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IRL5602STRLPBFIRN/a5600avai-20V Single P-Channel HEXFET Power MOSFET in a D2-Pak package
IRL5602STRRPBFIRN/a5000avai-20V Single P-Channel HEXFET Power MOSFET in a D2-Pak package


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IRL5602STRLPBF-IRL5602STRRPBF
-20V Single P-Channel HEXFET Power MOSFET in a D2-Pak package
International
:raRIectifier
P-Channel
Lead-Free
Description
Fifth Generation HEXFETs from International Rectifier utilize advanced
processing techniquesto achieve extremely low on-resistance per silicon area.
This benefit, combined with the fast switching speed and ruggedized device
design that HEXFET Power MOSFETs are well known for, provides the
designer with an extremely efficient and reliable device for use in a wide variety
of applications.
The D2Pak is a surface mount power package capable of accommodating die
sizes up to HEX-4. It provides the highest power capability and the lowest
possible on-resistance in any existing surface mount package. The D2Pak is
Advanced Process Technology
Dynamic dv/dt Rating
175°C Operating Temperature
PD- 95099
IRL5602SPbF
HEXFET® Power MOSFET
Fast Switching G
Fully Avalanche Rated
VDSS = -20V
7 RDS(on) = 0.04252
s ID = -24A
suitable for high current applications because of its low internal connection
resistance and can dissipate up to 2.0W in a typical surface mount application.
Absolute Maximum Ratings
Parameter Max. Units
ID @ To = 25°C Continuous Drain Current, l/ss @ -4.5V -24
ID @ To = 100°C Continuous Drain Current, VGS © -4.5V -17 A
IDM Pulsed Drain Current (D -96
PD ©Tc = 25°C Power Dissipation 75 W
Linear Derating Factor 0.5 W/°C
Vss Gate-to-Source Voltage 1 8.0 V
EAS Single Pulse Avalanche Energy© 290 mJ
IAR Avalanche Current0) -12 A
EAR Repetitive Avalanche Energy© 7.5 mJ
dv/dt Peak Diode Recovery dv/dt © -0.81 V/ns
To Operating Junction and -55 to + 175
Tsms Storage Temperature Range "C
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Thermal Resistance
Parameter Typ. Max. Units
ReJc Junction-to-Case - 2.0 0
Ram Junction-to-Ambient ( PCB Mounted,steady-state)** - 40 CA/V
1

03/1 0/04
IRL5602SPbF
International
TOR Rectifier
Electrical Characteristics @ To = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage -20 - - V Vss = 0V, ID = -250pA
AV- - 0.042 VGS = -4.5V, ID = -12A C9
RDS(on) Static Drain-to-Source On-Resistance - _ O.062 Q Vas = -2.7V, ID = -1OA ©
- - 0.075 VGs = -2.5V, ID = -10A ©
Vasim) Gate Threshold Voltage -0.7 - -1.0 V I/os = VGs, ID = -250PA
gts Forward Transconductance 12 - - S Vos = -15V, lo = -12A©
. - - -25 Vos = -20V, Vss = 0V
IDSS Drain-to-Source Leakage Current - - -250 PA Vos = -16V, VGS = 0V, Tu = 150°C
less Gate-to-Source Forward Leakage - - 500 n A Vas = -8.0V
Gate-to-Source Reverse Leakage - - -500 Vss = 8.0V
% Total Gate Charge - - 44 ID = -12A
Qgs Gate-to-Source Charge - - 8.7 nC Vos = -16V
di Gate-to-Drain ("Miller") Charge - - 19 Vss = -4.5V, See Fig. 6 and 13 C9(S)
tum) Turn-On Delay Time - 9.7 - VDD = -10 V
t, Rise Time - 73 - ns ID = -12A
tum) Turn-Off Delay Time - 53 - Ra = 6.09, Ves = 4.5V
tf Fall Time - 84 - RD = 0.89, See Fig. 10®©
Ls Internal Source Inductance - 7.5 - nH Between lead, .
and center of die contact
Ciss Input Capacitance - 1460 - Vss = 0V
Coss Output Capacitance --.- 790 -- pF Vros = -15V
Crss Reverse Transfer Capacitance - 370 - f = 1.0MHz, See Fig. 5©
Source-Drain Ratings and Characteristics
Parameter Min. Typ. Max. Units Conditions
Is Continuous Source Current - - -24 MOSFET symbol D
(Body Diode) A showing the
ISM Pulsed Source Current integral reverse G
(Body Diode) co - - -96 p-n junction diode. s
VSD Diode Forward Voltage - - -1.4 V Tu = 25°C, Is = -12A, Vss = 0V co
tn Reverse Recovery Time - 58 88 ns Tu = 25°C, IF = -12A
Qrr Reverse RecoveryCharge - 54 81 nC di/dt = -100A/us (9
ton Forward Turn-On Time Intrinsic turn-on time is negligible (tum-on is dominated by Ls+k)
Notes:
C) Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
© Starting Tu = 25°C, L = 3.0mH
Rs = 259, lAs = -14A. (See Figure 12)
* When mounted on 1" square PCB ( FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.

© ISDS -12A, di/dt S 120A/ps, VDD f V(BR)Dss,
Tu 3 175°C
© Pulse width S 300ps; duty cycle S 2%.

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