MAX1973EUB ,PLASTIC ENCAPSULATED DEVICESTable of Contents I. ........Device Description V. ........Quality Assurance Information II ..
MAX1973EUB+ ,Smallest 1A, 1.4MHz Step-Down RegulatorsApplications that forward bias these diodes should take care not to exceedthe IC package power diss ..
MAX1974EUB ,Smallest 1A, 1.4MHz Step-Down RegulatorsELECTRICAL CHARACTERISTICS(V = V = 3.3V, FB = OUT, T = 0°C to +85°C, unless otherwise noted. Typica ..
MAX1974EUB+ ,Smallest 1A, 1.4MHz Step-Down RegulatorsApplicationsOrdering InformationNetwork EquipmentPART TEMP RANGE PIN-PACKAGECellular Base StationsM ..
MAX1974EUB+ ,Smallest 1A, 1.4MHz Step-Down Regulatorsapplications. Forced PWM operationensures a constant switching frequency over all load♦ Fixed-Frequ ..
MAX1974EUB+T ,Smallest 1A, 1.4MHz Step-Down RegulatorsFeaturesThe MAX1973/MAX1974 are constant-frequency 2♦ Tiny Circuit Footprint of 0.19in1.4MHz pulse- ..
MAX494ESD+ ,Single/Dual/Quad, Micropower, Single-Supply, Rail-to-Rail Op AmpsFeatures♦ Low-Voltage Single-Supply Operation (+2.7V to +6V)The dual MAX492, quad MAX494, and singl ..
MAX4951AECTP+ ,SATA I/II Bidirectional Redriver with High ESD and Cable DetectApplications TOP VIEWLaptop Computers15 14 13 12 11Docking StationsDesktop ComputersV 10 VCC 16 CCS ..
MAX4951BECTP+ ,SATA I/II/III Bidirectional Redriver with Input Equalization and Preemphasisfeatures channel-independent digital preemphasis controls to drive SATA outputs over longer S Inlin ..
MAX4951BECTP+ ,SATA I/II/III Bidirectional Redriver with Input Equalization and Preemphasisfeatures high electrostatic discharge (ESD) Q8kV Human S Drive DetectionBody Model (HBM) protection ..
MAX4951BECTP+T ,SATA I/II/III Bidirectional Redriver with Input Equalization and PreemphasisApplicationsLaptop ComputersServersDesktop ComputersDocking StationsData Storage/Workstations ___ M ..
MAX4951BECTP+TGH7 ,SATA I/II/III Bidirectional Redriver with Input Equalization and PreemphasisELECTRICAL CHARACTERISTICS(V = +3.0V to +3.6V, C = 12nF, R = 50I, T = 0NC to +70NC, unless otherwis ..
MAX1973EUB
PLASTIC ENCAPSULATED DEVICES
MAX1973EUB Rev. A RELIABILITY REPORT FOR
MAX1973EUB PLASTIC ENCAPSULATED DEVICES February 9, 2003
MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086
Written by Reviewed by
Jim Pedicord Bryan J. Preeshl Quality Assurance Quality Assurance Reliability Lab Manager Executive Director
Conclusion The MAX1973 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality and reliability standards.
Table of Contents
I. ........Device Description V. ........Quality Assurance Information
II. ........Manufacturing Information VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information ......Attachments
I. Device Description A. General The MAX1973 is a constant-frequency 1.4MHz pulse-width-modulated (PWM) current-mode step-down regulator. The output voltage can be set as low as 0.75V using an external voltage-divider, or it can be set to preset outputs of 1V, 1.5V or 2.5V without requiring external resistors. The MAX1973 also includes a voltage-margining feature that offsets the output voltage up or down 4% to facilitate board-level production testing.
A fixed 1.4MHz operating frequency ensures operation outside the DSL frequency band, provides fast transient response, and allows the use of small external components. Only 4.7µF input and output ceramic capacitors are needed for 1A applications. Forced PWM operation ensures a constant switching frequency over all load conditions.
