MAX1446EHJ+ ,10-Bit, 60Msps, 3.0V, Low-Power ADC with Internal ReferenceELECTRICAL CHARACTERISTICS(V = 3.0V, OV = 2.7V; 0.1µF and 1.0µF capacitors from REFP, REFN, and COM ..
MAX1448EHJ ,10-Bit, 80Msps, Single 3.0V, Low-Power ADC with Internal ReferenceELECTRICAL CHARACTERISTICS(V = 3.0V, OV = 2V, 0.1µF and 1µF capacitors from REFP, REFN, and COM to ..
MAX1449EHJ ,10-bit, 105Msps, single +3.3V low-power ADC with internal reference. For medical ultrasound imaging, CCD pixel processing, IR focal plane arrays, radar, IF & baseband digitizationELECTRICAL CHARACTERISTICS(V = +3.3V, OV = +2.0V; 0.1µF and 1.0µF capacitors from REFP, REFN, and C ..
MAX1449EHJ+ ,10-Bit, 105Msps, Single +3.3V, Low-Power ADC with Internal ReferenceELECTRICAL CHARACTERISTICS(V = 3.3V, OV = 2V, 0.1µF and 1µF capacitors from REFP, REFN, and COM to ..
MAX144ACPA+ ,+2.7V, Low-Power, 2-Channel, 108ksps, Serial 12-Bit ADCs in 8-Pin µMAXELECTRICAL CHARACTERISTICS(V = +2.7V to +5.25V, V = 2.5V, 0.1μF capacitor at REF, f = 2.17MHz, 16 c ..
MAX144AEUA+ ,+2.7V, Low-Power, 2-Channel, 108ksps, Serial 12-Bit ADCs in 8-Pin µMAXFeaturesThe MAX144/MAX145 low-power, 12-bit analog-to-♦ Single-Supply Operation (+2.7V to +5.25V) ® ..
MAX4041EUA ,Single/Dual/Quad / Low-Cost / SOT23 / Micropower Rail-to-Rail I/O Op AmpsMAX4040–MAX404419-1377; Rev 0; 5/98Single/Dual/Quad, Low-Cost, SOT23, Micropower Rail-to-Rail I/O O ..
MAX4042ESA ,Single/Dual/Quad / Low-Cost / SOT23 / Micropower Rail-to-Rail I/O Op AmpsFeaturesThe MAX4040–MAX4044 family of micropower op amps' Single-Supply Operation Down to +2.4Voper ..
MAX4042ESA ,Single/Dual/Quad / Low-Cost / SOT23 / Micropower Rail-to-Rail I/O Op AmpsELECTRICAL CHARACTERISTICS—T = +25°CA(V = +5.0V, V = 0, V = 0, V = V / 2, SHDN = V , R = 100kΩ tied ..
MAX4042ESA+ ,Single/Dual/Quad, Low-Cost, SOT23, Micropower Rail-to-Rail I/O Op AmpsELECTRICAL CHARACTERISTICS—T = +25°CA(V = +5.0V, V = 0V, V = 0V, V = V / 2, SHDN = V , R = 100kΩ ti ..
MAX4042EUA ,Single/Dual/Quad / Low-Cost / SOT23 / Micropower Rail-to-Rail I/O Op AmpsGeneral Description ________
MAX4042EUA+ ,Single/Dual/Quad, Low-Cost, SOT23, Micropower Rail-to-Rail I/O Op AmpsFeaturesThe MAX4040–MAX4044 family of micropower op amps♦ Single-Supply Operation Down to +2.4Voper ..
MAX1446EHJ+
10-Bit, 60Msps, 3.0V, Low-Power ADC with Internal Reference
General DescriptionThe MAX1446 10-bit, 3V analog-to-digital converter
(ADC) features a fully differential input, a pipelined 10-
stage ADC architecture with digital error correction and
wideband track and hold (T/H) incorporating a fully dif-
ferential signal path. This ADC is optimized for low-
power, high dynamic performance applications in
imaging and digital communications. The MAX1446
operates from a single 2.7V to 3.6V supply, consuming
only 90mW while delivering a 59.5dB signal-to-noise
ratio (SNR) at a 20MHz input frequency. The fully differ-
ential input stage has a 400MHz, -3dB bandwidth and
may be operated with single-ended inputs. In addition
to low operating power, the MAX1446 features a 5µA
power-down mode for idle periods.
