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IRFZ46S
50V Single N-Channel HEXFET Power MOSFET in a D2-Pak package
International
TOR, Rectifier
PD - 9.922A
IRFZ46S/L
Advanced Process Technology
Surface Mount (IRFZ46S)
Low-profile through-hole (IRFZ46L)
175°C Operating Temperature
Fast Switching
Description
Third Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designerwith an extremely
efficient and reliable device for use in a wide variety of
applications.
The D2Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
HEXFET® Power MOSFET
VDSS = 50V
RDS(on) = 0.0240
ID = 72A©
highest power capability and the lowest possible on- D 2 Pak T0452
resistance in any existing surface mount package. The
D2Pak is suitable for high current applications because of
its low internal connection resistance and can dissipate
up to 2.0W in a typical surface mount application.
The through-hole version (IRFZ46L) is available for low-
profile applications.
Absolute Maximum Ratings
Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V6) 50 ©
ID @ Tc = 100°C Continuous Drain Current, VGS @ ION/OD 38 A
IDM Pulsed Drain Current C)6) 220
PD @TA = 25°C Power Dissipation 3.7 W
PD @Tc = 25°C Power Dissipation 150 W
Linear Derating Factor 1.0 W/°C
Ves Gate-to-Source Voltage k 20 V
EAS Single Pulse Avalanche Energy©6) 100 mJ
dv/dt Peak Diode Recovery dv/dt (3)6) 4.5 V/ns
TJ Operating Junction and -55 to + 175 "C
TSTG Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Thermal Resistance
Parameter Typ. Max. Units
ReJC Junction-to-Case - 1.0 °CNV
ReJA Junction-to-Ambient ( PCB Mounted/steady-state)" - 40
8/25/97
IRFZ46S/L
International
TOR Rectifier
Electrical Characteristics @ Tu = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage 50 - - V VGS = 0V, ID = 250pA
AV(BR)DSS/ATJ Breakdown Voltage Temp. Coefrcient - 0.057 - V/°C Reference to 25°C, ID =1mA©
RDs(on) Static Drain-to-Source On-Resistance - - 0.024 f2 VGs =10V, ID = 32A CO
VGS(th) Gate Threshold Voltage 2.0 - 4.0 V VDs = VGs, ID = 250pA
gig Forward Transconductance 27 - - S VDs = 25V, ID = 32AS
loss Drain-to-Source Leakage Current - - 25 pA l/os = 50V, VGS = 0V
- - 250 Vos = 48V, VGS = 0V, Tu = 150°C
less Gate-to-Source Forward Leakage - - 100 n A I/ss = 20V
Gate-to-Source Reverse Leakage - - -100 VGS = -20V
% Total Gate Charge - - 66 ID = 54A
Qgs Gate-to-Source Charge - - 21 nC VDS = 48V
di Gate-to-Drain ("Miller") Charge - - 25 V63 = 10V, See Fig. 6 and 13 ©(0
tum) Turn-On Delay Time - 12 - VDD = 28V
tr Rise Time - 120 - ns ID = 54A
tum) Turn-Off Delay Time - 42 - R3 = 9.19
tf Fall Time - 96 - RD = 0.499, See Fig. 10 ©
LS Internal Source Inductance - 7.5 - nH Between lead, .
and center of die contact
Ciss Input Capacitance - 1800 - VGs = 0V
Coss Output Capacitance - 960 - pF VDS = 25V
Crss Reverse Transfer Capacitance - 160 - f = 1.0MHz, See Fig. 5S
Source-Drain Ratings and Characteristics
Parameter Min. Typ. Max. Units Conditions
Is Continuous Source Current MOSFET symbol D
(Body Diode) - - 50© A showing the [-,
ISM Pulsed Source Current integral reverse G Dix
(Body Diode) OD - - 220 p-n junction diode. s
VSD Diode Forward Voltage - - 2.5 V Tu = 25°C, Is = 54A, VGS = 0V co
trr Reverse Recovery Time - 66 99 ns Tu = 25°C, IF = 54A
er Reverse Recovery Charge - 170 310 nC di/dt = 100A/ps cos
ton Forward Turn-On Time Intrinsic tum-on time is negligible (tum-on is dominated by LS+LD)
Notes:
C) Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
© VDD = 25V,
Rs = 259,
© ISD S 54A, di/dt f 250A/ps, VDD f V(BR)DSS,
Tuf 175°C
starting T: = 25°C, L = 34pH
IAS = 54A. (See Figure 12)
co Pulse width 3 300ps; duty cycle s: 2%.
(5) Uses IRFZ46 data and test conditions
© Calculated continuous current based on maximum allowable
junction temperature; for recommended current-handling of the
package refer to Design Tip # 93-4
** When mounted on 1" square PCB (FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
