MAX1820ZEUB ,PLASTIC ENCAPSULATED DEVICES MAX1820ZEUB Rev. B RELIABILITY REPORT FOR MAX1820ZEUB PLASTIC EN ..
MAX1821EUB ,WCDMA Cellular Phone 600mA Buck RegulatorsMAX1820/MAX182119-2011; Rev 3; 4/05WCDMA Cellular Phone 600mABuck Regulators
MAX1821EUB+T ,WCDMA Cellular Phone 600mA Buck RegulatorsELECTRICAL CHARACTERISTICS(V = 3.6V, SHDN = BATT, SKIP = SYNC = GND, V = 1.25V (MAX1820 only), T = ..
MAX1821EUB-T ,WCDMA Cellular Phone 600mA Buck RegulatorsApplications4.7μHINPUT DYNAMICWCDMA Cell Phone Power Amplifiers2.6V TO OUTPUTBATT LX5.5V 0.4V TO 3. ..
MAX1822ESA ,High-Side Power SupplyApplicationsHigh-Side Power Control with N-Channel FETsLow-Dropout Voltage RegulatorsPower Switchin ..
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MAX4699EGE ,Low-Voltage, Dual DPDT/Quad SPDT Analog Switches in QFNFeaturesThe MAX4699/MAX4701/MAX4702 are low-voltage, 3mm x 3mm and 4mm x 4mm 16-Pin QFNsingle-sup ..
MAX469CPE ,Two-Channel, Triple/Quad RGB Video Switches and BuffersMAX463–MAX47019-0219; Rev 2; 6/94Two-Channel, Triple/QuadRGB Video Switches and Buffers____________ ..
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MAX1820ZEUB
PLASTIC ENCAPSULATED DEVICES
MAX1820ZEUB Rev. B RELIABILITY REPORT
FOR
MAX1820ZEUB PLASTIC ENCAPSULATED DEVICES
March 21, 2003
MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by Reviewed by
Jim Pedicord Bryan J. Preeshl
Quality Assurance Quality Assurance
Reliability Lab Manager Executive Director
Conclusion The MAX1820 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. ........Device Description V. ........Quality Assurance Information
II. ........Manufacturing Information VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information ......Attachments
I. Device Description A. General
The MAX1820 low-dropout, pulse-width-modulated (PWM) DC-DC buck regulator is optimized to provide power to the
power amplifier (PA) in WCDMA cell phones; however, it may be applied in many other applications where high
efficiency is a priority. The supply voltage range is from 2.6V to 5.5V, and the guaranteed output current is 600mA;
1MHz PWM switching allows for small external components, while skip mode reduces quiescent current to 180µA
with light loads.
The MAX1820 is dynamically controlled to provide varying output voltages from 0.4V to 3.4V. The circuit is designed
such that the output voltage settles in <30µs for a full-scale change in voltage and current.
The MAX1820 includes a low on-resistance internal MOSFET switch and synchronous rectifier to maximize
efficiency and minimize external component count; 100% duty-cycle operation allows for low dropout of only 150mV
at 600mA load, including the external inductor resistance. The device is offered in 10-pin µMAX and tiny 3 x 4 chip-
scale (UCSP™) packages B. Absolute Maximum Ratings Item Rating BATT, OUT (FB), SHDN, SYNC, SKIP, REF to GND -0.3V to +6.0V
PGND to GND -0.3V to +0.3V
LX, COMP to GND -0.3V to (VBATT + 0.3V)
Output Short-Circuit Duration Infinite
Operating Temperature Range -40°C to +85°C
Junction Temperature +150°C
Storage Temperature Ranges -65°C to +150°C
Lead Temperature (soldering, 10s) +300°C Continuous Power Dissipation (TA = +70°C) 10-Pin µMAX 444mW Derates above +70°C
10-Pin µMAX 5.6mW/°C
II. Manufacturing Information A. Description/Function: WCDMA Cellular Phone 600Ma Buck Regulator B. Process: S8 - Standard 8 micron silicon gate CMOS C. Number of Device Transistors: 2722 D. Fabrication Location: California, USA E. Assembly Location: Thailand, Philippines or Malaysia F. Date of Initial Production: April, 2001
III. Packaging Information A. Package Type:
10-Lead µMAX B. Lead Frame: Copper C. Lead Finish: Solder Plate D. Die Attach: Silver-filled Epoxy E. Bondwire: Gold (1.3 mil dia.) F. Mold Material: Epoxy with silica filler
G. Assembly Diagram: Buildsheet # 05-2301-0048 H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-A112: Level 1
IV. Die Information A. Dimensions: 81 X 81 mils B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: TiW/ AlCu/ TiWN D. Backside Metallization: None E. Minimum Metal Width: .8 microns (as drawn) F. Minimum Metal Spacing: .8 microns (as drawn) G. Bondpad Dimensions: 2.7 mil. Sq. H. Isolation Dielectric: SiO2
V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord (Reliability Lab Manager) Bryan Preeshl ( Executive Director of QA) Kenneth Huening (Vice President) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in
Table 1. Using these results, the Failure Rate (l) is calculated as follows:
l = 1 = 1.83 (Chi square value for MTTF upper limit)
MTTF 192 x 4389 x 551 x 2 Temperature Acceleration factor assuming an activation energy of 0.8eV l = 1.97 x 10-9 l = 1.97 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability qualification and monitor programs.
Maxim also performs weekly Burn-In on samples from production to assure reliability of its processes. The
reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates
to 3 failures in an 80 piece sample. Maxim performs failure analysis on rejects from lots exceeding this level. The
Burn-In Schematic (Spec.# 06-5591) shows the static circuit used for this test. Maxim also performs 1000 hour life
test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1M) located
on the Maxim website at http:// . B. Moisture Resistance Tests
Maxim evaluates pressure pot stress from every assembly process during qualification of each new design.
Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85°C/85%RH or
HAST tests are performed quarterly per device/package family.
C. E.S.D. and Latch-Up Testing The PY72 die type has been found to have all pins able to withstand a transient pulse of ±400V, per Mil-
Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of ±250mA.
Table 1 Reliability Evaluation Test Results
MAX1820ZEUB
TEST ITEM TEST CONDITION FAILURE SAMPLE NUMBER OF IDENTIFICATION SIZE FAILURES
Static Life Test (Note 1) Ta = 135°C DC Parameters 551 0 Biased & functionality Time = 192 hrs.
Moisture Testing (Note 2) Pressure Pot Ta = 121°C DC Parameters 77 0 P = 15 psi. & functionality RH= 100% Time = 168hrs. 85/85 Ta = 85°C DC Parameters 77 0 RH = 85% & functionality Biased Time = 1000hrs.
Mechanical Stress (Note 2) Temperature -65°C/150°C DC Parameters 77 0 Cycle 1000 Cycles Method 1010
Note 1: Life Test Data may represent plastic D.I.P. qualification lots.
Note 2: Generic process/package data
Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/ 1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 Pin combinations to be tested. a. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. b. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1, or VCC2) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. c. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open.
TERMINAL B
TERMINAL A
CURRENT
PROBE
(NOTE 6)
R = 1.5kW
C = 100pf
SHORT
R2
S2 R1