An internal 2.048V precision bandgap reference is used
to set the ADC full-scale range. A flexible reference
structure allows the user to supply a buffered, direct or
externally derived reference for applications requiring
increased accuracy or a different input voltage range.
Lower and higher speed, pin-compatible versions of
the MAX1446 are also available. Refer to the MAX1444
data sheet for a 40Msps version, the MAX1448 data
sheet for an 80Msps version, and the MAX1449 data
sheet for a 105Msps version.
The MAX1446 has parallel, offset binary, three-state
outputs that can be operated from 1.7V to 3.3V to allow
flexible interfacing. The device is available in a 5mm x
5mm, 32-pin TQFP package and is specified over the
extendedindustrial (-40°C to +85°C) and automotive
(-40°C to +105°C) temperature ranges.
________________________ApplicationsUltrasound Imaging
CCD Imaging
Baseband and IF Digitization
Digital Set-Top Boxes
Video Digitizing Applications
FeaturesSingle 3.0V OperationExcellent Dynamic Performance
59.5dB SNR at fIN= 20MHz
73dB SFDR at fIN= 20MHz Low Power:
30mA (Normal Operation)
5µA (Shutdown Mode)Fully Differential Analog InputWide 2VP-PDifferential Input Voltage Range400MHz -3dB Input BandwidthOn-Chip 2.048V Precision Bandgap ReferenceCMOS-Compatible Three-State Outputs32-Pin TQFP PackageEvaluation Kit Available (MAX1448 EV Kit)
MAX1446
10-Bit, 60Msps, 3.0V, Low-Power
ADC with Internal ReferenceCLK
IN+
CONTROL
PIPELINE ADC
REF SYSTEM +
BIAS
OUTPUT
DRIVERS
REF
REFINREFOUTREFPCOMREFNOE
VDD
GND
OVDD
OGND
D9–D0
IN-
T/H
MAX1446
Functional Diagram19-1729; Rev 4; 11/08
EVALUATION KIT
AVAILABLE
Ordering Information
PARTTEMP RANGEPIN-
PACKAGEMAX1446EHJ+-40°C to +85°C32 TQFP
MAX1446GHJ+-40°C to +105°C32 TQFP
Pin-Compatible,
Lower/Higher Speed Versions
PARTSAMPLING SPEED (Msps)MAX144440
MAX144880
+Denotes a lead(Pb)-free/RoHS-compliant package.
MAX1446
10-Bit, 60Msps, 3.0V, Low-Power
ADC with Internal Reference
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS(VDD= 3.0V, OVDD= 2.7V; 0.1µF and 1.0µF capacitors from REFP, REFN, and COM to GND; VREFIN= 2.048V, REFOUT connected
to REFIN through a 10kΩresistor, VIN= 2VP-P(differential with respect to COM), CL≈10pF at digital outputs, fCLK= 62.5MHz
(50% duty cycle), TA= TMINto TMAX, unless otherwise noted. ≥+25°C guaranteed by production test, < +25°C guaranteed by design
and characterization. Typical values are at TA= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDD, OVDDto GND...............................................-0.3V to +3.6V
OGND to GND.......................................................-0.3V to +0.3V
IN+, IN- to GND........................................................-0.3V to VDD
REFIN, REFOUT, REFP,
REFN, and COM to GND.........................-0.3V to (VDD+ 0.3V)
OE, PD, CLK to GND..................................-0.3V to (VDD+ 0.3V)
D9–D0 to GND.........................................-0.3V to (OVDD+ 0.3V)
Continuous Power Dissipation (TA= +70°C)
32-Pin TQFP (derate 18.7mW/°C above +70°C)......1495.3mW
Operating Temperature Ranges:
MAX1446EHJ+.................................................-40°C to +85°C
MAX1446GHJ+...............................................-40°C to +105°C
