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L6234PD013TR
THREE PHASE MOTOR DRIVER
L6234THREE PHASE MOTOR DRIVER
SUPPLY VOLTAGE FROM 7 TO 52V
5A PEAK CURRENT
RDS ON 0.3Ω TYP. VALUE AT 25°C
CROSS CONDUCTION PROTECTION
TTL COMPATIBLE DRIVER
OPERATING FREQUENCY TO 50KHz
THERMAL SHUTDOWN
INTRINSIC FAST FREE WHEELING DIODES
INPUT AND ENABLE FUNCTION FOR
EVERY HALF BRIDGE
10V EXTERNAL REFERENCE AVAILABLE
DESCRIPTIONThe L6234 is a triple half bridge to drive a
brushless motor.
It is realized in Multipower BCD technology which
combines isolated DMOS power transistors with
CMOS and Bipolar circuits on the same chip.
By using mixed technology it has been possible to
optimize the logic circuitry and the power stage to
achieve the best possible performance.
The output DMOS transistors can sustain a very
high current due to the fact that the DMOS struc-
ture is not affected by the second breakdown ef-
fect, the RMS maximum current is practically lim-
ited by the dissipation capability of the package.
All the logic inputs are TTL, CMOS and μP com-
patible. Each channel is controlled by two sepa-
rate logic input.
L6234 is available in 20 pin POWER DIP package
(16+2+2) and in PowerSO20.
PIN CONNECTION (Top view)
BLOCK DIAGRAM
L62342/10
THERMAL DATA
Figure 1: Printed Heatsink
THERMAL CHARACTERISTICSRth j-pins
DIP16+2+2. The thermal resistance is referred tothe thermal path from the dissipating region on
the top surface of the silicon chip, to the points
along the four central pins of the package, at a
distance of 1.5 mm away from the stand-offs.
Rth j-amb1
If a dissipating surface, thick at least 35 μm, and
with a surface similar or bigger than the one
shown, is created making use of the printed cir-
cuit.
Such heatsinking surface is considered on the
bottom side of an horizontal PCB (worst case).
Rth j-amb2
If the power dissipating pins (the four central
ones), as well as the others, have a minimum
thermal connection with the external world (very
thin strips only) so that the dissipation takes place
through still air and through the PCB itself.
It is the same situation of point above, without any
heatsinking surface created on purpose on the
board.
Additional data on the PowerDip and the
PowerSO20 package can be found in:
Application Note AN467:
Thermal Characteristics of the PowerDip
20,24 Packages Soldered on 1,2,3 oz.
Copper PCB
Application Note AN668:
A New High Power IC Surface Mount Package:
PowerSO20 Power IC Packaging from Insertion
to Surface Mounting.
L62343/10
ABSOLUTE MAXIMUM RATINGSNote 1: Pulse width limited only by junction temperature and the transient thermal impedance
(*) Mounted on board with minimized copper area
RECOMMENDED OPERATING CONDITIONS
PIN FUNCTIONS
L62344/10
ELECTRICAL CHARACTERISTICS (Vs = 42V ; Tj = 25°C unless otherwise specified)
OUTPUT DMOS TRANSISTOR
SOURCE DRAIN DIODE
LOGIC LEVELS
CIRCUIT DESCRIPTIONL6234 is a triple half bridge designed to drive
brushless DC motors.
Each half bridge has 2 power DMOS transistors
with RdsON = 0.3Ω. The 3 half bridges can be
controlled independently by means of the 3 inputs
IN1, IN2, IN3 and the 3 inputs EN1, EN2, and
EN3. An external connection to the 3 common
low side DMOS sources is provided to connect a
sensing resistor for constant current chopping ap-
plication.
The driving stage and the logic stage are de-
signed to work from 7V to 52V.
L62345/10
8 16 24 32 40 48Iq [mA]
Figure 1. Quiescent Current vs. Supply Volt-
age. 102030 405060
Iq/(Iq@500Hz)
Figure 2. Normalized Quiescent Current vs.
switching frequency.-50 -25 0 25 50 75 100 125 150
Tj [°C]
VSD [V]
Figure 4. Source Drain Forward ON voltage
vs. Junction Temperature. 1020 3040 500
Vref [V]
Figure 6. Reference Voltage vs. Supply Voltage.00.5 11.5 2
ISD [A]
Figure 5. Typical Diode Forward ON charac-
teristics 8 16 24 32 40 48
Vs [V]
RDS (ON)[Ω]
Figure 3. Typical RDS (ON) vs. Supply Voltage.
L62346/10
