Quadrature Mod/Demod
MODULATOR OUTPUT IP3
vs. LO FREQUENCY
LO FREQUENCY (GHz)
OUTPUT IP3 (dBm)
MAX2023 toc07
PLO = -3dBm
PLO = +3dBm
PLO = 0dBm
f1 = 1.8MHz
f2 = 1.9MHz
MODULATOR OUTPUT IP3
vs. I/Q COMMON-MODE VOLTAGE
I/Q COMMON-MODE VOLTAGE (V)
OUTPUT IP3 (dBm)
MAX2023 toc08
f1 = 1.8MHz
f2 = 1.9MHz
MODULATOR OUTPUT IP2
vs. LO FREQUENCY
LO FREQUENCY (GHz)
OUTPUT IP2 (dBm)
MAX2023 toc09
TC = +85°CTC = +25°C
TC = -40°C
f1 = 1.8MHz
f2 = 1.9MHz
Typical Operating Characteristics (continued)
(MAX2023 Typical Application Circuit, VCC= 4.75V to 5.25V, GND = 0V, I/Q differential inputs driven from a 100ΩDC-coupled source
(modulator), VBBI= VBBQ= 2.6VP-Pdifferential (modulator), PRF= +6dBm (demodulator), I/Q differential output drives 50Ωdifferential load
(demodulator), 0V common-mode input/output, PLO= 0dBm, 1500MHz ≤fLO≤2300MHz, 50ΩLO and RF system impedance, R1 = 432Ω,
R2 = 562Ω, R3 = 301Ω, TC= -40°C to +85°C. Typical values are at VCC= 5V, fLO= 1850MHz, TC= +25°C, unless otherwise noted.)
MODULATOR OUTPUT IP2
vs. LO FREQUENCY
LO FREQUENCY (GHz)
OUTPUT IP2 (dBm)
MAX2023 toc10
VCC = 5V
VCC = 5.25V
VCC = 4.75V
f1 = 1.8MHz
f2 = 1.9MHz
MODULATOR OUTPUT IP2
vs. LO FREQUENCY
LO FREQUENCY (GHz)
OUTPUT IP2 (dBm)
MAX2023 toc11
PLO = -3dBm
PLO = 0dBm
PLO = +3dBm
f1 = 1.8MHz
f2 = 1.9MHz
MODULATOR OUTPUT IP2
vs. I/Q COMMON-MODE VOLTAGE
I/Q COMMON-MODE VOLTAGE (V)
OUTPUT IP2 (dBm)
MAX2023 toc12
f1 = 1.8MHz
f2 = 1.9MHz
MODULATOR OUTPUT POWER
vs. INPUT POWER
OUTPUT POWER (dBm)
MAX2023 toc1312141618202224262830
VCC = 4.75V, 5V, 5.25V
MODULATOR OUTPUT POWER
vs. INPUT POWER
OUTPUT POWER (dBm)
MAX2023 toc1412141618202224262830
PLO = -3dBm
PLO = +3dBm
PLO = 0dBm
MODULATOR OUTPUT POWER
vs. LO FREQUENCY
OUTPUT POWER (dBm)
MAX2023 toc15
TC = +85°C
TC = +25°C
TC = -40°C
MAX2023
High-Dynamic-Range, Direct Up-/Downconversion
1500MHz to 2500MHz Quadrature Mod/Demod
MODULATOR LO LEAKAGE
vs. LO FREQUENCY
LO FREQUENCY (GHz)
LO LEAKAGE (dBm)
MAX2023 toc19
PLO = +3dBm
PLO = -3dBm
PLO = 0dBm
PRF = -1dBm,
LO LEAKAGE NULLED
AT PLO = 0dBm
MODULATOR OUTPUT NOISE DENSITY
vs. OUTPUT POWER
OUTPUT POWER (dBm)
OUTPUT NOISE DENSITY (dBm/Hz)
MAX2023 toc20
TC = +85°C
TC = +25°CTC = -40°C
MODULATOR OUTPUT NOISE DENSITY
vs. OUTPUT POWER
OUTPUT POWER (dBm)
OUTPUT NOISE DENSITY (dBm/Hz)
MAX2023 toc21
PLO = +3dBm
PLO = -3dBm
PLO = 0dBm
DEMODULATOR CONVERSION LOSS
vs. LO FREQUENCY
CONVERSION LOSS (dB)
MAX2023 toc22
TC = +85°C
TC = +25°C
TC = -40°C
DEMODULATOR INPUT IP3
vs. LO FREQUENCY
INPUT IP3 (dBm)
MAX2023 toc23
PLO = +3dBm
f1 = fLO + 25MHz
f2 = fLO + 26MHz
PLO = -3dBm
PLO = 0dBm
DEMODULATOR INPUT IP3
vs. LO FREQUENCY
INPUT IP3 (dBm)
MAX2023 toc24
TC = +85°C
TC = +25°C
TC = -40°C
f1 = fLO + 25MHz