Storage Temperature Range ............................-60°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
DC ACCURACYResolution10Bits
Integral NonlinearityINLfIN = 7.492MHz, TA ≥ +25°C±0.6±1.9LSB
Differential NonlinearityDNLNo missing codes, fIN = 7.492MHz±0.4±1.0LSB
Offset Error-1.6 < ±0.1±1.9% FS
Gain ErrorTA ≥ +25°C0±2.0% FS
ANALOG INPUTInput Differential RangeVDIFFDifferential or single-ended inputs±1.0V
Common-Mode Voltage RangeVCOMVDD/2
± 0.5V
Input ResistanceRINSwitched capacitor load33kΩ
Input CapacitanceCIN5pF
CONVERSION RATEMaximum Clock FrequencyfCLK60MHz
Data Latency5.5Cycles
DYNAMIC CHARACTERISTICS fIN = 7.492MHz5759.5
fIN = 19.943MHz56.559.5Signal-to-Noise RatioSNR
fIN = 39.9MHz (Note 1)59
fIN = 7.492MHz56.659.4
fIN = 19.943MHz56.259Signal-to-Noise + Distortion
(Up to 5th Harmonic)SINAD
fIN = 39.9MHz (Note 1)58.5
fIN = 7.492MHz6574
fIN = 19.943MHz6373Spurious-Free Dynamic
RangeSFDR
fIN = 39.9MHz (Note 1)71
dBc
MAX1446
10-Bit, 60Msps, 3.0V, Low-Power
ADC with Internal Reference
ELECTRICAL CHARACTERISTICS (continued)(VDD= 3.0V, OVDD= 2.7V; 0.1µF and 1.0µF capacitors from REFP, REFN, and COM to GND; VREFIN= 2.048V, REFOUT connected
to REFIN through a 10kΩresistor, VIN= 2VP-P(differential with respect to COM), CL≈10pF at digital outputs, fCLK= 62.5MHz
(50% duty cycle), TA= TMINto TMAX, unless otherwise noted. ≥+25°C guaranteed by production test, < +25°C guaranteed by design
and characterization. Typical values are at TA= +25°C.)
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITSfIN = 7.492MHz-74
fIN = 19.943MHz-73Third-Harmonic DistortionHD3
fIN = 39.9MHz (Note 1)-71
dBc
Two-Tone Intermodulation
DistortionIMDTTf1 = 19MHz at -6.5dBFS,
f2 = 21MHz at -6.5dBFS (Note 2)-75dBc
Third-Order Intermodulation
DistortionIM3f1 = 19MHz at -6.5dBFS
f2 = 21MHz at -6.5dBFS (Note 2)-75dBc
fIN = 7.492MHz-70-64
fIN = 19.943MHz-70-63Total Harmonic Distortion
(First 5 Harmonics)THD
fIN = 39.9MHz (Note 1)-69
dBc
Small-Signal BandwidthInput at -20dBFS, differential inputs500MHz
Full-Power BandwidthFPBWInput at -0.5dBFS, differential inputs400MHz
Aperture DelaytAD1ns
Aperture JittertAJ2psrms
Overdrive Recovery TimeFor 1.5 × full-scale input2ns
Differential Gain±1%
Differential Phase±0.25°
Output NoiseIN+ = IN- = COM0.2LSBrms
INTERNAL REFERENCEReference Output VoltageREFOUT2.048
±1%V
Reference Temperature
CoefficientTCREF60ppm/°C
Load Regulation1.25mV/mA
BUFFERED EXTERNAL REFERENCE (VREFIN = 2.048V)REFIN Input VoltageVREFIN2.048osi ti ve Refer ence Outp ut V ol tag eVREFP2.012Veg ati ve Refer ence Outp utol tag eVREFN0.988V
Common-Mode LevelVCOMVDD/2V
Differential Reference Output
Voltage RangeΔVREFΔVREF = VREFP - VREFN, TA ≥ +25°C0.981.0241.07V
REFIN ResistanceRREFIN> 50MΩ
Maximum REFP, COM Source
CurrentISOURCE5mA
Maximum REFP, COM Sink
CurrentISINK-250µA
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITSMaximum REFN Source CurrentISOURCE250µA
Maximum REFN Sink CurrentISINK-5mA
UNBUFFERED EXTERNAL REFERENCE (VREFIN = AGND, reference voltage applied to REFP, REFN, and COM)REFP, REFN Input ResistanceRREFP,
RREFN
Measured between REFP and COM and
REFN and COM4KΩ
REFP, REFN, COM Input