Output voltage accuracy is ±1% over load, line, and temperature operating ranges. The MAX1973 features voltage margining. The device is available in small 10-pin µMAX package. B. Absolute Maximum Ratings Item Rating IN, POK, CTL1, CTL2, FBSEL, ON to GND -0.3V to +6V COMP, FB, SS to GND -0.3V to (VIN + 0.3V) PGND to GND -0.3V to +0.3V LX Current (Note 1) -2.4A to +2.4A Operating Temperature Range -40°C to +85°C Storage Temperature Range -65°C to +150°C Lead Temperature (soldering, 10s) +300° Continuous Power Dissipation (TA = +70°C) 10-Pin uMAX 444mW Derates above +70°C 10-Pin uMAX 5.6mW/°C .
Note 1: LX has internal clamp diodes to IN and PGND. Applications that forward bias these diodes should take care not to exceedthe IC package power dissipation limit.
II. Manufacturing Information A. Description/Function: Smallest 1A, 1.4MHz Step-Down Regulator B. Process: S8 - Standard 8 micron silicon gate CMOS C. Number of Device Transistors: 1998 D. Fabrication Location: California, USA E. Assembly Location: Philippines, Malaysia or Thailand F. Date of Initial Production: July, 2002
III. Packaging Information A. Package Type:
10-Lead uMAX B. Lead Frame: Copper C. Lead Finish: Solder Plate D. Die Attach: Silver-filled Epoxy E. Bondwire: Gold (1.3 mil dia.) F. Mold Material: Epoxy with silica filler G. Assembly Diagram: Buildsheet # 05-3501-0031 H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1
IV. Die Information A. Dimensions: 62 X 89 mils B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: TiW/ AlCu/ TiWN D. Backside Metallization: None E. Minimum Metal Width: .8 microns (as drawn) F. Minimum Metal Spacing: .8 microns (as drawn) G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO2
V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord (Reliability Lab Manager) Bryan Preeshl ( Executive Director of QA) Kenneth Huening (Vice President) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation A. Accelerated Life Test The results of the 135°C biased (static) life test are shown in
Table 1. Using these results, the Failure Rate (l) is calculated as follows: l = 1 = 1.83 (Chi square value for MTTF upper limit) MTTF 192 x 4389 x 90 x 2 Temperature Acceleration factor assuming an activation energy of 0.8eV l = 12.07 x 10-9 l = 12.07 F.I.T. (60% confidence level @ 25°C) This low failure rate represents data collected from Maxim’s reliability qualification and monitor programs. Maxim also performs weekly Burn-In on samples from production to assure reliability of its processes. The reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on rejects from lots exceeding this level. The Burn-In Schematic (Spec.# 06-5984) shows the static circuit used for this test. Maxim also performs 1000 hour life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1M) located on the Maxim website at http:// . B. Moisture Resistance Tests Maxim evaluates pressure pot stress from every assembly process during qualification of each new design. Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85°C/85%RH or HAST tests are performed quarterly per device/package family. C. E.S.D. and Latch-Up Testing The PM27 die type has been found to have all pins able to withstand a transient pulse of ±1500V, per Mil-Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of ±250mA.
Table 1 Reliability Evaluation Test Results
MAX1973EUB
TEST ITEM TEST CONDITION FAILURE SAMPLE NUMBER OF IDENTIFICATION SIZE FAILURES
Static Life Test (Note 1) Ta = 135°C DC Parameters 90 0 biased & functionality Time = 192 hrs.
Moisture Testing (Note 2) Pressure Pot Ta = 121°C DC Parameters 77 0 P = 15 psi. & functionality RH= 100% Time = 168hrs. 85/85 Ta = 85°C DC Parameters 77 0 RH = 85% & functionality Biased Time = 1000hrs.
Mechanical Stress (Note 2) Temperature -65°C/150°C DC Parameters 77 0 Cycle 1000 Cycles Method 1010 Note 1: Life Test Data may represent plastic D.I.P. qualification lots. Note 2: Generic process/package data
Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/ 1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 Pin combinations to be tested. a. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. b. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1, or VCC2) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. c. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open.
TERMINAL B
TERMINAL A
CURRENT
PROBE
(NOTE 6)
R = 1.5kWW
C = 100pf
SHORT
R2
S2 R1