f2 = fLO + 26MHz
MODULATOR OUTPUT POWER
vs. BASEBAND FREQUENCY
BASEBAND FREQUENCY (MHz)
OUTPUT POWER (dBm)
MAX2023 toc1610203040506070
fLO + fBB
fLO - fBB
PI/Q-COMBINED = 0dBm
MODULATOR LO LEAKAGE
vs. LO FREQUENCY
LO FREQUENCY (GHz)
LO LEAKAGE (dBm)
MAX2023 toc17
PRF = +5dBmPRF = -40dBm
LO LEAKAGE NULLED
AT PRF = -1dBm
PRF = -7dBm
PRF = -1dBm
MODULATOR LO LEAKAGE
vs. LO FREQUENCY
LO FREQUENCY (GHz)
LO LEAKAGE (dBm)
MAX2023 toc18
TC = -40°C
TC = +85°C
TC = +25°C
PRF = -1dBm,
LO LEAKAGE NULLED
AT TA = +25°C
Typical Operating Characteristics (continued)
(MAX2023 Typical Application Circuit, VCC= 4.75V to 5.25V, GND = 0V, I/Q differential inputs driven from a 100ΩDC-coupled source
(modulator), VBBI= VBBQ= 2.6VP-Pdifferential (modulator), PRF= +6dBm (demodulator), I/Q differential output drives 50Ωdifferential load
(demodulator), 0V common-mode input/output, PLO= 0dBm, 1500MHz ≤fLO≤2300MHz, 50ΩLO and RF system impedance, R1 = 432Ω,
R2 = 562Ω, R3 = 301Ω, TC= -40°C to +85°C. Typical values are at VCC= 5V, fLO= 1850MHz, TC= +25°C, unless otherwise noted.)
MAX2023
High-Dynamic-Range, Direct Up-/Downconversion
1500MHz to 2500MHz Quadrature Mod/Demod
Typical Operating Characteristics (continued)
(MAX2023 Typical Application Circuit, VCC= 4.75V to 5.25V, GND = 0V, I/Q differential inputs driven from a 100ΩDC-coupled source
(modulator), VBBI= VBBQ= 2.6VP-Pdifferential (modulator), PRF= +6dBm (demodulator), I/Q differential output drives 50Ωdifferential load
(demodulator), 0V common-mode input/output, PLO= 0dBm, 1500MHz ≤fLO≤2300MHz, 50ΩLO and RF system impedance, R1 = 432Ω,
R2 = 562Ω, R3 = 301Ω, TC= -40°C to +85°C. Typical values are at VCC= 5V, fLO= 1850MHz, TC= +25°C, unless otherwise noted.)
DEMODULATOR INPUT IP2
vs. LO FREQUENCY
LO FREQUENCY (GHz)
INPUT IP2 (dBm)
MAX2023 toc25
TC = +85°C
TC = +25°C
TC = -40°C
f1 = fLO + 25MHz
f2 = fLO + 26MHz
DEMODULATOR I/Q PHASE IMBALANCE
vs. LO FREQUENCY
LO FREQUENCY (GHz)
I/Q PHASE IMBALANCE (deg)
MAX2023 toc26
PLO = -3dBm
PLO = 0dBm
PLO = +3dBm
PLO = -6dBm
DEMODULATOR I/Q AMPLITUDE IMBALANCE
vs. LO FREQUENCY
LO FREQUENCY (GHz)
I/Q AMPLITUDE IMBALANCE (dB)
MAX2023 toc27
PLO = -3dBm
PLO = 0dBm
PLO = +3dBm
PLO = -6dBm
LO PORT RETURN LOSS
LO FREQUENCY (GHz)
RETURN LOSS (dB)
MAX2023 toc28
PLO = -3dBm
PLO = 0dBm
PLO = +3dBm
PLO = -6dBm
RF PORT RETURN LOSS
RF FREQUENCY (GHz)
RETURN LOSS (dB)
MAX2023 toc29
PLO = -6dBm, -3dBm, 0dBm, +3dBm

Partno	Mfg	Dc	Qty	Available	Descript
MAX2023ETX	MAXIM	N/a	6	avai	High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2500MHz Quadrature Mod/Demod
MAX2023ETX+ \|MAX2023ETX	MAXIM	N/a	166	avai	High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2500MHz Quadrature Mod/Demod