CapacitanceCIN15pF
Differential Reference Input
Voltage RangeΔVREFΔVREF = VREFP - VREFN1.024±10%V
COM Input Voltage RangeVCOMVDD/2±10%V
REFP Input VoltageVREFPVCOM+
ΔVREF/2V
REFN Input VoltageVREFNVCOM -
ΔVREF/2V
DIGITAL OUTPUTS (CLK, PD, OE)CLK0.8 x
VDD
Input High ThresholdVIH
PD, OE0.8 x
OV D D
CLK0.2 x
VDD
Input Low ThresholdVIL
PD, OE0.2 x
OV D D
Input HysteresisVHYST0.1V
IIHVIH = VDD = OVDD±5Input LeakageIILVIL = 0±5µA
Input CapacitanceCIN5pF
DIGITAL OUTPUTS (D9–D0)Output Voltage LowVOLISINK = 200µA0.2V
Output Voltage HighVOHISOURCE = 200µAOVDD -
0.2V
Three-State Leakage CurrentILEAKOE = OVDD±10µA
Three-State Output CapacitanceCOUTOE = OVDD5pF
MAX1446
10-Bit, 60Msps, 3.0V, Low-Power
ADC with Internal Reference
ELECTRICAL CHARACTERISTICS (continued)(VDD= 3.0V, OVDD= 2.7V; 0.1µF and 1.0µF capacitors from REFP, REFN, and COM to GND; VREFIN= 2.048V, REFOUT connected
to REFIN through a 10kΩresistor, VIN= 2VP-P(differential with respect to COM), CL≈10pF at digital outputs, fCLK= 62.5MHz
(50% duty cycle), TA= TMINto TMAX, unless otherwise noted. ≥+25°C guaranteed by production test, < +25°C guaranteed by design
and characterization. Typical values are at TA= +25°C.)
MAX1446
Note 1:SNR, SINAD, THD, SFDR, and HD3 are based on an analog input voltage of -0.5dBFS referenced to a 1.024V full-scale
input voltage range.
Note 2:Intermodulation distortion is the total power of the intermodulation products relative to the individual carrier. This number is
6dB better, if referenced to the two-tone envelope.
Note 3:Digital outputs settle to VIH, VIL.
Note 4:Wake-up time is defined as the time from complete reference power-down until the ADC performs within 0.3 ENOB of the
final performance for fIN= 10MHz at -0.5dBFS input amplitude. VREFIN= 2.048V, REFP, REFN, and CML decoupled with
2.3µF.
Note 5:Dynamic characteristics guaranteed at fIN= 19.943MHz for the specified duty-cycle range.
Note 6:Guaranteed by design and engineering characterization.
10-Bit, 60Msps, 3.0V, Low-Power
ADC with Internal Reference
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
POWER REQUIREMENTSAnalog Supply VoltageVDD2.73.03.6V
Output Supply VoltageOVDDCL = 10pF1.73.03.6V
Operating, fIN = 19.943MHz at -0.5dBFS3037mAAnalog Supply CurrentIVDDShutdown, clock idle, PD = OE = OVDD415µA
Operating, CL = 15pF, fIN = 19.943MHz at
-0.5dBFS7mAOutput Supply CurrentIOVDD
Shutdown, clock idle, PD = OE = OVDD120µA
Offset± 0.1mV/VPower-Supply RejectionPSRRGain± 0.1%/V
TIMING CHARACTERISTICSCLK Rise to Output Data ValidtDOFigure 5 (Notes 3, 6)258ns
OE Fall to Output EnabletENABLEFigure 510ns
OE Rise to Output DisabletDISABLEFigure 51.5ns
Clock Duty CycleFigure 6, clock period 16ns (Notes 5, 6)4555%
Wake-Up TimetWAKE(Notes 4, 6)366520µs
ELECTRICAL CHARACTERISTICS (continued)(VDD= 3.0V, OVDD= 2.7V; 0.1µF and 1.0µF capacitors from REFP, REFN, and COM to GND; VREFIN= 2.048V, REFOUT connected
to REFIN through a 10kΩresistor, VIN= 2VP-P(differential with respect to COM), CL≈10pF at digital outputs, fCLK= 62.5MHz
(50% duty cycle), TA= TMINto TMAX, unless otherwise noted. ≥+25°C guaranteed by production test, < +25°C guaranteed by design
and characterization. Typical values are at TA= +25°C.)
