LMV1012TPX-25/NOPB ,Analog Pre-Amplified IC for High Gain Microphones 4-DSBGA -40 to 85FEATURES DESCRIPTIONThe LMV1012 is an audio amplifier series for small2• Typical LMV1012-15, 2.2V S ..
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LMV1012UPX-15 ,Analog Pre-Amplified IC's for High Gain MicrophonesFeaturesThe LMV1012 is an audio amplifier series for small form (Typical LMV1012-15, 2.2V supply, R ..
LMV1012UPX-15 ,Analog Pre-Amplified IC's for High Gain MicrophonesElectrical Characteristics (Note 3)Unless otherwise specified, all limits guaranteed for T = 25˚C, ..
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LMV1012TPX-25/NOPB
Analog Pre-Amplified IC for High Gain Microphones 4-DSBGA
LMV1012 www.ti.com SNAS194H –NOVEMBER 2002–REVISED MAY 2013 LMV1012 Analog Series: Pre-Amplified IC's for High Gain 2-Wire Microphones Check for Samples: LMV1012 1FEATURES DESCRIPTION The LMV1012 is an audio amplifier series for small 2• Typical LMV1012-15, 2.2V Supply, R = 2.2 kΩ, L form factor electret microphones. This 2-wire portfolio C = 2.2μF, V = 18 mV , Unless Otherwise IN PP is designed to replace the JFET amplifier currently Specified being used. The LMV1012 series is ideally suited for • Supply Voltage: 2V - 5V applications requiring high signal integrity in the presence of ambient or RF noise, such as in cellular • Supply Current: <180μA communications. The LMV1012 audio amplifiers are • Signal to Noise Ratio (A-Weighted): 60 dB specified to operate over a 2.2V to 5.0V supply • Output Voltage Noise (A-Weighted):−89 dBV voltage range with fixed gains of 7.8 dB, 15.6 dB, • Total Harmonic Distortion: 0.09% 20.9 dB, and 23.8 dB. The devices offer excellent THD, gain accuracy and temperature stability as • Voltage Gain compared to a JFET microphone. – LMV1012-07: 7.8 dB The LMV1012 series enables a two-pin electret – LMV1012-15: 15.6 dB microphone solution, which provides direct pin-to-pin – LMV1012-20: 20.9 dB compatibility with the existing JFET market. – LMV1012-25: 23.8 dB The devices are offered in extremely thin space • Temperature Range:−40°C to 85°C saving 4-bump DSBGA packages. The LMV1012XP is designed for 1.0 mm canisters and thicker ECM • Offered in 4-Bump DSBGA Packages canisters. These extremely miniature packages are designed for electret condenser microphones (ECM) APPLICATIONS form factor. • Cellular Phones • Headsets • Mobile Communications • Automotive Accessories • PDAs • Accessory Microphone Products Schematic Diagram Built-In Gain Electret Microphone DIAPHRAGM V DD 2.2k xx AIRGAP ELECTRET 2.2PF BACKPLATE CONNECTOR OUTPUTxxxxxxxxx LMV1012 - INPUT IC + xxxxx - + GND 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Copyright © 2002–2013, Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
