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IRF820STN/a16696avaiPOWER MOSFET


IRF820 ,POWER MOSFETIRF820N-CHANNEL 500V - 2.5Ω - 4A TO-220PowerMesh™II MOSFETTYPE V R IDSS DS(on) DIRF820 500 V < 3 Ω ..
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IRF820
POWER MOSFET
1/8Aug 2000
IRF820

N-CHANNEL 500V - 2.5Ω - 4A TO-220
PowerMesh™II MOSFET TYPICAL RDS(on) = 2.5 Ω EXTREMELY HIGH dv/dt CAPABILITY 100% AVALANCHE TESTED NEW HIGH VOLTAGE BENCHMARK GATE CHARGE MINIMIZED
DESCRIPTION

The PowerMESH™II is the evolution of the first
generation of MESH OVERLAY™. The layout re-
finements introduced greatly improve the Ron*area
figure of merit while keeping the device at the lead-
ing edge for what concerns switching speed, gate
charge and ruggedness.
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING SWITH MODE POWER SUPPLIES (SMPS) DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVES
ABSOLUTE MAXIMUM RATINGS

(•)Pulse width limited by safe operating area
(1)ISD ≤2.5A, di/dt ≤50A/μs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX.
IRF820
THERMAL DATA
AVALANCHE CHARACTERISTICS
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)

OFF (1)
DYNAMIC
3/8
IRF820
ELECTRICAL CHARACTERISTICS (CONTINUED)

SWITCHING ON
SWITCHING OFF
SOURCE DRAIN DIODE
Note:1. Pulsed: Pulse duration = 300 μs, duty cycle 1.5 %. Pulse width limited by safe operating area.
Safe Operating Area Thermal Impedence
IRF820
Static Drain-source On Resistance
Transfer CharacteristicsOutput Characteristics
Transconductance
5/8
IRF820
Normalized Gate Threshold Voltage vs Temp. Normalized On Resistance vs Temperature
Fig. 5: Test Circuit For Inductive Load Switching
Fig. 4: Gate Charge test Circuit
Fig. 3: Switching Times Test Circuit For

Resistive Load
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