MAX1446
10-Bit, 60Msps, 3.0V, Low-Power
ADC with Internal Reference
Typical Operating Characteristics(VDD= 3.0V, OVDD= 2.7V, internal reference, differential input at -0.5dBFS, fCLK = 62.35MHz, CL≈10pF, TA= +25°C, unless
otherwise noted.)
MAX1446 toc01
FFT PLOT
(fIN = 7.5MHz, 8192-POINT FFT,
DIFFERENTIAL INPUT)
ANALOG INPUT FREQUENCY (MHz)
AMPLITUDE (dB)
SFDR = 72.2dBc
SNR = 60.1dB
THD = -71.5dBc
SINAD = 59.8dB
HD2HD3
FFT PLOT
(fIN = 13.3MHz, 8192-POINT FFT,
DIFFERENTIAL INPUT)
MAX1446 toc02
ANALOG INPUT FREQUENCY (MHz)
AMPLITUDE (dB)
SINAD = 59.3dB
SNR = 59.5dB
THD = -72.9dBc
SFDR = 74.3dBc
HD2HD3
FFT PLOT
(fIN = 20MHz, 8192-POINT FFT,
DIFFERENTIAL INPUT)
MAX1446 toc03
ANALOG INPUT FREQUENCY (MHz)
AMPLITUDE (dB)
SINAD = 59.3dB
SNR = 59.6dB
THD = -70.7dBc
SFDR = 72.2dBc
HD2HD3
FFT PLOT
(fIN = 26.8MHz, 8192-POINT FFT,
DIFFERENTIAL INPUT)
MAX1446 toc04
ANALOG INPUT FREQUENCY (MHz)
AMPLITUDE (dB)
SINAD = 59.0dB
SNR = 59.4dB
THD = -70.5dBc
SFDR = 72.9dBc
HD2
HD3
FFT PLOT
(fIN = 50MHz, 8192-POINT FFT,
DIFFERENTIAL INPUT)
MAX1446 toc05
ANALOG INPUT FREQUENCY (MHz)
AMPLITUDE (dB)
SFDR = 70dBc
SNR = 59.1dB
THD = -67.1dBc
SINAD = 58.5dB
HD2
HD3
FFT PLOT
(fIN = 7.5MHz, 8192-POINT FFT,
SINGLE-ENDED INPUT)
MAX1446 toc06
ANALOG INPUT FREQUENCY (MHz)
AMPLITUDE (dB)
SINAD = 59.5dB
SNR = 59.7dB
THD = -73.0dBc
SFDR = 73.6dBc
HD2
HD3
FFT PLOT
(fIN = 20MHz, 8192-POINT FFT,
SINGLE-ENDED INPUT)
MAX1446 toc07
AMPLITUDE (dB)
SINAD = 59.2dB
SNR = 59.5dB
THD = -70.7dBc
SFDR = 71.1dBc
HD2
HD3
TWO-TONE INTERMODULATION
(8192-POINT IMD,
DIFFERENTIAL INPUT)
MAX1446 toc08
AMPLITUDE (dB)
f1 = 19MHz AT -6.5dBFS
f2 = 21MHz AT -6.5dBFS
3RD IMD = -76dBc
SPURIOUS-FREE DYNAMIC RANGE
vs. ANALOG INPUT FREQUENCY
(AIN = -0.5dBFS)SFDR (dBc)
MAX1446 toc09102030405060708090
DIFFERENTIAL
SINGLE-ENDED
MAX1446
10-Bit, 60Msps, 3.0V, Low-Power
ADC with Internal Reference
Typical Operating Characteristics (continued)(VDD= 3.0V, OVDD= 2.7V, internal reference, differential input at -0.5dBFS, fCLK = 62.35MHz, CL≈10pF, TA= +25°C, unless
otherwise noted.)
