L6376D013TR ,0.5A HIGH-SIDE DRIVER QUAD INTELLIGENT POWER SWITCHABSOLUTE MAXIMUM RATINGS (Pin numering referred to PowerSO20 package)Symbol Pin Parameter Value Uni ..
L6376PD ,0.5A HIGH-SIDE DRIVER QUAD INTELLIGENT POWER SWITCHBLOCK DIAGRAM220nF 22nFV V V VS CP C PCHARGE PUMP VSGNDVSVCP RSCURRENTOVCLIMITI +1- DRIVERO1UVSHORT ..
L6376PD ,0.5A HIGH-SIDE DRIVER QUAD INTELLIGENT POWER SWITCHABSOLUTE MAXIMUM RATINGS (Pin numering referred to PowerSO20 package)Symbol Pin Parameter Value Uni ..
L6377D ,0.5A HIGH-SIDE DRIVER INTELLIGENT POWER SWITCHABSOLUTE MAXIMUM RATINGSSymbol Pin Parameter Value UnitSupply Voltage (t < 10ms) 50 VwVs 3Supply Vo ..
L6377D013TR ,0.5A High Side Driver Intelligent Power SwitchAbsolute maximum ratingsSymbol Pin Parameter Value UnitSupply voltage (tw ≤ 10 ms) 50 V V 4sSupply ..
L6377D013TR ,0.5A High Side Driver Intelligent Power SwitchFeatures■ Multipower BCD technology■ 0.5 A output currentSO-14■ 8 to 35 V supply voltage range■ Ext ..
LC35256AT-15LV ,256 K (32768 words X 8 bits) SRAM with OE and CE control PinsFeatures. Power supply voltage range: 2.0 to 3.6 V3 V operation: 2.7 to 3.6 VBattery operation: 2.0 ..
LC35256D-10 ,Dual Control Pins: OE and CE 256K (32768-word X 8-bit) SRAMOrdering number : EN5823CMOS IC LC35256D-10, LC35256DM, DT-70/10Dual Control Pins: OE and CE256K ( ..
LC35256DM ,Dual Control Pins: OE and CE 256K (32768-word X 8-bit) SRAMElectrical Characteristics at Ta = –40 to +85°C, V = 4.5 to 5.5 VCCRatingsParameter Symbol Conditio ..
LC35256DM-10 ,Dual control pins: OE and CE 256K (32768word x 8bit) SRAMFeatures3187-SOP28D• Supply voltage range: 2.7 to 5.5 V[LC35256DM]— 5-V operation: 5.0 V±10%— 3-V o ..
LC35256DM-70 ,Dual control pins: OE and CE 256K (32768word x 8bit) SRAMOrdering number : EN5823CMOS IC LC35256D-10, LC35256DM, DT-70/10Dual Control Pins: OE and CE256K ( ..
LC35256DT-10 ,Dual Control Pins: OE and CE 256K (32768-word X 8-bit) SRAMFeatures3187-SOP28D• Supply voltage range: 2.7 to 5.5 V[LC35256DM]— 5-V operation: 5.0 V±10%— 3-V o ..
L6376D013TR
0.5A HIGH-SIDE DRIVER QUAD INTELLIGENT POWER SWITCH
L63760.5A HIGH-SIDE DRIVER
QUAD INTELLIGENT POWER SWITCH
0.5 A FOUR INDEPENDENT OUTPUTS
9.5 TO 35 V SUPPLY VOLTAGE RANGE
INTERNAL CURRENT LIMIT
NON-DISSIPATIVE OVER-CURRENT PRO-
TECTION
THERMAL SHUTDOWN
UNDER VOLTAGE LOCKOUT WITH HYS-
TERESYS
DIAGNOSTIC OUTPUT FOR UNDER VOLT-
AGE, OVER TEMPERATURE AND OVER
CURRENT
EXTERNAL ASYNCHRONOUS RESET IN-
PUT
PRESETTABLE DELAY FOR OVERCUR-
RENT DIAGNOSTIC
OPEN GROUND PROTECTION
IMMUNITY AGAINST BURST TRANSIENT
(IEC 801-4)
ESD PROTECTION (HUMAN BODY MODEL
± 2KV)
DESCRIPTIONThis device is a monolithic quad Intelligent Power
Switch in Multipower BCD Technology, for driving
inductive, capacitive or resistive loads. Diagnostic
for CPU feedback and extensive use of electrical
protections make this device inherently indis-
tructible and suitable for general purpose indus-
trial applications.
BLOCK DIAGRAM
ABSOLUTE MAXIMUM RATINGS (Pin numering referred to PowerSO20 package)
PIN CONNECTIONS (Top view)
L63762/12
PIN DESCRIPTION (Pin numering referred to PowerSO20 package).
L63763/12
ELECTRICAL CHARACTERISTICS (Vs = 24V; Tj = -25 to 125°C; unless otherwise specified.)
DC OPERATION (Pin numering referred to PowerSO20 package).
L63764/12
AC OPERATION (Pin numering referred to PowerSO20 package).
SOURCE DRAIN NDMOS DIODE
SWITCHING WAVEFORMS
UNDERVOLTAGE COMPARATOR HYSTERESIS
L63765/12
THERMAL CHARACTERISTICSRth j-pins
DIP16+2+2. The thermal resistance is re-
ferred to the thermal path from the dissipat-
ing region on the top surface of the silicon
chip, to the points along the four central pins
of the package, at a distance of 1.5 mm
away from the stand-offs.
Rth j-amb1
If a dissipating surface, thick at least 35 μm,
and with a surface similar or bigger than the
one shown, is created making use of the
printed circuit.
Such heatsinking surface is considered on
the bottom side of an horizontal PCB (worst
case).
Rth j-amb2
If the power dissipating pins (the four central
ones), as well as the others, have a mini-
mum thermal connection with the external
world (very thin strips only) so that the dissi-
pation takes place through still air and
through the PCB itself.
It is the same situation of point above, with-
out any heatsinking surface created on pur-
pose on the board.
Additional data on the PowerDip and the
PowerSO20 package can be found in:
Application Note AN467:
Thermal Characteristics of the PowerDip
20,24 Packages Soldered on 1,2,3 oz.
Copper PCB
Application Note AN668:
A New High Power IC Surface Mount Pack-
age: PowerSO20 Power IC Packaging from
Insertion to Surface Mounting.
THERMAL DATA
Figure 1: Printed Heatsink
L63766/12