SPURIOUS-FREE DYNAMIC RANGE
vs. TEMPERATURESFDR (dBc)
MAX1446 toc17
fIN = 19.943MHz, AIN = -0.5dBFS
SIGNAL-TO-NOISE RATIO vs. TEMPERATURESNR (dB)
MAX1446 toc18
fIN = 19.943MHz, AIN = -0.5dBFS
SIGNAL-TO-NOISE RATIO
vs. ANALOG INPUT FREQUENCY
(AIN = -0.5dBFS)ANALOG INPUT FREQUENCY (MHz)
SNR (dB)
MAX1446 toc10102030405060708090
DIFFERENTIAL
SINGLE-ENDED
TOTAL HARMONIC DISTORTION
vs. ANALOG INPUT FREQUENCY
(AIN = -0.5dBFS)ANALOG INPUT FREQUENCY (MHz)
THD (dBc)
MAX1446 toc11102030405060708090
DIFFERENTIAL
SINGLE-ENDED
SIGNAL-TO-NOISE AND DISTORTION
vs. ANALOG INPUT FREQUENCY
(AIN = -0.5dBFS)ANALOG INPUT FREQUENCY (MHz)
SINAD (dB)
MAX1446 toc12102030405060708090
DIFFERENTIAL
SINGLE-ENDED
SPURIOUS-FREE DYNAMIC RANGE
vs. ANALOG INPUT POWER
(fIN = 19.943MHz)ANALOG INPUT POWER (dBFS)
SFDR (dBc)
MAX1446 toc13
SIGNAL-TO-NOISE RATIO
vs. ANALOG INPUT POWER
(fIN = 19.943MHz)
ANALOG INPUT POWER (dBFS)
SNR (dB)
MAX1446 toc14
TOTAL HARMONIC DISTORTION
vs. ANALOG INPUT POWER
(fIN = 19.943MHz)
ANALOG INPUT POWER (dBFS)
THD (dBc)
MAX1446 toc15
SIGNAL-TO-NOISE AND DISTORTION
vs. ANALOG INPUT POWER
(fIN = 19.943MHz)
SINAD (dB)
MAX1446 toc16
-20-16-12-8-40
MAX1446
10-Bit, 60Msps, 3.0V, Low-Power
ADC with Internal Reference
Typical Operating Characteristics (continued)(VDD= 3.0V, OVDD= 2.7V, internal reference, differential input at -0.5dBFS, fCLK = 62.35MHz, CL≈10pF, TA= +25°C, unless
otherwise noted.)
TOTAL HARMONIC DISTORTION
vs. TEMPERATURETEMPERATURE (°C)
THD (dBc)
MAX1446 toc19
fIN = 19.943MHz, AIN = -0.5dBFS
TA = +105°C
SIGNAL-TO-NOISE AND DISTORTION
vs. TEMPERATURETEMPERATURE (°C)
SINAD (dB)
MAX1446 toc20
fIN = 19.943MHz, AIN = -0.5dBFS
TA = +105°C
INTEGRAL NONLINEARITY vs. DIGITAL
OUTPUT CODE (BEST STRAIGHT LINE)
MAX1446 toc21
DIGITAL OUTPUT CODE
INL (LSB)
fIN = 7.5MHz
DIFFERENTIAL NONLINEARITY
vs. DIGITAL OUTPUT CODE
MAX1446 toc22
DIGITAL OUTPUT CODE
DNL (LSB)
fIN = 7.5MHz
OFFSET ERROR vs. TEMPERATURE,
EXTERNAL REFERENCE (VREFIN = 2.048V)TEMPERATURE (°C)
OFFSET ERROR (%FS)
MAX1446 toc24
TA = +105°C
ANALOG SUPPLY CURRENT
vs. ANALOG SUPPLY VOLTAGE
MAX1446 toc25
IVDD
(mA)
GAIN ERROR vs. TEMPERATURE,
EXTERNAL REFERENCE (VREFIN = 2.048V)TEMPERATURE (°C)
GAIN ERROR (%FS)
MAX1446 toc23
TA = +105°C
ANALOG SUPPLY CURRENT
vs. TEMPERATUREIVDD
(mA)
MAX1446 toc26
TA = +105°C
DIGITAL SUPPLY CURRENT
vs. DIGITAL SUPPLY VOLTAGE
MAX1446 toc27
IOVDD
(mA)
fIN = 7.5MHz
MAX1446
10-Bit, 60Msps, 3.0V, Low-Power
ADC with Internal Reference
Typical Operating Characteristics (continued)(VDD= 3.0V, OVDD= 2.7V, internal reference, differential input at -0.5dBFS, fCLK = 62.35MHz, CL≈10pF, TA= +25°C, unless
otherwise noted.)
DIGITAL SUPPLY CURRENT
vs. TEMPERATURETEMPERATURE (°C)
IOVDD
(mA)
MAX1446 toc28
fIN = 7.5MHz
TA = +105°C
ANALOG POWER-DOWN CURRENT
vs. ANALOG POWER SUPPLY
MAX1446 toc29
VDD (V)
IVDD
OE = OVDD,
PD = VDD
DIGITAL POWER-DOWN CURRENT
vs. DIGITAL POWER SUPPLY
MAX1446 toc30
OVDD (V)
IOVDD
PD = VDD,
OE = OVDD
SNR/SINAD, -THD/SFDR vs. CLOCK FREQUENCYCLOCK FREQUENCY (MHz)
SNR/SINAD, -THD/SFDR (dB, dBc)
MAX1446 toc315458626670
SINAD
SNR
SFDR
-THD
fIN = 20MHz, AIN = -0.5dBFS
INTERNAL REFERENCE VOLTAGE
vs. ANALOG SUPPLY VOLTAGE
MAX1446 toc32
VDD (V)
REFOUT
(V)
INTERNAL REFERENCE VOLTAGE
vs. TEMPERATURETEMPERATURE (°C)
REFOUT
(V)
MAX1446 toc33
TA = +105°C
N-2N-1NN+1N+2
OUTPUT NOISE HISTOGRAM (DC INPUT)
MAX1446 toc34
COUNT
MAX1446
10-Bit, 60Msps, 3.0V, Low-Power
ADC with Internal Reference
Pin Description
PINNAMEFUNCTIONREFNLower Reference. Conversion range is ±(VREFP - VREFN). Bypass to GND with a > 0.1µF
capacitor.COMCommon-Mode Voltage Output. Bypass to GND with a > 0.1µF capacitor.
3, 9, 10VDDAnalog Supply Voltage. Bypass to GND with a capacitor combination of 2.2µF in parallel
with 0.1µF.
4, 5, 8, 11, 14, 30GNDAnalog GroundIN+Positive Analog Input. For single-ended operation, connect signal source to IN+.IN-Negative Analog Input. For single-ended operation, connect IN- to COM.CLKConversion Clock InputPD
Power-Down Input
High: power-down mode
Low: normal operationOE
Output Enable Input
High: digital outputs disabled
Low: digital outputs enabled
16–20D9–D5Three-State Digital Outputs D9–D5. D9 is the MSB.OVDDOutput Driver Supply Voltage. Bypass to GND with a capacitor combination of 2.2µF in
parallel with 0.1µF.T.P.Test Point. Do not connect.OGNDOutput Driver Ground
24–28D4–D0Three-State Digital Outputs D4–D0. D0 is the LSB.REFOUTInternal Reference Voltage Output. May be connected to REFIN through a resistor or a
resistor-divider.REFINReference Input. VREFIN = 2 × (VREFP - VREFN). Bypass to GND with a > 0.01µF capacitor.REFPUpper Reference. Conversion range is ±(VREFP - VREFN). Bypass to GND with a > 0.1µF
capacitor.
